Patents by Inventor Dong-Hwan Ko

Dong-Hwan Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250053921
    Abstract: Disclosed is a method of controlling at least one server configured to assign a task to a plurality of robots assisting to a worker. The control method includes generating one or more picking rounds including a plurality of orders with respect to the same shipment, identifying at least one robot corresponding to an idle state as a target robot, selecting a picking round with the highest priority among the one or more picking rounds in progress, assigning the target robot to the selected picking round, selecting a location group matching a picking unit in a waiting state among a plurality of location groups in which locations at which shipments related to the selected picking round are stored are grouped, and assigning the target robot to the selected location group and assigning a picking task to the target robot according to a picking unit matching the selected location group.
    Type: Application
    Filed: August 8, 2024
    Publication date: February 13, 2025
    Applicant: Twinny Co., Ltd.
    Inventors: Jong Min Park, Dong Hwan Ko, Yun Hui Chae, Yul Ri Jung
  • Publication number: 20250012979
    Abstract: The present invention relates to a fiber-optic cable magnetic coupling adapter, and the fiber-optic cable magnetic coupling adapter according to an embodiment of the present invention includes: an adapter main body; a joint that is provided on one surface of the adapter main body and has a magnetic body; and an insertion connection part that is provided on the other surface of the adapter main body and connected to a connector, in which the joint is provided as a protrusion that protrudes from a central portion of one surface of the adapter main body to an outer side of one surface, but has a hollow part formed inside and has opened one surface, or is provided as a recession that is recessed from the central portion of one surface of the adapter main body to an inner side of one surface, but is provided so as to be engaged with the protrusion and has the hollow part formed inside and has opened one surface.
    Type: Application
    Filed: September 24, 2024
    Publication date: January 9, 2025
    Inventors: Byung Jo JUNG, Dong Hwan KO, Su Bin PARK
  • Publication number: 20170038104
    Abstract: The present invention provides an evaporator having a vertical arrangement of header pipes for a vehicle air conditioner, the evaporator including: a pair of header pipes disposed to face each other with a gap therebetween, providing a circulation path for a coolant supplied in the cooling cycle, and discharging the coolant that has exchanged heat; a plurality of tubes laterally arranged between the pair of header pipes to communicate with the header pipes, connected in a longitudinal direction of the header pipes, and allowing a coolant flowing inside through inlets of the header pipes to exchange heat with air while flowing in a zigzag pattern toward outlets of the header pipes; and heat-dissipating fins disposed among the tubes and dissipating heat of vaporization from the tubes while passing the air supplied from the fan.
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Inventor: Dong Hwan Ko
  • Publication number: 20170036515
    Abstract: Disclosed is a drain pan structure having a drain pan storing and draining condensate water generated from an evaporator installed in a casing of the bus air conditioner, the drain pan including: a bottom plate provided at a position below the evaporator, the bottom plate including: an inclined portion having at least one surface having at least one downward inclination; and a drain channel formed by extending to distal ends of a side direction of the bottom plate such that height of the drain channel is lowest at the distal ends of the side direction of the bottom plate so as to move the condensate water drained from the bottom plate, in a drain direction of the condensate water.
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Inventor: Dong Hwan Ko
  • Publication number: 20170036509
    Abstract: The present invention relates to a heat exchanger that is disposed in an automotive air conditioner and provides cold air or hot air through heat exchange with air supplied by a fan and, more particularly, to an integrated module of an evaporator core and a heater core for an automotive air conditioner whereby the integrated module can simplify an automotive air conditioner by integrating an evaporator for cooling and a heater core for heating in the automotive air conditioner. According to the present invention, evaporator headers and heater headers are stacked and fixed in an integrated unit, so it is possible to simplify a facility. Accordingly, installation is easy and a volume can be reduced, as compared with the related art, whereby it is possible to reduce the weight of a vehicle.
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Inventor: Dong Hwan Ko
  • Patent number: 6686266
    Abstract: A method for forming a fuse pattern for repairing a bad cell includes forming a metal wiring pattern on a substrate and successively forming an insulating layer on the metal wiring pattern and the substrate. The insulating layer of a region for defining the fuse pattern is etched by using an etching gas including a fluorocarbon-type compound and a fluorosilicate-type compound, which substantially suppresses a generation of by-products. A partially exposed metal layer of the metal wiring pattern is removed to form a fuse. Accordingly, a structure such as a fence is not formed on the residue of insulating layer. Therefore, the removal process for the fence is unnecessary. As a result, the process for forming the fuse is simplified.
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: February 3, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Hwan Ko, Seog-Hun Yoon, Jae-Hyun Park
  • Publication number: 20030013289
    Abstract: A method for forming a fuse pattern for repairing a bad cell includes forming a metal wiring pattern on a substrate and successively forming an insulating layer on the metal wiring pattern and the substrate. The insulating layer of a region for defining the fuse pattern is etched by using an etching gas including a fluorocarbon-type compound and a fluorosilicate-type compound, which substantially suppresses a generation of by-products. A partially exposed metal layer of the metal wiring pattern is removed to form a fuse. Accordingly, a structure such as a fence is not formed on the residue of insulating layer. Therefore, the removal process for the fence is unnecessary. As a result, the process for forming the fuse is simplified.
    Type: Application
    Filed: July 5, 2002
    Publication date: January 16, 2003
    Inventors: Dong-Hwan Ko, Seog-Hun Yoon, Jae-Hyun Park
  • Patent number: 6123805
    Abstract: A process chamber of a dry etching facility for manufacturing semiconductor devices uniformly forms the ion density of plasma over a wafer, and reduces the volume of the process chamber by installing a plurality of discharge openings in an electrode housing which supports the electrode plate of a lower electrode. The lower electrode is a discharge electrode which is constructed such that a plurality of discharge openings are symmetrically provided in the side wall of the electrode housing supporting the electrode plate on which a wafer is mounted, and the discharge openings form a discharge passage which is connected to a discharge pipe at a pipe connection opening.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: September 26, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-hoon Kim, Byung-chul Kim, Dong-hwan Ko
  • Patent number: D514210
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: January 31, 2006
    Assignee: Dong Hwan Ind. Ltd.
    Inventor: Dong-Hwan Ko