Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Abstract: Methods and systems for a semiconductor package may comprise a package device comprising at least one semiconductor chip and an active element attached to a substrate and a window with sidewalls forming cavity regions for the package device and coupled to the substrate with an adhesive. An outer edge of the substrate may be flush with an outer surface of the window sidewalls. The window may be plastic and may include an EMI shielding layer, which may be a copper/nickel plating layer. The semiconductor chip may be a MEMS microphone device. The sidewalls and a top plate of the window may be at a right angle to each other. The package may be formed by severing it from an N×M array of package structures resulting in the outer edges being flush.

Abstract: Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.

Abstract: Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.