Patents by Inventor Dong Ha PARK
Dong Ha PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250087139Abstract: A pixel includes: a light emitting element; a first transistor including a gate electrode electrically connected to a first node, a second node to which a first power voltage for driving the light emitting element is to be applied, and a third node electrically connected to the light emitting element; and a bias control transistor configured to be controlled in operating timing thereof by a bias control signal, and configured to switch electrical connection between the second node and a bias power line for transmitting a bias voltage. In one frame period, a voltage level of the bias voltage to be applied to the second node sequentially increases.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Inventors: Se Hyuk PARK, Hong Soo KIM, Young Ha SOHN, Jin Wook YANG, Dong Gyu LEE, Jae Hyeon JEON
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Publication number: 20250059180Abstract: The present invention relates to a compound represented by chemical formula I, a stereoisomer thereof, a pharmaceutically acceptable salt thereof, a hydrate or solvate thereof, and a pharmaceutical composition comprising same.Type: ApplicationFiled: January 13, 2023Publication date: February 20, 2025Inventors: Seung Hwan Kim, Whui Jung Park, Dong Hyuk Shin, Seong Su Jeong, Sang Ho Lee, Ji Young Woo, Woon Heo, Doc Gyun Jeong, Seo Hee Jeong, Jae Kyung Lim, Yun Ha Hwang
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Patent number: 11017918Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.Type: GrantFiled: December 7, 2017Date of Patent: May 25, 2021Assignee: DYM SOLUTION CO., LTD.Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Patent number: 10732613Abstract: Provided is a smart factory for production and quality management of a thermoplastic and thermosetting compound capable of predicting and controlling quality and production schedule in the future as well as monitoring a current state of factory by acquiring various types of data generated during a manufacturing process such as a manufacturing schedule, a quality condition, or the like of a manufacturing process.Type: GrantFiled: April 25, 2018Date of Patent: August 4, 2020Assignee: DYM Solution Co., Ltd.Inventor: Dong Ha Park
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Patent number: 10658649Abstract: An electronic equipment chamber is disclosed. The electronic equipment chamber has an electronic equipment chamber board on which at least one electronic component among a current sensor, a relay, and a fuse is disposed, a controller located in a center of the electronic equipment chamber board, the controller electrically connected to the electronic component and configured to control the electronic component, and a plurality of busbars electrically connected to the electronic component and disposed along an outer edge of the electronic equipment chamber board, the plurality of busbars spaced apart from the controller.Type: GrantFiled: November 16, 2015Date of Patent: May 19, 2020Assignee: Tyco Electronics AMP Korea Co., Ltd.Inventors: Young Geun Park, Dong Ha Park
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Patent number: 10626260Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.Type: GrantFiled: August 2, 2018Date of Patent: April 21, 2020Assignee: DYM SOLUTION CO., LTD.Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Patent number: 10442923Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to 15 parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.Type: GrantFiled: August 2, 2018Date of Patent: October 15, 2019Assignee: DYM Solution Co., Ltd.Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
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Publication number: 20190180889Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.Type: ApplicationFiled: December 7, 2017Publication date: June 13, 2019Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Publication number: 20190040243Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.Type: ApplicationFiled: August 2, 2018Publication date: February 7, 2019Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
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Publication number: 20190040244Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.Type: ApplicationFiled: August 2, 2018Publication date: February 7, 2019Inventors: Jong Seok YANG, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Patent number: 10174187Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.Type: GrantFiled: August 23, 2016Date of Patent: January 8, 2019Assignee: DYM SOLUTION CO., LTD.Inventors: Jong Seok Yang, Eun Ho Choi, Chan Ryoo, Baeg Yong Seong, Dong Ha Park
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Publication number: 20180314241Abstract: Provided is a smart factory for production and quality management of a thermoplastic and thermosetting compound capable of predicting and controlling quality and production schedule in the future as well as monitoring a current state of factory by acquiring various types of data generated during a manufacturing process such as a manufacturing schedule, a quality condition, or the like of a manufacturing process.Type: ApplicationFiled: April 25, 2018Publication date: November 1, 2018Applicant: DYM Solution Co., Ltd.Inventor: Dong Ha Park
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Patent number: 9620261Abstract: A resin composition for producing an insulating material includes (A) 40 to 50% by weight of a base resin formed with a polyolefin-based resin or a derivative thereof, (B) 40 to 50% by weight of a magnesium hydroxide flame retardant of which surface is treated with vinyl silane, (C) 1 to 2% by weight of an antioxidant in which a first antioxidant and a second antioxidant are mixed in a weight ratio of 1:1 to 3, (D) 0.5 to 2% by weight of a lubricant, (E) 2 to 3% by weight of organosilane, (F) 0.05 to 0.2% by weight of an initiator, and (G) 1 to 4% by weight of a catalyst.Type: GrantFiled: February 9, 2015Date of Patent: April 11, 2017Assignees: HYUNDAI MOTOR COMPANY, DYM CO., LTD.Inventors: Seung Woo Choi, Dong Ha Park, Baeg Yong Seong, Eun Ho Choi, Jong Seok Yang
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Publication number: 20170058113Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.Type: ApplicationFiled: August 23, 2016Publication date: March 2, 2017Inventors: Jong Seok YANG, Eun Ho CHOI, Chan RYOO, Baeg Yong SEONG, Dong Ha PARK
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Publication number: 20160072118Abstract: An electronic equipment chamber is disclosed. The electronic equipment chamber has an electronic equipment chamber board on which at least one electronic component among a current sensor, a relay, and a fuse is disposed, a controller located in a center of the electronic equipment chamber board, the controller electrically connected to the electronic component and configured to control the electronic component, and a plurality of busbars electrically connected to the electronic component and disposed along an outer edge of the electronic equipment chamber board, the plurality of busbars spaced apart from the controller.Type: ApplicationFiled: November 16, 2015Publication date: March 10, 2016Applicant: Tyco Electronics AMP Korea Co., Ltd.Inventors: Young Geun Park, Dong Ha Park
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Publication number: 20160072166Abstract: A battery package is disclosed. The battery package has a battery module formed by stacking a plurality of pouch-type battery cells, a cover disposed on an outside of the battery module, an air communication channel fluidly connecting the battery module and an area outside of the cover, and a blower fluidly connected to the battery module.Type: ApplicationFiled: November 16, 2015Publication date: March 10, 2016Applicant: TYCO ELECTRONICS AMP KOREA LTDInventors: Young Geun Park, Dong Ha Park
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Publication number: 20150248948Abstract: A resin composition for producing an insulating material includes (A) 40 to 50% by weight of a base resin formed with a polyolefin-based resin or a derivative thereof, (B) 40 to 50% by weight of a magnesium hydroxide flame retardant of which surface is treated with vinyl silane, (C) 1 to 2% by weight of an antioxidant in which a first antioxidant and a second antioxidant are mixed in a weight ratio of 1:1 to 3, (D) 0.5 to 2% by weight of a lubricant, (E) 2 to 3% by weight of organosilane, (F) 0.05 to 0.2% by weight of an initiator, and (G) 1 to 4% by weight of a catalyst.Type: ApplicationFiled: February 9, 2015Publication date: September 3, 2015Inventors: Seung Woo CHOI, Dong Ha PARK, Baeg Yong SEONG, Eun Ho CHOI, Jong Seok YANG