Patents by Inventor Dong-ha Sim

Dong-ha Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging chip having inductor therein
    Patent number: 7541662
    Abstract: A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: June 2, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-ha Sim, In-sang Song, Duck-hwan Kim, Yun-kwon Park, Seok-chul Yun, Kuang-woo Nam
  • Packaging chip having inductor therein
    Publication number: 20070018281
    Abstract: A packaging chip having inductors therein. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.
    Type: Application
    Filed: May 18, 2006
    Publication date: January 25, 2007
    Inventors: Dong-ha Sim, In-sang Song, Duck-hwan Kim, Yun-kwon Park, Seok-chul Yun, Kuang-woo Nam