Patents by Inventor Dong-Han Yoon

Dong-Han Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10338134
    Abstract: In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the second surface includes lower terminals that are electrically connected to the test apparatus, and the upper terminals include a first upper terminal group for testing the first type semiconductor chip and a second upper terminal group for testing whether a crack defect exists in the second type semiconductor chip.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: July 2, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Chul Jun, Yun-Bo Yang, Dong-Ho Lee, Tae-Hwan Oh, Dong-Han Yoon
  • Publication number: 20170139004
    Abstract: In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the second surface includes lower terminals that are electrically connected to the test apparatus, and the upper terminals include a first upper terminal group for testing the first type semiconductor chip and a second upper terminal group for testing whether a crack defect exists in the second type semiconductor chip.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 18, 2017
    Inventors: MIN-CHUL JUN, YUN-BO YANG, DONG-HO LEE, TAE-HWAN OH, DONG-HAN YOON
  • Patent number: 9163821
    Abstract: A high power optical element streetlamp using a thermocouple includes a body unit, a lamp head unit, and a power supply unit fixed to the body unit. The lamp head unit includes a circuit board connected to the power supply unit, at least one optical element installed on the lower surface of the circuit board, a molding, and a heat dissipation plate installed on the upper end of the circuit board and including a plurality of heat dissipation fins to dissipate heat generated and transmitted from the at least one optical element and the circuit board. The thermocouple is arranged in the shape of a checkerboard on the surfaces of the heat dissipation fins and converts dissipated heat into thermoelectromotive force, and forming junctions where two kinds of metals having different thermal conductivities intersect to generate thermoelectric current is formed on the heat dissipation plate.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: October 20, 2015
    Inventor: Dong Han Yoon
  • Patent number: 8975504
    Abstract: An embedded optical element package module uses a thermocouple, which increases the optical output efficiency of an optical element, dissipates high-temperature heat generated by the optical element having high output to prevent degradation, converts waste heat into electrical energy, and supplies the electrical energy as a power source for the optical element to reutilize resources, thereby reducing the amount of power consumed by the optical element and minimizing costs.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: March 10, 2015
    Inventor: Dong Han Yoon
  • Publication number: 20130083516
    Abstract: A high power optical element streetlamp using a thermocouple includes a body unit, a lamp head unit, and a power supply unit fixed to the body unit. The lamp head unit includes a circuit board connected to the power supply unit, at least one optical element installed on the lower surface of the circuit board, a molding, and a heat dissipation plate installed on the upper end of the circuit board and including a plurality of heat dissipation fins to dissipate heat generated and transmitted from the at least one optical element and the circuit board. The thermocouple is arranged in the shape of a checkerboard on the surfaces of the heat dissipation fins and converts dissipated heat into thermoelectromotive force, and forming junctions where two kinds of metals having different thermal conductivities intersect to generate thermoelectric current is formed on the heat dissipation plate.
    Type: Application
    Filed: June 14, 2011
    Publication date: April 4, 2013
    Inventor: Dong Han Yoon
  • Publication number: 20130081666
    Abstract: An embedded optical element package module uses a thermocouple, which increases the optical output efficiency of an optical element, dissipates high-temperature heat generated by the optical element having high output to prevent degradation, converts waste heat into electrical energy, and supplies the electrical energy as a power source for the optical element to reutilize resources, thereby reducing the amount of power consumed by the optical element and minimizing costs.
    Type: Application
    Filed: June 14, 2011
    Publication date: April 4, 2013
    Inventor: Dong Han Yoon
  • Publication number: 20070285016
    Abstract: Disclosed is a bundle type fluorescent lamp adaptable for the lower temperature atmosphere, in which at least two fluorescent lamps are aligned in a row in the form of a bundle and are accommodated in a transparent or a semitransparent insulative cover, so that the bundle type fluorescent lamp represents superior operational characteristics even if it is installed in a freezing chamber or a cold storage warehouse. Each of the fluorescent lamps includes a glass tube filled with discharge gas and an electrode positioned at both side ends of the glass tube, wherein the fluorescent lamps are bound with each other in a form of a bundle and each electrode of the fluorescent lamps is electrically connected to a power source. The fluorescent lamp includes an external electrode fluorescent lamp, a cold cathode fluorescent lamp or a general fluorescent lamp.
    Type: Application
    Filed: June 13, 2006
    Publication date: December 13, 2007
    Inventors: June-Gill Kang, Chang-Soo Choi, Dong-Han Yoon