Abstract: A cooking system is disclosed. The cooking system includes a microwave and a display device. The microwave is configured to in response to a received user command, generate a first image by photographing a cooktop located below the microwave through a first camera or generate a second image by photographing an inside of the microwave through a second camera. The microwave is also configured to transmit at least one of the first image and the second image to the display device. The display device is configured to receive the at least one of a first image and the second image from the microwave and display the received at least one image.

Abstract: A light-emitting element includes a first end portion and a second end portion disposed in a length direction of the light-emitting element, a first electrode corresponding to the first end portion, a first semiconductor layer on the first electrode, an active layer on the first semiconductor layer, a second semiconductor layer on the active layer, and a second electrode on the second semiconductor layer and corresponding to the second end portion. The second electrode includes a first layer on the first semiconductor layer, and a second layer on the first layer. The first semiconductor layer includes a p-type semiconductor layer doped with a p-type dopant. The second semiconductor layer includes an n-type semiconductor layer doped with an n-type dopant. The first electrode is in ohmic contact with the first semiconductor layer. The second electrode is in ohmic contact with the second semiconductor layer.

Abstract: An optical imaging system includes a plurality of lenses disposed along an optical axis from an object side of the optical imaging system toward an imaging plane of the optical imaging system. The lenses are separated from each other by respective air gaps along the optical axis between the lenses. The lenses include a first lens closest to the object side of the optical imaging system. The conditional expressions 1.5 mm<Gmax, TL<12.0 mm, and 0.15<R1/f are satisfied, where Gmax is a maximum air gap along the optical axis among all of the air gaps, TL is a length of the optical imaging system along the optical axis from an object-side surface of the first lens to the imaging plane, R1 is a radius of curvature of the object-side surface of the first lens, and f is a focal length of the optical imaging system.

Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: A range hood and a method for controlling the range hood are provided. The apparatus includes a range hood which is capable of photographing a cooking process that is being performed on an upper plate of a cook top by using a camera disposed in the main body of the range hood, and a method for controlling the range hood are provided. In some of the example embodiments, a range hood is capable of photographing a cooking process that is being performed on an upper plate of a cook top that is positioned below a bottom surface of the main body.

Abstract: A display device includes a display panel disposed in a receiving member, a circuit board coupled to the display panel, an optical layer on the display panel, a conductive layer on one surface of the optical layer facing the circuit board, and a pad disposed between the conductive layer and the circuit board. The conductive layer contacts the receiving member.

Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.

Abstract: The present disclosure relates to an airbag apparatus for a vehicle, which includes: an airbag cushion which is inflated and deployed in a forward direction from both sides of a passenger upon vehicle collision to protect both sides of the passenger; and an inflater configured to generate gas by an impact detection signal and to supply the gas to the airbag cushion, wherein the airbag cushion includes a first airbag configured to protect both sides or one side from passenger's shoulder to passenger's lower body part; and a second airbag configured to protect passenger's head and both sides of passenger's shoulder, and can restrict and protect passenger's upper body and lower body by inflating and deploying the first and second airbags toward both sides of the passenger upon vehicle collision.

Abstract: The present invention relates to a driver seat airbag device for a vehicle and a method for manufacturing same, the driver seat airbag device comprising: a driver seat airbag mounted in a folded state inside a steering wheel; and an inflator connected to the driver seat airbag to supply gas to allow the driver seat airbag to expand between the steering wheel and a driver at the time of a vehicle collision, wherein: the driver seat airbag has a plurality of tether members and a diffuser installed thereat, the tether members restricting an expansion thickness of the driver seat airbag, the diffuser controlling a supply direction for a gas supplied to the driver seat airbag, the tether members and the diffuser being installed between a front panel facing the front side of the vehicle and a rear panel opposite to the front panel and facing the driver; and the diffuser is installed between the plurality of tether members, and thus the diffuser and the tether members are integrated to simplify an installation struc

Abstract: The present disclosure relates to an airbag apparatus for a vehicle, which includes: an airbag cushion which is inflated and deployed in a forward direction from both sides of a passenger upon vehicle collision to protect both sides of the passenger; and an inflater configured to generate gas by an impact detection signal and to supply the gas to the airbag cushion, wherein the airbag cushion includes a first airbag configured to protect both sides or one side from passenger's shoulder to passenger's lower body part; and a second airbag configured to protect passenger's head and both sides of passenger's shoulder, and can restrict and protect passenger's upper body and lower body by inflating and deploying the first and second airbags toward both sides of the passenger upon vehicle collision.

Abstract: The present invention relates to a block copolymer, comprising a hydrophilic first block, a hydrophobic second block, and a functional group capable of specifically binding to thiol.

Abstract: A parallel thermoelectric module includes: first and second substrates spaced apart from each other; a plurality of first electrodes disposed on the first substrate; a plurality of second electrodes disposed on the second substrate; thermoelectric devices disposed in the first and second substrates to connect one of the first electrodes with one of the second electrodes and including a plurality of P and N type thermoelectric devices; electrode terminals including at least one positive electrode terminal and at least one negative electrode terminal disposed in at least one of the first and second substrates; and N parallel circuit units (N is a natural number of 2 or more) having an electrically parallel structure to each other in series. The plurality of first electrodes, the plurality of second electrodes, and the thermoelectric devices are arranged to connect N parallel circuit units.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.