Patents by Inventor Dong-Ik Yang

Dong-Ik Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10228849
    Abstract: An electronic device is provided. The electronic device includes at least one display, a memory configured to store an application and a database including information on a plurality of controllers, and a processor, wherein the processor is configured to display a content including at least one object in relation to an execution of the application in a first area of the display, determine a controller corresponding to the application based on the database, and output the determined controller to a second area of the display.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: March 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byeong Kuk Keam, Dong Kyung Kim, Dong Ik Yang
  • Publication number: 20160313912
    Abstract: An electronic device is provided. The electronic device includes at least one display, a memory configured to store an application and a database including information on a plurality of controllers, and a processor, wherein the processor is configured to display a content including at least one object in relation to an execution of the application in a first area of the display, determine a controller corresponding to the application based on the database, and output the determined controller to a second area of the display.
    Type: Application
    Filed: April 20, 2016
    Publication date: October 27, 2016
    Inventors: Byeong Kuk KEAM, Dong Kyung KIM, Dong Ik YANG
  • Publication number: 20110135113
    Abstract: An apparatus and method for increasing an audio volume in a portable terminal are provided. The apparatus includes a sound booster for increasing a volume of a final audio signal comprising at least one sound source data to be output through an audio hardware, and a speaker for converting audio data having a volume increased by the sound booster into a sound signal to play the converted sound signal.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Ra-Mi JUNG, Sung-Cheol KIM, Nam-Il LEE, Dong-Ik YANG, Chi-Hyun CHO
  • Patent number: 7766212
    Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 3, 2010
    Assignee: W.C. Heraeus GmbH
    Inventors: Dong-Ik Yang, Eun-Kyun Chung, Joong-Geun Shin, Nam-Kwon Cho
  • Publication number: 20090072063
    Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 19, 2009
    Applicant: W.C. HERAEUS GMBH
    Inventors: Dong-Ik YANG, Eun-Kyun CHUNG, Joong-Geun SHIN, Nam-Kwon CHO