Abstract: The invention relates to a wafer for use as a substrate for a semiconductor device, the wafer comprising a round zone formed along a circumference thereof; a flat zone wherein the circumference thereof is partially cut in a straight line; and a laser marking region functioning as a wafer bar-code which is formed in an upper portion of the round zone opposite to and apart from the flat zone. The wafer bar-code has holes having about 2 .mu.m depth and is formed by a soft marking process. A good fine pattern can be formed on the wafer with a follow-on patterning process by substantially cleaning photoresist materials remaining in holes of the laser marking region. Further, the occurrence of G-defects can be reduced, such defects being caused by photoresist particles remaining on the surface of the wafer.

Abstract: A method for manufacturing a semiconductor device comprises the steps of extracting an optimal working condition by accumulatively averaging accumulated working conditions of lots previously performed in an expectation process to be currently performed in the manufacturing equipment, extracting a correction condition by extracting information for an alignment state of a lower layer performed by the expectation process, and setting the working condition by adding the correction condition to the optimal working condition.

Abstract: A semiconductor wafer cleaning apparatus having an edge rinse member adapted for rinsing edges of a semiconductor wafer and having a moving member adapted to permit horizontally movement of the edge rinse member, wherein the apparatus is adapted to minimize or prevent an upper surface of the wafer from being stained with pollutants during rinsing. The wafer cleaning apparatus minimizes or prevents rebounding of a rinse solution containing particles from the inside wall of a bowl during rinsing of the edges of a semiconductor wafer.