Patents by Inventor Dong Jean Kim

Dong Jean Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing a semiconductor device
    Patent number: 11094645
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 17, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20190371739
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 7, 2019
    Publication date: December 5, 2019
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Semiconductor device and method of manufacturing a semiconductor device
    Patent number: 10381313
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 13, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20190189566
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 20, 2018
    Publication date: June 20, 2019
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Semiconductor device and method of manufacturing a semiconductor device
    Patent number: 10134687
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: November 20, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Semiconductor package and fabricating method thereof
    Patent number: 10037949
    Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 31, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeoung Beom Ko, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim