Abstract: Disclosed are a primary coil unit having four coils independently controllable and a pickup coil unit having four coils also independently controllable. The proposed power transfer system and the proposed power pickup system can satisfy standard compatibility and improve the efficiency of wireless power transmission. The power transfer device is compatible with various types of conventional power pickup systems and capable of expanding compatibility with a new power pickup system to be developed in future by changing the power transfer magnetic flux pattern. The power pickup device is compatible with various types of conventional power transfer systems and capable of expanding compatibility with a power transfer system to be developed in future. The system including both the power transfer device and the power pickup device is more robust against a deviation.

Abstract: The present invention discloses a system and method for redesigning treatment prescriptions according to evaluation of treatment effectiveness. In the present invention, when the system receives the treatment prescriptions from the medical staff terminal, sets the treatment device according to the treatment prescriptions, and delivers the treatment device to the patient, the patient performs treatment by himself using the treatment device at home. When the treatment is finished, the patient terminal transmits the treatment history information, the treatment image obtained by photographing the process of self-treatment, and the questionnaire replies to the system. The system calculates compliance from the treatment history information, evaluates the treatment motor/cognitive/emotional functions from the questionnaire reply, and then provides them to the medical staff terminal together with the questionnaire replies, and allows the medical staff to evaluate effect of the treatment prescriptions.

Abstract: The present invention relates to a bone-regenerating composition containing angiogenin and to a bone-generating scaffold comprising the composition.

Abstract: Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.

Abstract: Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.