Patents by Inventor Dong Han

Dong Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11408060
    Abstract: The present invention relates to an amorphous alloy having low frictional resistance and capable of improving abrasion resistance, a target made of the amorphous alloy, and a compressor comprising a layer of the amorphous alloy as a coating layer. According to the present invention, it is possible to secure high hardness and a low elastic modulus of the coating layer by controlling a microstructure having an amorphous phase as a primary phase by using Ti-based three-component to five-component amorphous alloys. As a result, it is possible to prevent the coating layer from being peeled off from a matrix or destroyed, and thus it is possible to achieve the effect of improving reliability or durability of a mechanical apparatus such as a compressor.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 9, 2022
    Assignees: LG Electronics Inc., Seoul National University R&DB Foundation
    Inventors: Kyoung Jin Ku, Dong Han Kim, Joungwook Kim, Hangjin Ban, Bumdong Sa, Eun Soo Park, Wook Ha Ryu, Kyung-Jun Kim, Jinwoo Kim, Heh Sang Ahn
  • Publication number: 20220245313
    Abstract: Disclosed is a method for calculating a fluid-structure interaction response of ceramic matrix composites (CMCs). The method includes: calculating a stress-strain hysteresis curve under loading and unloading of a CMC unit cell model through a multi-scale method; performing an interpolation to calculate a hysteresis loop response under arbitrary loading and unloading through a hysteresis loop under loading and unloading calculated through the unit cell model, and using the hysteresis loop response as a proxy model for a dynamics calculation of a solid domain of a fluid-structure interaction; and calculating a fluid load on a fluid-structure interaction interface through CFD, writing a program to read the fluid load and map the same to a solid node, reading a displacement of the solid node and mapping the same onto the fluid node, where a fluid domain and the solid domain use the same time step.
    Type: Application
    Filed: August 31, 2020
    Publication date: August 4, 2022
    Inventors: Yingdong SONG, Xiguang GAO, Guoqiang YU, Dong HAN, Sheng ZHANG, Lu ZHANG, Chao YOU
  • Publication number: 20220237867
    Abstract: A system and corresponding method is disclosed for monitoring and conducting large-scale performance verification of a city's lighting infrastructure. In particular, the current invention combines measurements of lighting performance measurements along city roadways with regulatory requirements for the roadways. In various embodiments, the current invention then presents a three-dimensional visualization of the adequacy of existing roadway lighting with respect to these regulatory requirements.
    Type: Application
    Filed: March 2, 2022
    Publication date: July 28, 2022
    Inventors: DONG HAN, YUTING ZHANG, OLAITAN PHILIP OLALEYE, SIRISHA RANGAVAJHALA
  • Publication number: 20220215870
    Abstract: A ferroelectric random access memory device comprises: a memory cell array including a plurality of memory cells each having one ferroelectric transistor (FeFET) connected between a read line of a plurality of read lines and a source line of a plurality of source lines and one transistor connected between a bit line of a plurality of bit lines and a gate of the FeFET and having a gate connected to a corresponding word line of a plurality of word lines; and a read/write control unit, when address information for a memory cell to be written is applied with a write command and data, selecting a word line and a read line corresponding to a row address and applying a write voltage having a positive voltage level, and applying a ground voltage to the selected read line, and applying the write voltage to a bit line corresponding to a memory cell.
    Type: Application
    Filed: January 4, 2022
    Publication date: July 7, 2022
    Inventors: Seong Ook JUNG, Dong Han KO, Tae Woo OH, Se Hee LIM, Se Keon KIM
  • Patent number: 11372548
    Abstract: Some systems compress data utilized by a user mode software without the user mode software being aware of any compression taking place. To maintain that illusion, such systems prevent user mode software from being aware of and/or accessing the underlying compressed states of the data. While such an approach protects proprietary compression techniques used in such systems from being deciphered, such restrictions limit the ability of user mode software to use the underlying compressed forms of the data in new ways. Disclosed herein are various techniques for allowing user-mode software to access the underlying compressed states of data either directly or indirectly. Such techniques can be used, for example, to allow various user-mode software on a single system or on multiple systems to exchange data in the underlying compression format of the system(s) even when the user mode software is unable to decipher the compression format.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: June 28, 2022
    Assignee: NVIDIA Corporation
    Inventors: Ram Rangan, Patrick Richard Brown, Wishwesh Anil Gandhi, Steven James Heinrich, Mathias Heyer, Emmett Michael Kilgariff, Praveen Krishnamurthy, Dong Han Ryu
  • Publication number: 20220173083
    Abstract: A package on package structure includes a first package, a plurality of conductive bumps, a second package and an underfill. The conductive bumps are disposed on a second surface of the first package and electrically connected to the first package. The second package is disposed on the second surface of the first package through the conductive bumps, and includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. A shortest distance from an upper surface of the encapsulating material to an upper surface of the semiconductor device is greater than or substantially equal to twice a thickness of the semiconductor device. The underfill is filled between the first package and the second package.
