Patents by Inventor Dong-hyun Lim

Dong-hyun Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240393705
    Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art.
    Type: Application
    Filed: April 18, 2024
    Publication date: November 28, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Sang Hyun PARK, Seung Hwan LEE, Su Jin AHN, Geon Yup LIM, Jin Ki SHIN, Dong Hoon KANG, Hyun Soo KIM, Kwang Soo KIM, Chang Suk OH, Young Jun LEE
  • Patent number: 12155859
    Abstract: The present invention relates to a method for encoding and decoding an image. The method for decoding an image includes: deriving an initial motion vector from a merge candidate list of a current block; deriving a refined motion vector using the initial motion vector; and generating a prediction block of the current block using the refined motion vector.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: November 26, 2024
    Assignee: INTELLECTUAL DISCOVERY CO., LTD.
    Inventors: Ha Hyun Lee, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Jin Ho Lee, Dong San Jun, Seung Hyun Cho, Hui Yong Kim, Jin Soo Choi
  • Publication number: 20240388716
    Abstract: The present invention relates to a method of performing motion compensation by using motion vector prediction. To this end, a method of decoding an image may include: generating multiple motion vector candidate lists according to an inter-prediction direction of a current block; deriving multiple motion vectors for the current block by using the multiple motion vector candidate lists; determining multiple prediction blocks for the current block by using the multiple motion vectors; and obtaining a final prediction block for the current block based on the multiple prediction blocks.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 21, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Chang LIM, Jung Won KANG, Ha Hyun LEE, Dong San JUN, Hyun Suk KO, Jin Ho LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
  • Patent number: 12140316
    Abstract: A home appliance is provided. The home appliance includes a main body having an opening, a door disposed on one side of the main body, the door being configured to open or close the opening, and a damping assembly configured to be operated by the door. The damping assembly includes a first lever installed in the main body, the first lever being configured to be movable when the door is pressed, a second lever connected to the first lever, and a cylinder connected to the second lever, the cylinder being configured to be movable in a direction that is parallel to a movement path of the first lever.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: November 12, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Wan Gi Park, Byoung Hak Kim, Yong Bin Lim, Jeong Hoon Kang, Dong Hyun Sohn, Ga Young Jo
  • Publication number: 20240368104
    Abstract: The present invention provides a compound of chemical formula 1, a compound of chemical formula 3, compound [212], compound [224], or compound [228], a pharmaceutically acceptable salt thereof, a stereoisomer thereof, a hydrate thereof, or a solvate thereof, and a pharmaceutical composition comprising same. The pharmaceutical composition has excellent antiviral efficacy, thereby having a preventive or treatment effect on viral infectious disease such as SARS-COV-2, and exhibits an inhibitory effect on IL-5 expression and thus has a preventive or treatment effect on respiratory disease or allergic disease.
    Type: Application
    Filed: March 30, 2022
    Publication date: November 7, 2024
    Applicant: DONG WHA PHARM. CO., LTD.
    Inventors: Jae Kyung LIM, Jung UK CHOI, Dong Hyuk SHIN, Yong Tae KIM, Seung Hwan KIM, Jung Hwan KIM, O Jin KWON, Jin Yong JUNG, Seo Hee JEONG, Yun Ha HWANG, Doc Gyun JEONG, Ji Hyun YOUM, Whui Jung PARK
  • Publication number: 20240373538
    Abstract: Provided is a radiation irradiation device and method in which radiation intensity can be adjusted depending on an irradiation position. The device includes a radiation source, a target plate having an irradiation hole through which radiation emitted from the radiation source passes and having a first target stopper and a second target stopper formed to protrude on both surfaces, respectively, X-axis shield plates and Y-axis shield plates coupled to both sides of one surface of the target plate and including shield stoppers formed on a contact surface with the target plate and capable of being moved with respect to the target plate. The X-axis shield plate are coupled laterally with shield stoppers capable of moving laterally and the Y-axis plate are coupled longitudinally with shield stoppers capable of moving longitudinally. The shield stoppers can be moved between two first target stoppers or two second target stoppers adjacent to each other.
    Type: Application
    Filed: August 22, 2022
    Publication date: November 7, 2024
    Applicant: NATIONAL CANCER CENTER
    Inventors: Dong Ho SHIN, Tae Hyun KIM, Hak Soo KIM, Se Byeong LEE, Young Kyung LIM, Jong Hwi JEONG
  • Publication number: 20240371614
    Abstract: Provided is a method for cleaning a substrate processing apparatus. The method includes loading a substrate into a chamber, injecting a gas containing at least one of Zn, Ga, In, or Sn into the chamber to deposit a thin film on the substrate, unloading the substrate to the outside of the chamber, injecting a cleaning gas containing Br into the chamber, and exhausting byproducts generated through a reaction between impurities deposited inside the chamber in addition to the substrate and the cleaning gas in the depositing of the thin film. Therefore, the inside of the apparatus may be cleaned at relatively low temperature. That is, impurities having the form of the thin film, which are deposited on a surface of a component or structure installed inside the apparatus may be delaminated from the surface.
