Abstract: A semiconductor device may include a first substrate, a lower pattern on a first side of the first substrate, a plurality of sheet patterns on the lower pattern and spaced apart from each other in a first direction, a gate electrode which surrounds portions the plurality of sheet patterns, a source/drain pattern which is on one side of the gate electrode and connected to the plurality of sheet patterns, a power rail which is on a second side of the first substrate, a via pattern which extends through the first substrate in the first direction, and is connected to both the power rail and the source/drain pattern, a first dummy pattern on the via pattern, a second substrate on the first dummy pattern, and a second dummy pattern on a third side of the second substrate that faces the first side of the first substrate.

Abstract: A slurry solution includes an abrasive including a first frame portion including an oxide and having a spherical shape, a plurality of pores in the abrasive, and a plurality of first abrasive elements at least partially filling the plurality of pores, where the plurality of first abrasive elements include Ce(OH)4.

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a substrate including a frontside on which an active pattern is formed and a backside opposite the frontside, an electronic element on an active region in which the active pattern is formed, a frontside interconnection structure, in which a power line connected to the electronic element is disposed, on the frontside of the substrate, a backside interconnection structure, which includes a backside line connected to the electronic element, on the backside of the substrate, a through via connecting the power line with the backside line by passing through the substrate, and a dummy mold structure on the frontside interconnection structure, having a first cross-sectional thickness greater than a second cross-sectional thickness of the frontside interconnection structure.

Abstract: A substrate processing device includes a platen, a polishing pad disposed on the platen, a first rotating body, a second rotating body spaced apart from the first rotating body, a caterpillar module disposed on a portion of the polishing pad and engaged with the first rotating body and the second rotating body, and a temperature controller thermally connected to the caterpillar module.

Abstract: A chemical mechanical polishing apparatus capable of controlling polishing temperature, and a method of fabricating a semiconductor device using the same are provided. The chemical mechanical polishing apparatus includes a platen, a polishing pad on the platen, the polishing pad including a plurality of grooves, and a light irradiator in the platen, the light irradiator configured to irradiate light toward the polishing pad, wherein the polishing pad includes a light transmission pattern interposed between at least some of the plurality of grooves and the light irradiator and through which the light is transmitted.

Abstract: A method of fabricating a semiconductor device comprises mounting a carrier substrate and a wafer on a wafer chuck of a wafer chuck apparatus, the carrier substrate and the wafer attached to each other, injecting air into an air member by selectively controlling at least one air injection pipe connected to the air member of the wafer chuck apparatus, tilting the wafer chuck to a predetermined angle in response to the air being injected into the air member, processing the wafer while the wafer chuck is tilted, determining whether to change a tilt angle of the wafer chuck or a position of the wafer, adjusting an amount of air injected into the air member according to a changed tilt angle of the wafer chuck or a changed position of the wafer, and processing the wafer after adjusting of the amount of air in the air member.

Abstract: A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the second region, turning the polishing pad to polish a surface of the wafer, and unloading the wafer from the polishing pad after polishing on the surface of the wafer is completed, wherein the fence includes a first fence extending from a center of the polishing pad toward an edge of the polishing pad in a first horizontal direction, and a second fence extending from the center of the polishing pad toward the edge of the polishing pad in a second horizontal direction different from the first horizontal direction.

Abstract: The present invention relates to a method for detecting food poisoning bacteria, and more particularly, to a method for rapidly and quantitatively isolating food poisoning bacteria contents which contaminate food and the like. The method according to the present invention is characterized by including the steps of: introducing magnetic nanoparticles which can bind to bacteria into a sample for measuring the bacteria so as to bind the magnetic nanoparticles to the bacteria; isolating the magnetic nanoparticles; passing the nanoparticles which are isolated by using magnetism through a solution having high viscosity so as to separate the magnetic nanoparticles to which bacteria are bound from magnetic nanoparticles to which no bacteria are bound; and quantifying the magnetic nanoparticles to which bacteria are bound.

Abstract: The present invention relates to a method for detecting food poisoning bacteria, and more particularly, to a method for rapidly and quantitatively isolating food poisoning bacteria contents which contaminate food and the like. The method according to the present invention is characterized by including the steps of: introducing magnetic nanoparticles which can bind to bacteria into a sample for measuring the bacteria so as to bind the magnetic nanoparticles to the bacteria; isolating the magnetic nanoparticles; passing the nanoparticles which are isolated by using magnetism through a solution having high viscosity so as to separate the magnetic nanoparticles to which bacteria are bound from magnetic nanoparticles to which no bacteria are bound; and quantifying the magnetic nanoparticles to which bacteria are bound.