Abstract: A dielectric adhesive film for an electronic paper display device, by which the operating performance of a flexible display device is excellent even applying a high voltage when the flexible display device is operated, by controlling a dielectric constant with respect to an adhesive film for attaching a lower electrode to which a voltage is applied with an image upper electrode on which particles, which possess electric charges with various colors that change according to an applied voltage, are coated to adjust the electric charges of the adhesive film in the thickness direction to thereby minimize loss of the applied voltage while maintaining an adhesive property and reliability.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present disclosure provides a dielectric adhesive film for an electronic paper display device, by which the operating performance of a flexible display device is excellent even applying a high voltage when the flexible display device is operated, by controlling a dielectric constant with respect to an adhesive film for attaching a lower electrode to which a voltage is applied with an image upper electrode on which particles, which possess electric charges with various colors that change according to an applied voltage, are coated to adjust the electric charges of the adhesive film in the thickness direction to thereby minimize loss of the applied voltage while maintaining an adhesive property and reliability.

Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure-sensitive adhesive composition comprising a) acrylic copolymers; b) a hydrophilic plasticizer; and c) a hydrophobic plasticizer. The acrylic pressure-sensitive adhesive composition according to the present invention has no mura under moisture and heat resistant condition, and thus has an excellent stain resistance of adherends, and an excellent wettability, endurance reliability, transparency and adhesion reliability, regardless of whether surface property of the adherend is hydrophillic or hydrophobic.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

Abstract: A dielectric adhesive film for an electronic paper display device. A lower electrode to which voltage is applied and an image upper electrode coated with charged particles whose colors are changed depending on the applied voltage are attached to the adhesive film. Thickness of the adhesive film is controlled to be uniform and constant, and a resistance value in the thickness direction of the adhesive film, i.e., a resistance value in the direction where an electric field is formed, is controlled without changing adhesive properties and reliability as the thickness of the adhesive film is controlled. Since loss of the applied voltage is minimized and the charged particles are freely driven, driving performance of the display device is excellent although a high voltage is not applied in driving a flexible display device, such as a flexible LED, an organic electro luminescence (EL) element including an electronic paper, and the like.

Abstract: Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturing a liquid crystal display device comprising a glass substrate. The present invention provides an adhesive composition for transporting a flexible substrate, which includes 100 parts by weight of an adhesive for transporting a flexible substrate and 0.001 to 5 parts by weight of an antistatic agent, an adhesive sheet containing the composition, and a method of transporting a flexible substrate using the same.

Abstract: The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 ?m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Abstract: There are provided a sheet having a silicon/plastic bi-layer structure capable of easily transferring a paste even when a hard roll is used, the hard roll having excellent durability but having disadvantages that the paste is poorly transferred when the paste is printed on a plastic base, and a method for producing the same. The bi-layer structured sheet having excellent printability when printed by hard roll includes a flexible substrate and a silicon resin formed on the substrate.

Abstract: Disclosed herein is a silicon adhesive composition for transporting a flexible substrate. The composition includes (A) 42 to 70 parts by weight of a polydiorganosiloxane containing an alkenyl group, (B) 55 to 28 parts by weight of a polyorganosiloxane copolymer including R13SiO1/2 units and SiO2 units, wherein R1 is a hydroxy group or a monovalent hydrocarbon group of 1 to 12 carbon atoms, (C) a polyorganosiloxane containing an SiH group, wherein the molar ratio of the SiH group of component (C) to the alkenyl group of component (A) is from 0.5 to 20, and (D) a platinum group catalytic compound, wherein the weight ratio of a metal component of the compound to the sum of components (A) and (B) is from 1 to 5000 ppm by weight.

Abstract: There are provided a sheet having a silicon/plastic bi-layer structure capable of easily transferring a paste even when a hard roll is used, the hard roll having excellent durability but having disadvantages that the paste is poorly transferred when the paste is printed on a plastic base, and a method for producing the same. The bi-layer structured sheet having excellent printability when printed by hard roll includes a flexible substrate and a silicon resin formed on the substrate.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of buns during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure-sensitive adhesive composition comprising a) acrylic copolymers; b) a hydrophilic plasticizer; and c) a hydrophobic plasticizer. The acrylic pressure-sensitive adhesive composition according to the present invention has no mura under moisture and heat resistant condition, and thus has an excellent stain resistance of adherends, and an excellent wettability, endurance reliability, transparency and adhesion reliability, regardless of whether surface property of the adherend is hydrophillic or hydrophobic.

Abstract: The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 ?m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Abstract: The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

Abstract: The present invention relates to an acrylic pressure sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure sensitive adhesive composition which comprises a) acrylic copolymers; and b) a compound having an ester value of 200 or more. The acrylic pressure sensitive adhesive composition of the present invention has an excellent wettability to the surface of an adhered article with surface unevenness, an excellent endurance reliability, transparency, and stain resistance of adhered article, and a high-rate release property without any considerable change of adhesive properties.