    Type: Application
    Filed: February 16, 2022
    Publication date: June 2, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Dong-Han Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng, Yi-Jen Lai
  • Patent number: 11340332
    Abstract: A radar data processing method and apparatus. The radar data processing apparatus calculates phase information of a radar signal received by a radar sensor, calculates noise representative information from the calculated phase information, and determines driving-related information based on the noise representative information and radar data calculated from the radar signal.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 24, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun Woong Cho, Dong Han Kim, Sung Do Choi
  • Publication number: 20220156221
    Abstract: An electronic device includes a CPU, an acceleration module, and a memory. The acceleration module is communicatively connected with the CPU, and includes chips. The chip according to an embodiment includes a data bus, and a memory, a data receiver, a computing and processing unit, and a data transmitter connected to the data bus. The data receiver receives first data and header information from outside, writes the first data to a corresponding area of the memory through the data bus, and configures a corresponding computing and processing unit and/or data transmitter according to the header information. The computing and processing unit receives first task information, performs an operation processing according to the first task information and a configuration operation on the data transmitter. The data transmitter obtains second task information and second data, and outputs third data to outside based on at least part of the second data.
    Type: Application
    Filed: August 31, 2020
    Publication date: May 19, 2022
    Inventors: Yao ZHANG, Shaoli LIU, Dong HAN
  • Publication number: 20220115567
    Abstract: A display device includes: a substrate; a plurality of pixels on the substrate, and each of the pixels including first to third sub-pixels each including at least one light emitting diode configured to emit light; and a color conversion layer including first to third color conversion patterns respectively corresponding to the first to third sub-pixels, each of the first to third color conversion patterns configured to transmit the light or convert the light into light of a different color. The light emitting diode of each of the first to third sub-pixels is coupled to a first electrode and a second electrode. At least one of the first to third color conversion patterns includes a perovskite compound.
    Type: Application
    Filed: December 21, 2021
    Publication date: April 14, 2022
    Inventors: Jae Hong PARK, Sung Woon KIM, Min Ki NAM, Kyoung Won PARK, Dong Han SONG
  • Patent number: 11294011
    Abstract: Methods, devices, apparatus and systems for magnetic resonance imaging with deep neural networks are provided. In one aspect, a method of magnetic resonance imaging method combines a deep neural network and an accelerated imaging manner. The method includes: scanning a subject with a first undersampling factor and a first sampling trajectory to obtain first imaging information, processing the first imaging information with the deep neural network to obtain second imaging information corresponding to a second undersampling factor that is smaller than the first undersampling factor, and reconstructing a magnetic resonance image of the subject from the second imaging information.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: April 5, 2022
    Assignee: Shanghai Neusoft Medical Technology Co., Ltd.
    Inventors: Feng Huang, Dong Han, Ling Mei
  • Patent number: 11295520
    Abstract: A system and corresponding method is disclosed for monitoring and conducting large-scale performance verification of a city's lighting infrastructure. In particular, the current invention combines measurements of lighting performance measurements along city roadways with regulatory requirements for the roadways. In various embodiments, the current invention then presents a three-dimensional visualization of the 5 adequacy of existing roadway lighting with respect to these regulatory requirements.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: April 5, 2022
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Dong Han, Yuting Zhang, Olaitan Philip Olaleye, Sirisha Rangavajhala
  • Publication number: 20220090809
    Abstract: Provided is a heat pump system including a compressor for compressing a refrigerant the heat pump system including: an input interface configured to receive an input of an authentication code; a display configured to display the authentication code input through the input interface; and a controller to control an operation of the heat pump system according to whether a control program to control the operation is to be activated based on the authentication code input through the input interface.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 24, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Hyun JANG, Jae-Yang LEE, Dong Han KO, Yong Sang Kong, Suk Ho LEE, Min CHANG
  • Patent number: 11263530
    Abstract: Aspects for maxout layer operations in neural network are described herein. The aspects may include a load/store unit configured to retrieve input data from a storage module. The input data may be formatted as a three-dimensional vector that includes one or more feature values stored in a feature dimension of the three-dimensional vector. The aspects may further include a pruning unit configured to divide the one or more feature values into one or more feature groups based on one or more data ranges and select a maximum feature value from each of the one or more feature groups. Further still, the pruning unit may be configured to delete, in each of the one or more feature groups, feature values other than the maximum feature value and update the input data with the one or more maximum feature values.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: March 1, 2022
    Assignee: Cambricon Technologies Corporation Limited
    Inventors: Dong Han, Qi Guo, Tianshi Chen, Yunji Chen
  • Publication number: 20220059249
    Abstract: This invention relates to a solidifying agent for solidifying radioactive waste, and more particularly to a solidifying-agent composition for solidifying radioactive waste, including alumina cement and a gypsum powder. The solidifying-agent composition including alumina cement and a gypsum powder is capable of effectively minimizing an increase in the volume of a solidified radioactive waste product to a level satisfying physical and chemical safety regulations upon the solidification of radioactive waste.