    Type: Application
    Filed: September 20, 2022
    Publication date: November 7, 2024
    Inventors: Jeong HEO, Il Houng PARK, Won Ju OH, Dong Hwan LEE, Jun Seok LEE, Byung Gwan LIM, Seung Hyun CHO
  • Patent number: 12132915
    Abstract: The present invention relates to a method for encoding/decoding a video. To this end, the method for decoding a video may include: deriving a spatial merge candidate from at least one of spatial candidate blocks of a current block, deriving a temporal merge candidate from a co-located block of the current block, and generating a prediction block of the current block based on at least one of the derived spatial merge candidate and the derived temporal merge candidate, wherein a reference picture for the temporal merge candidate is selected based on a reference picture list of a current picture including the current block and a reference picture list of a co-located picture including the co-located block.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: October 29, 2024
    Assignee: LX Semicon Co., Ltd.
    Inventors: Dong San Jun, Ha Hyun Lee, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Jin Ho Lee, Seung Hyun Cho, Hui Yong Kim, Jin Soo Choi
  • Publication number: 20240357127
    Abstract: The present invention relates to a method for encoding/decoding a video. To this end, the method for decoding a video may include: deriving a spatial merge candidate from at least one of spatial candidate blocks of a current block, deriving a temporal merge candidate from a co-located block of the current block, and generating a prediction block of the current block based on at least one of the derived spatial merge candidate and the derived temporal merge candidate, wherein a reference picture for the temporal merge candidate is selected based on a reference picture list of a current picture including the current block and a reference picture list of a co-located picture including the co-located block.
    Type: Application
    Filed: March 22, 2024
    Publication date: October 24, 2024
    Inventors: Dong San JUN, Ha Hyun LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Jin Ho LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
  • Patent number: 12122267
    Abstract: The present disclosure provides a device for reclining a seatback for a vehicle, which may allow a separate actuator to be driven by a switching signal of a lever switch when a user operates the lever switch with only a small force such that a cable connected to a latch for locking or unlocking a recliner may be pulled in an unlock direction of the recliner, thereby implementing the reclining operation for adjusting an angle of the seatback in a semiautomatic manner.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: October 22, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Daedong Movel System Co. Ltd., Hyundai Transys Inc.
    Inventors: Hoon Bok Lee, Yo Han Kim, Deok Soo Lim, Chan Ho Jung, Yoon Gu Kim, Dong Hyun Kim, Jung Bin Lee
  • Publication number: 20240335678
    Abstract: The present invention relates to a conversion device for converting a treatment beam for treating a lesion of a subject, comprising: a collimator unit to which the treatment beam is incident and which has a plurality of slits; and a scattering unit that scatters the treatment beam that has passed through the collimator unit.
    Type: Application
    Filed: June 23, 2022
    Publication date: October 10, 2024
    Applicants: NATIONAL CANCER CENTER, RAPHARAD INC., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, SAMSUNG LIFE PUBLIC WELFARE FOUNDATION
    Inventors: Young Kyung LIM, Myeong Soo KIM, Kyeong Yun PARK, Do Hyeon KIM, Sang Soo KIM, Hak Soo KIM, Jong Hwi JEONG, Se Byeong LEE, Dong Ho SHIN, Joo Young KIM, Tae Hyun KIM, Seong Ho MOON, Yang-Gun SUH, Hojin KIM, Kwanghyun JO
  • Publication number: 20240340950
    Abstract: Disclosed are a method and device for bidirectional communication in a wireless LAN. The method of a first STA comprises the steps of: receiving, from an AP, a first frame including an information element indicating TXOP sharing; confirming a shared TXOP duration on the basis of the first frame; and communicating with a second STA within the shared TXOP duration.
    Type: Application
    Filed: August 11, 2022
    Publication date: October 10, 2024
    Inventors: Sung Hyun HWANG, Kyu Min KANG, Jae Cheol PARK, Jin Hyung OH, Dong Woo LIM, Su Na CHOI, Yong Ho KIM
  • Publication number: 20240340975
    Abstract: A method and apparatus for NSTR communication in a communication system supporting multiple links are disclosed. A method for a first device comprises the steps of: if a first backoff operation has succeeded on a first link belonging to a first pair of NSTR links on which an STR operation of a second device is not supported, transmitting a first data frame to the second device on the first link; performing a second backoff operation for transmission of a second data frame on a second link belonging to the first pair of NSTR links; if the second backoff operation has succeeded on the second link, identifying whether or not a transmission operation of the second device is performed on the first link belonging to the pair of NSTR links; and transmitting the second data frame to the second device on the second link.
