Patents by Inventor Dong Hoon Seo

Dong Hoon Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11545451
    Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: January 3, 2023
    Assignee: NEPES CO., LTD.
    Inventors: Hyun Sik Kim, Seung Hwan Shin, Yong Tae Kwon, Dong Hoon Seo, Hee Cheol Kim, Dong Soo Lee
  • Patent number: 11461066
    Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: October 4, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo Sik Yun, Dong Hoon Seo, Sung-Jae Lee, Min Chul Jung
  • Publication number: 20220075586
    Abstract: A display apparatus according to an embodiment of the disclosure includes a communicator configured to receive content from an external apparatus; a display; and a controller configured to determine whether tag information related to a component of the received content matches predetermined apparatus information, and determine whether to display the content based on the determined result.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 10, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo Sik YUN, Dong Hoon SEO, Sung-Jae LEE, Min Chul JUNG
  • Publication number: 20210288005
    Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.
    Type: Application
    Filed: February 19, 2021
    Publication date: September 16, 2021
    Applicant: Nepes CO., LTD.
    Inventors: Hyun Sik KIM, Seung Hwan SHIN, Yong Tae KWON, Dong Hoon SEO, Hee Cheol KIM, Dong Soo LEE
  • Patent number: 11065343
    Abstract: The present invention relates to a compound bearing a self-immolative linker having ?-galactoside-introduced thereto. In a compound bearing a ?-galactoside-introduced self-immolative linker according to the present invention, particularly, the self-immolative linker may form a glycosidic bond with a protein (e.g., an oligopeptide, polypeptide, an antibody, etc.) or ligand which has specific affinity for a desired target or with an active agent (e.g., a drug, a toxin, a ligand, a detection probe, etc.), which has a specific function or activity so as to allow the selective release of the active agent within a target cell.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: July 20, 2021
    Assignee: IntoCell Inc.
    Inventors: Tae Kyo Park, Sung Ho Woo, Sun Young Kim, Doo Hwan Jung, Sang Kwang Lee, Jong Un Cho, Jae Ho Lee, Su Ho Park, Dong Hoon Seo, Hyang Sook Lee, Beom Seok Seo, Ji Yeon Lim
  • Publication number: 20190328902
    Abstract: The present invention relates to a compound bearing a self-immolative linker having ?-galactoside-introduced thereto. In a compound bearing a ?-galactoside-introduced self-immolative linker according to the present invention, particularly, the self-immolative linker may form a glycosidic bond with a protein (e.g., an oligopeptide, polypeptide, an antibody, etc.) or ligand which has specific affinity for a desired target or with an active agent (e.g., a drug, a toxin, a ligand, a detection probe, etc.), which has a specific function or activity so as to allow the selective release of the active agent within a target cell.
    Type: Application
    Filed: December 28, 2017
    Publication date: October 31, 2019
    Inventors: Tae Kyo Park, Sung Ho Woo, Sun Young Kim, Doo Hwan Jung, Sang Kwang Lee, Jong Un Cho, Jae Ho Lee, Su Ho Park, Dong Hoon Seo, Hyang Sook Lee, Beom Seok Seo, Ji Yeon Lim