Abstract: The present invention relates to a block copolymer, comprising a hydrophilic first block, a hydrophobic second block, and a functional group capable of specifically binding to thiol.

Abstract: A parallel thermoelectric module includes: first and second substrates spaced apart from each other; a plurality of first electrodes disposed on the first substrate; a plurality of second electrodes disposed on the second substrate; thermoelectric devices disposed in the first and second substrates to connect one of the first electrodes with one of the second electrodes and including a plurality of P and N type thermoelectric devices; electrode terminals including at least one positive electrode terminal and at least one negative electrode terminal disposed in at least one of the first and second substrates; and N parallel circuit units (N is a natural number of 2 or more) having an electrically parallel structure to each other in series. The plurality of first electrodes, the plurality of second electrodes, and the thermoelectric devices are arranged to connect N parallel circuit units.

Abstract: The present disclosure relates to an airbag apparatus for a vehicle, which includes: an airbag cushion which is inflated and deployed in a forward direction from both sides of a passenger upon vehicle collision to protect both sides of the passenger; and an inflater configured to generate gas by an impact detection signal and to supply the gas to the airbag cushion, wherein the airbag cushion includes a first airbag configured to protect both sides or one side from passenger's shoulder to passenger's lower body part; and a second airbag configured to protect passenger's head and both sides of passenger's shoulder, and can restrict and protect passenger's upper body and lower body by inflating and deploying the first and second airbags toward both sides of the passenger upon vehicle collision.

Abstract: The present invention relates to a driver seat airbag device for a vehicle and a method for manufacturing same, the driver seat airbag device comprising: a driver seat airbag mounted in a folded state inside a steering wheel; and an inflator connected to the driver seat airbag to supply gas to allow the driver seat airbag to expand between the steering wheel and a driver at the time of a vehicle collision, wherein: the driver seat airbag has a plurality of tether members and a diffuser installed thereat, the tether members restricting an expansion thickness of the driver seat airbag, the diffuser controlling a supply direction for a gas supplied to the driver seat airbag, the tether members and the diffuser being installed between a front panel facing the front side of the vehicle and a rear panel opposite to the front panel and facing the driver; and the diffuser is installed between the plurality of tether members, and thus the diffuser and the tether members are integrated to simplify an installation struc

Abstract: The present disclosure relates to an airbag apparatus for a vehicle, which includes: an airbag cushion which is inflated and deployed in a forward direction from both sides of a passenger upon vehicle collision to protect both sides of the passenger; and an inflater configured to generate gas by an impact detection signal and to supply the gas to the airbag cushion, wherein the airbag cushion includes a first airbag configured to protect both sides or one side from passenger's shoulder to passenger's lower body part; and a second airbag configured to protect passenger's head and both sides of passenger's shoulder, and can restrict and protect passenger's upper body and lower body by inflating and deploying the first and second airbags toward both sides of the passenger upon vehicle collision.

Abstract: The present invention relates to a block copolymer, comprising a hydrophilic first block, a hydrophobic second block, and a functional group capable of specifically binding to thiol.

Abstract: A parallel thermoelectric module includes: first and second substrates spaced apart from each other; a plurality of first electrodes disposed on the first substrate; a plurality of second electrodes disposed on the second substrate; thermoelectric devices disposed in the first and second substrates to connect one of the first electrodes with one of the second electrodes and including a plurality of P and N type thermoelectric devices; electrode terminals including at least one positive electrode terminal and at least one negative electrode terminal disposed in at least one of the first and second substrates; and N parallel circuit units (N is a natural number of 2 or more) having an electrically parallel structure to each other in series. The plurality of first electrodes, the plurality of second electrodes, and the thermoelectric devices are arranged to connect N parallel circuit units.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.