    Type: Application
    Filed: July 19, 2022
    Publication date: October 10, 2024
    Inventors: Sung Hyun HWANG, Kyu Min KANG, Jae Cheol PARK, Jin Hyung OH, Dong Woo LIM, Su Na CHOI, Yong Ho KIM
  • Publication number: 20240332159
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: June 4, 2024
    Publication date: October 3, 2024
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20240334509
    Abstract: A method and a device for direct communication in a communication system supporting multiple links are disclosed. A method of an AP MLD comprises the steps of: transmitting a trigger frame in multiple links including a first link and a second link; receiving a response frame for the trigger frame from a first STA associated with an STA MLD in the first link; receiving a first data frame from a third STA in the second link; and when a subject to receive the first data frame is a second STA associated with the STA MLD, transmitting a second data frame generated on the basis of the first data frame, to the first STA in the first link.
    Type: Application
    Filed: July 12, 2022
    Publication date: October 3, 2024
    Inventors: Sung Hyun HWANG, Kyu Min KANG, Jae Cheol PARK, Jin Hyung OH, Dong Woo LIM, Su Na CHOI, Yong Ho KIM, Ju Seong MOON
  • Patent number: 12107035
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: October 1, 2024
    Assignee: Amkor Technology Singapore Holdings Pte. Ltd.
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Publication number: 20240323449
    Abstract: An image decoding is performed by steps including: determining whether or not to perform filtering on a boundary of a current block; determining a filtering strength on the boundary of the current block, and a number of samples used in filtering; and performing filtering on the boundary of the current block on the basis of the filtering strength and the number of samples used in filtering, where the number of samples used in filtering is determined on the basis of a size of the current block.
    Type: Application
    Filed: May 28, 2024
    Publication date: September 26, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, CHIPS&MEDIA, INC, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY
    Inventors: Sung Chang LIM, Jung Won KANG, Ha Hyun LEE, Jin Ho LEE, Hui Yong KIM, Dae Yeon KIM, Wook Je JEONG, Dong Jin PARK, Min Yong JEON, Yung Lyul LEE, Nam Uk KIM, Myung Jun KIM, Ji Youn JUNG, Jae Gon KIM
  • Publication number: 20240318309
    Abstract: Disclosed are a raw material supply method including vaporizing a raw material in a canister, discharging the vaporized raw material, measuring an inner temperature of the canister, calculating a calculated temperature by using the inner temperature, and compensating a variation of the inner temperature by heating a heating unit disposed on the canister at the calculated temperature and a raw material supply apparatus applied to the method for supplying the raw material. The raw material supply method and apparatus may stably supply the vaporized raw material to a process space.
    Type: Application
    Filed: June 28, 2022
    Publication date: September 26, 2024
    Inventors: Byung Gwan LIM, Sang Kyo KWON, Yong Hyun KIM, Jin Hyun KIM, Hong Eun KIM, Il Houng PARK, Chang Kyun PARK, In Woo BACK, Won Ju OH, Dong Hwan LEE, Yong Hyun LEE, Jun Seok LEE, Seung Hyun CHO, Jeong HEO
  • Patent number: 12095999
    Abstract: The present invention relates to a method of performing motion compensation by using motion vector prediction. To this end, a method of decoding an image may include: generating multiple motion vector candidate lists according to an inter-prediction direction of a current block; deriving multiple motion vectors for the current block by using the multiple motion vector candidate lists; determining multiple prediction blocks for the current block by using the multiple motion vectors; and obtaining a final prediction block for the current block based on the multiple prediction blocks.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: September 17, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sung Chang Lim, Jung Won Kang, Ha Hyun Lee, Dong San Jun, Hyun Suk Ko, Jin Ho Lee, Seung Hyun Cho, Hui Yong Kim, Jin Soo Choi
  • Patent number: 12092907
    Abstract: A transmittance-variable device is provided in the present application. The present application provides a transmittance-variable device, which can be applied to various applications without causing problems such as a crosstalk phenomenon, a rainbow phenomenon or a mirroring phenomenon, while having excellent transmittance-variable characteristics.
    Type: Grant
    Filed: March 9, 2023
    Date of Patent: September 17, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Eun Jung Lim, Sergey Belyaev, Min Jun Gim, Dong Hyun Oh, Jung Sun You, Nam Gyu Kim, Jin Hong Kim, Hyun Jun Lee