Abstract: A semiconductor device includes a substrate, a bit line conductive layer extending in a lateral direction substantially parallel to a surface of the substrate, a first insulation line structure extending in a second direction that is perpendicular to the first lateral direction and that is substantially parallel to the surface of the substrate, first and second channel structures that are disposed to respectively contact first and second sides of the first insulation line structure and that partially overlap with the bit line conductive layer, first and second gate dielectric layers respectively disposed over the substrate and on side surfaces of the first and second channel structures, and first and second gate line conductive layers extending in the second lateral direction over the substrate and covering at least a portion of each of the first and second gate dielectric layers, respectively.

Abstract: A semiconductor device includes a substrate, a bit line conductive layer disposed on the substrate and extending in a first lateral direction substantially parallel to a surface of the substrate, first and second channel structures disposed on the bit line conductive layer to be spaced apart from each other in the first lateral direction, first and second gate dielectric layers disposed on side surfaces of the first and second channel structures over the substrate, first and second gate line conductive layers disposed on the first and second gate dielectric layers, respectively, the first and second gate line conductive layers common to the first and second channel structures, respectively, and extending in a second lateral direction perpendicular to the first lateral direction and substantially parallel to the surface of the substrate, and first and second storage node electrode layers disposed over the first and second channel structures, respectively.

Abstract: A semiconductor device according to an embodiment includes a first electrode and a second electrode that are spaced apart from each other, a capacitor dielectric structure disposed between the first electrode and the second electrode, and a barrier dielectric layer disposed between one of the first and second electrodes and the capacitor dielectric structure. The capacitor dielectric structure may include a ferroelectric layer and a dielectric layer. The barrier dielectric layer may include a ferroelectric material.

Abstract: A semiconductor device according to an embodiment includes a first electrode and a second electrode that are spaced apart from each other, and a dielectric structure disposed between the first electrode and the second electrode. The dielectric structure includes a barrier dielectric layer and a capacitor dielectric layer that are connected in series to each other. The barrier dielectric layer includes a ferroelectric material, and the capacitor dielectric layer includes a non-ferroelectric material.

Abstract: A semiconductor device according to an embodiment includes a substrate, a bit line structure and a source line structure respectively extending in a direction perpendicular to a surface of the substrate, a semiconductor layer disposed between the bit line structure and the source line structure on a plane parallel to the surface of the substrate, a first ferroelectric layer disposed on a first surface of the semiconductor layer, and a first gate electrode layer disposed on the first ferroelectric layer.

Abstract: A semiconductor device includes a first electrode, a ferroelectric layer disposed on the first electrode, a dielectric layer disposed on the ferroelectric layer, charge trap sites disposed in an inner region of the dielectric layer, and a second electrode disposed on the dielectric layer. The dielectric layer may have a non-ferroelectric property. The dielectric layer and the ferroelectric layer are disposed between the first electrode and the second electrode and connected in series to each other. The semiconductor device may include charge trap sites distributed in an inner region of the dielectric layer having a non-ferroelectric property.

Abstract: A semiconductor device may include: a first electrode; a second electrode; and a multilayer stack that is interposed between the first electrode and the second electrode and includes a seed layer and a high-k dielectric layer, wherein each of the seed layer and the high-k dielectric layer may have a rocksalt crystal structure, and wherein the high-k dielectric layer may exhibit a dielectric constant (k) of fifty (50) or higher.

Abstract: A semiconductor device according to an embodiment of the present disclosure includes a substrate, a first epitaxial electrode layer disposed on the substrate, a ferroelectric epitaxial layer disposed on the first epitaxial electrode layer, a dielectric epitaxial layer disposed on the ferroelectric epitaxial layer, and a second epitaxial electrode layer disposed on the dielectric epitaxial layer. The ferroelectric epitaxial layer implements a negative capacitance. Each of the first and second epitaxial electrode layers includes conductive pyrochlore oxide. The ferroelectric epitaxial layer and the dielectric epitaxial layer are electrically connected in series is non-ferroelectric. A dielectric structure comprising the ferroelectric epitaxial layer and the dielectric epitaxial layer is non-ferroelectric.

Abstract: A semiconductor device includes a first electrode, a ferroelectric layer disposed on the first electrode and implementing a negative capacitance, a dielectric structure disposed on the ferroelectric layer and including a first dielectric layer and a second dielectric layer that are alternately stacked, and a second electrode disposed on the dielectric structure. The ferroelectric layer and the dielectric structure are configured to be electrically connected in series to each other. The ferroelectric layer and dielectric structure together have a non-ferroelectric property.

Abstract: A semiconductor device according to an embodiment includes a substrate, a bit line structure and a source line structure respectively extending in a direction perpendicular to a surface of the substrate, a semiconductor layer disposed between the bit line structure and the source line structure on a plane parallel to the surface of the substrate, a first ferroelectric layer disposed on a first surface of the semiconductor layer, and a first gate electrode layer disposed on the first ferroelectric layer.

Abstract: A semiconductor device includes a substrate, a bit line conductive layer disposed on the substrate and extending in a first lateral direction substantially parallel to a surface of the substrate, first and second channel structures disposed on the bit line conductive layer to be spaced apart from each other in the first lateral direction, first and second gate dielectric layers disposed on side surfaces of the first and second channel structures over the substrate, first and second gate line conductive layers disposed on the first and second gate dielectric layers, respectively, the first and second gate line conductive layers common to the first and second channel structures, respectively, and extending in a second lateral direction perpendicular to the first lateral direction and substantially parallel to the surface of the substrate, and first and second storage node electrode layers disposed over the first and second channel structures, respectively.

Abstract: A semiconductor device may include: a first electrode; a second electrode; and a multilayer stack that is interposed between the first electrode and the second electrode and includes a seed layer and a high-k dielectric layer, wherein each of the seed layer and the high-k dielectric layer may have a rocksalt crystal structure, and wherein the high-k dielectric layer may exhibit a dielectric constant (k) of fifty (50) or higher.