Patents by Inventor Dong-Jie KE

Dong-Jie KE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096710
    Abstract: An integrated circuit device is provided. The integrated circuit device includes a semiconductor substrate, first and second semiconductor fins over the semiconductor substrate, and first and second epitaxy structures respectively on the first and second semiconductor fins. The first epitaxy structure is merged with the second epitaxy structure, and a bottom surface of the second epitaxy structure is lower than a bottom surface of the first epitaxy structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Hsien TU, Dong-Jie KE
  • Patent number: 11862519
    Abstract: A method for manufacturing an integrated circuit device is provided. The method includes forming first, second, and third semiconductor fins over a semiconductor substrate, in which the second semiconductor fin is between the first and third semiconductor fins; forming first and second fin sidewall spacers respectively on a sidewall of a first portion of the first semiconductor fin and a sidewall of a first portion of the second semiconductor fin, wherein the first and second fin sidewall spacers are between the first and second semiconductor fins; recessing the first portions of the first and second semiconductor fins and a first portion of the third semiconductor fin; and forming first to third epitaxial features respectively on the recessed portions of the first to third semiconductor fins, wherein the second epitaxial feature is spaced apart from the first epitaxial feature and merged with the third epitaxial feature.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: January 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Hsien Tu, Dong-Jie Ke
  • Publication number: 20230068725
    Abstract: A method for manufacturing an integrated circuit device is provided. The method includes forming first, second, and third semiconductor fins over a semiconductor substrate, in which the second semiconductor fin is between the first and third semiconductor fins; forming first and second fin sidewall spacers respectively on a sidewall of a first portion of the first semiconductor fin and a sidewall of a first portion of the second semiconductor fin, wherein the first and second fin sidewall spacers are between the first and second semiconductor fins; recessing the first portions of the first and second semiconductor fins and a first portion of the third semiconductor fin; and forming first to third epitaxial features respectively on the recessed portions of the first to third semiconductor fins, wherein the second epitaxial feature is spaced apart from the first epitaxial feature and merged with the third epitaxial feature.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Hsien TU, Dong-Jie KE