Abstract: A multilayer voice coil plate and a flat speaker including the same are capable of significantly reducing difficulties in designing and manufacturing a multilayer voice coil pattern. The multilayer voice coil plate may include: a first-type voice coil pattern layer formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole disposed in the track; and a second-type voice coil pattern layer formed in the shape of a track and connected from a second outer via hole outside the track to an inner via hole disposed in the track. The plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers may be stacked so as to be insulated from each other, and the first outer via holes, the second outer via holes and the inner via holes may be electrically connected through interlayer conductors, respectively.

Abstract: Disclosed are a multilayer voice coil plate capable of significantly reducing difficulties in designing and manufacturing a multilayer voice coil pattern, and a flat speaker including the same. The multilayer voice coil plate may include: a first-type voice coil pattern layer formed in the shape of a track and connected from a first outer via hole outside the track to an inner via hole disposed in the track; and a second-type voice coil pattern layer formed in the shape of a track and connected from a second outer via hole outside the track to an inner via hole disposed in the track. The plurality of first-type voice coil pattern layers and the plurality of second-type voice coil pattern layers may be stacked so as to be insulated from each other, and the first outer via holes, the second outer via holes and the inner via holes may be electrically connected through interlayer conductors, respectively.

Abstract: A multi-way earphone may include: a housing having a space therein; a first sound unit housed in the space of the housing, and configured to convert an electrical signal into a sound; and a second sound unit disposed in a vertical direction from the first sound unit, and configured to output a different range of sound from the sound outputted from the first sound unit. The housing may form a first transmission path through which the sound outputted from the first sound unit is transmitted to the outside along the inner circumferential surface of the housing, and the second sound unit may include a unit cap forming a second transmission path through which the sound outputted from the second sound unit is outputted while being separated from the sound passing through the first transmission path. The stereo performance of the multi-way earphone can be improved to provide a sound with a 3D effect to a listener.

Abstract: A system and method for improving the electrical efficiency of an electrical load are provided. In an embodiment, a device is coupled to a load and its power source via an electrical conductor. The device optimizes the power delivered from the power source to the load by compensating or removing distortions in the matter wave of the electrical energy delivered from the power source. In some embodiments, the device employs infrared radiating materials that surround selected areas of the conductor. The infrared radiation may be of a wavelength and frequency that help restore the matter waves of the electrical energy and increase power factor of the load. Additionally, the device can be configured to modify the matter wave properties of the conductor itself to minimize its effects. For example, the infrared radiation emitted from the device may provide destructively interference energy that reduces vibrations of atoms inside the conductor.

Abstract: The present invention relates to an ultra sensitive in-situ magnetometer system, and more particularly to an ultra sensitive in-situ magnetometer system that can in-situ monitor a magnetic moment of a magnetic thin film with sub-monolayer precision while depositing and growing the magnetic thin film in an ultra high vacuum (UHV) chamber.

Abstract: The present invention relates to an ultra sensitive in-situ magnetometer system, and more particularly to an ultra sensitive in-situ magnetometer system that can in-situ monitor a magnetic moment of a magnetic thin film with sub-monolayer precision while depositing and growing the magnetic thin film in an ultra high vacuum (UHV) chamber.

Abstract: An inventive array of M.times.N thin film actuated mirrors includes an active matrix, a passivation layer, an etchant stopping layer and an array of M.times.N actuating structures. The active matrix includes a substrate, an array of M.times.N transistors, an adhesion layer, a diffusion barrier layer, an array of M.times.N connecting terminals and a stress balancing layer. The passivation layer is formed on top of the active matrix and the etchant stopping layer is formed on top of the passivation layer. The array of M.times.N actuating structures includes a first thin film electrode, a thin film electrodisplacive member, a second thin film electrode, an elastic member and a conduit. The diffusion barrier layer located between the substrate and the connecting terminal prevents diffusion of silicon (Si) from the substrate to the connecting terminals.

Abstract: Thin film AMA in an optical projection system and a method for manufacturing the same are disclosed. The thin film AMA has a substrate having an electrical wiring for receiving a first signal applied from outside and transmitting the first signal, a first metal layer having a connecting terminal, a first passivation layer, a second metal layer, an actuator, and a reflecting member. The actuator has a supporting layer, a bottom electrode, an active layer, and a top electrode. An incident light from a light source may be excluded by means of the second metal layer formed on the first metal layer. Mis-operation of actuator due to a photo leakage current caused by an incident light can be prevented before a first signal and a second signal are respectively applied to the bottom electrode and the top electrode.