    Type: Application
    Filed: November 2, 2021
    Publication date: February 24, 2022
    Applicant: KEPCO NUCLEAR FUEL CO., LTD.
    Inventors: Nam-Chan Cho, Young-Jong Ju, Jeong-Myeong Kim, Dong Han Lim, Kyoung Kuk Ki, Jung Hoon Park
  • Publication number: 20220057503
    Abstract: The present disclosure is directed to inventive systems, methods, and devices for use in an outdoor lighting network for drone detection. The drone detection system includes one or more lighting fixtures, one or more radar sensors to detect a moving object, and one or more controllers. The controllers receive data from the sensors, determine the velocity and velocity change rate of the object over a period of time, and analyze flight data pertaining to the moving object to determine if the object is a drone. The system can determine the starting location of the moving object, and send a signal indicating its starting location. The system can also track the position of the moving object in the outside environment.
    Type: Application
    Filed: January 9, 2020
    Publication date: February 24, 2022
    Inventors: DONG HAN, JIA HU, ABHISHEK MURTHY, JIN YU
  • Patent number: 11257797
    Abstract: A package on package structure includes a first package, a plurality of conductive bumps, a second package and an underfill. The conductive bumps are disposed on a second surface of the first package and electrically connected to the first package. The second package is disposed on the second surface of the first package through the conductive bumps, and includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. A shortest distance from an upper surface of the encapsulating material to an upper surface of the semiconductor device is greater than or substantially equal to twice a thickness of the semiconductor device. The underfill is filled between the first package and the second package.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: February 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Dong-Han Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng, Yi-Jen Lai
  • Publication number: 20220052715
    Abstract: The present disclosure relates to signal sending circuits, signal receiving circuits, electronic apparatus, and base stations. One example circuit includes a signal pre-processing sub-circuit, a digital-to-analog conversion sub-circuit, an intermediate frequency power splitter, K frequency conversion phase-shift sub-circuits, and K antenna elements. An output end of the signal pre-processing sub-circuit is connected to an input end of the digital-to-analog conversion sub-circuit, an output end of the digital-to-analog conversion sub-circuit is connected to an input end of the intermediate frequency power splitter, an output end of the intermediate frequency power splitter is connected to input ends of the K frequency conversion phase-shift sub-circuits, and output ends of the K frequency conversion phase-shift sub-circuits are connected one-to-one to input ends of the K antenna elements.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 17, 2022
    Inventors: CHUANHUI MA, Dong HAN, Guolong HUANG
  • Publication number: 20220024918
    Abstract: The present technology provides triazolopyridin-3-ones or pharmaceutically acceptable salts thereof, preparation processes thereof, pharmaceutical compositions comprising the same, and uses thereof. The triazolopyridin-3-ones or their pharmaceutically acceptable salts exhibit inhibitory activity on VAP-1 and therefore can be usefully applied, e.g., for the treatment and prophylaxis of nonalcoholic hepatosteatosis (NASH).
    Type: Application
    Filed: July 6, 2021
    Publication date: January 27, 2022
    Inventors: Tae Dong HAN, Hee Jae TAK, Eun Kyung KIM, Dong Hoon KIM, Su Bin CHOI, Sol PARK, Hyun Ho CHOI, Tae Wang KIM, Mi Kyeong JU, Na Ry HA
  • Publication number: 20220022765
    Abstract: The present disclosure relates to techniques for the estimating anomalies within photoplethysmographic signals. The techniques may include use of instruments that include photoplethysmographic and acceleration sensors. Time-frequency spectra may be used to determine the anomalies. Corrupted signals may be detected and corrected through applications of machine learning and feature extraction.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 27, 2022
    Inventors: Ki H. Chon, Dong Han, Syed Khairul Bashar, Fahimeh Mohagheghian
  • Patent number: 11227980
    Abstract: A display device includes: a substrate; a plurality of pixels on the substrate, and each of the pixels including first to third sub-pixels each including at least one light emitting diode configured to emit light; and a color conversion layer including first to third color conversion patterns respectively corresponding to the first to third sub-pixels, each of the first to third color conversion patterns configured to transmit the light or convert the light into light of a different color. The light emitting diode of each of the first to third sub-pixels is coupled to a first electrode and a second electrode. At least one of the first to third color conversion patterns includes a perovskite compound.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: January 18, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae Hong Park, Sung Woon Kim, Min Ki Nam, Kyoung Won Park, Dong Han Song