Patents by Inventor Dongil Kwon

Dongil Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for determining residual stress, method for determining residual stress data using it, residual stress determining method using it and recording medium thereof
    Patent number: 6851300
    Abstract: Disclosed herein is an apparatus for measuring residual stress, methods of measuring residual stress data and residual stress using the apparatus, and a recording medium for storing software of the residual stress measuring method. The present invention is advantageous for evaluation of a mechanical material property and is non-destructive. Further, the present invention is widely applied to fields ranging from a microscopic area, such as a thin film or micro device, to a large-sized structure, and is not influenced by a microstructure by controlling the range of an applied load. Further, the measuring apparatus of the present invention is minimized in its volume to be easily attached to an actual structure. Further, in the present invention, various attaching devices are employed, thus enabling the apparatus to be attached to various materials regardless of the size and type of object materials to measure residual stress.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: February 8, 2005
    Assignee: Frontics Inc.
    Inventors: Dongil Kwon, Yunhee Lee, Dongil Son
  • Apparatus for determining residual stress, method for determining residual stress data using it, residual stress determining method using it and recording medium thereof
    Publication number: 20030217591
    Abstract: Disclosed herein is an apparatus for measuring residual stress, methods of measuring residual stress data and residual stress using the apparatus, and a recording medium for storing software of the residual stress measuring method. The present invention is advantageous for evaluation of a mechanical material property and is non-destructive. Further, the present invention is widely applied to fields ranging from a microscopic area, such as a thin film or micro device, to a large-sized structure, and is not influenced by a microstructure by controlling the range of an applied load. Further, the measuring apparatus of the present invention is minimized in its volume to be easily attached to an actual structure. Further, in the present invention, various attaching devices are employed, thus enabling the apparatus to be attached to various materials regardless of the size and type of object materials to measure residual stress.
    Type: Application
    Filed: April 1, 2003
    Publication date: November 27, 2003
    Inventors: Dongil Kwon, Yunhee Lee, Dongil Son