Abstract: An image processing method of the present disclosure may include receiving a scanned image, and processing the received image through an octave convolution-based neural network to output a high-quality image and an edge image for the received image. The octave convolution-based neural network may include a plurality of octave encoder blocks and a plurality of octave decoder blocks. Each octave encoder block may include an octave convolutional layer, and may be configured to output a high-frequency feature map and a low-frequency feature map for the image.

Abstract: A display device includes a first conducive layer including a first and second wiring, a semiconductor layer on the first conductive layer and including a first to third semiconductor part, a gate insulating layer on the semiconductor layer, and a second conductive layer on the gate insulating layer and including a gate electrode overlapping the first semiconductor part, a first connecting electrode overlapping the second semiconductor part, and a second connecting electrode overlapping the third semiconductor part. The first and second connecting electrodes are directly connected to the second and third semiconductor parts, respectively. The second and third semiconductor parts include semiconductor openings. The first connecting electrode includes a (1-1)-th and (1-2)-th connecting electrodes.

Abstract: A display device includes: a first substrate having a first area; a second substrate having a second area larger than the first area and positioned above the first substrate; interconnects on the first substrate; connection pads on a side surface of the first substrate and electrically connected to the interconnects; and a first cover member on the side surface of the first substrate, wherein a side surface of the second substrate protrudes from the side surface of the first substrate in a first direction, and the first cover member is located under the second substrate.

Abstract: A display device includes: a first substrate having a first area; a second substrate having a second area larger than the first area and positioned above the first substrate; interconnects on the first substrate; connection pads on a side surface of the first substrate and electrically connected to the interconnects; and a first cover member on the side surface of the first substrate, wherein a side surface of the second substrate protrudes from the side surface of the first substrate in a first direction, and the first cover member is located under the second substrate.