Patents by Inventor Dong H. Ahn

Dong H. Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5200202
    Abstract: A head unit for a semiconductor lead frame leader including a vertical operating portion, a clamping portion having two pairs of jaws for clamping the lead frame and with the clamping portion interlocking with the vertical operating portion, a fixing portion with a pair of jaws secured thereto, an adjusting portion with a pair of jaws secured thereto for adjusting the distance separating each pair of jaws in order to accommodate different sizes of lead frames and which interlocks with the adjusting portion upper plate is disclosed.
    Type: Grant
    Filed: October 18, 1991
    Date of Patent: April 6, 1993
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventor: Dong H. Ahn
  • Patent number: 4769094
    Abstract: Amorphous Nickel-base alloys for electrical resistors, which contain, by atomic %, 81-x% Ni, x% Cr, 6% B and 13% Si (z=0.about.25), or 70% Ni, 11% Cr, 19-y% B and y% Si (y=0.about.19 except 13), or 100-z% of 0.864 Ni and 0.136 Cr and z% of 0.316 B and 0.684 Si (x=15.about.25 except 19), and have a relatively high electrical resistivity and a small temperature coefficient of resistivity, are disclosed. Their resistance values can be adjusted by heat treatment and the thermal stability of them after heat treatment is very good in the conventional operating temperature range of electrical components.
    Type: Grant
    Filed: November 25, 1985
    Date of Patent: September 6, 1988
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae S. Park, Dong H. Ahn
  • Patent number: 4740250
    Abstract: An aluminium-base alloy for head drum of video cassette recorders(VCR), which contains copper, magnesium, nickel, silicon, iron and Titanium+Boron and to which chromium is added optionally.The proposed alloy is characterized in that thermal expansion coefficient is less than 20.0.times.10.sup.-6 /.degree.C., hardness after heat treatment is more than 145(Hv) and dispersion of precipitates smaller than 7.5 micron in size is more than 95%.
    Type: Grant
    Filed: December 27, 1985
    Date of Patent: April 26, 1988
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong H. Ahn, Tae S. Park