Patents by Inventor Dong-Jin Jeong
Dong-Jin Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12278039Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.Type: GrantFiled: December 19, 2022Date of Patent: April 15, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 12062476Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: GrantFiled: March 10, 2023Date of Patent: August 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Publication number: 20230215610Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: ApplicationFiled: March 10, 2023Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin JEONG
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Publication number: 20230118574Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.Type: ApplicationFiled: December 19, 2022Publication date: April 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin JEONG
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Patent number: 11626233Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: GrantFiled: August 13, 2020Date of Patent: April 11, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 11562848Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.Type: GrantFiled: July 7, 2020Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 11469030Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: GrantFiled: December 30, 2019Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 11378721Abstract: A display device includes: a display panel including a substrate, and an organic light emitting element; an ultraviolet ray blocking part on a rear surface of the substrate of the display panel; a rear protection layer on a rear surface of the ultraviolet ray blocking part, and having an opening; and a sensor in the opening of the rear protection layer. The ultraviolet ray blocking part includes polyester.Type: GrantFiled: August 27, 2019Date of Patent: July 5, 2022Assignee: Samsung Display Co., Ltd.Inventors: Ye Won Cho, Dong Eun Lee, Dong Jin Jeong
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Publication number: 20210181383Abstract: A display device includes: a display panel including a substrate, and an organic light emitting element; an ultraviolet ray blocking part on a rear surface of the substrate of the display panel; a rear protection layer on a rear surface of the ultraviolet ray blocking part, and having an opening; and a sensor in the opening of the rear protection layer. The ultraviolet ray blocking part includes polyester.Type: ApplicationFiled: August 27, 2019Publication date: June 17, 2021Inventors: Ye Won CHO, Dong Eun LEE, Dong Jin JEONG
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Patent number: 10923264Abstract: An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. A thickness of each of the lead parts is formed to be thinner than a thickness of each of the internal coil parts.Type: GrantFiled: October 25, 2018Date of Patent: February 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Jeong, Jae Yeol Choi
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Patent number: 10910145Abstract: There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a?15 ?m and b/a?7 are satisfied.Type: GrantFiled: November 7, 2019Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Publication number: 20200373055Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: ApplicationFiled: August 13, 2020Publication date: November 26, 2020Inventor: Dong Jin JEONG
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Publication number: 20200335260Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.Type: ApplicationFiled: July 7, 2020Publication date: October 22, 2020Inventor: Dong Jin JEONG
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Patent number: 10804021Abstract: A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.Type: GrantFiled: April 11, 2019Date of Patent: October 13, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 10734155Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.Type: GrantFiled: April 17, 2018Date of Patent: August 4, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Publication number: 20200135376Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: ApplicationFiled: December 30, 2019Publication date: April 30, 2020Inventor: Dong Jin JEONG
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Patent number: 10607769Abstract: An electronic component includes a magnetic body, and first and second internal coil parts embedded in the magnetic body spaced apart from each other and including coil conductors disposed on first and second surfaces of a support member. First and second spacer parts are disposed between the first and second internal coil parts in upper and lower portions of the magnetic body, respectively, with an interval therebetween.Type: GrantFiled: October 5, 2018Date of Patent: March 31, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Publication number: 20200075228Abstract: There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a?15 ?m and b/a?7 are satisfied.Type: ApplicationFiled: November 7, 2019Publication date: March 5, 2020Inventor: Dong Jin JEONG
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Patent number: 10580563Abstract: A coil component includes: a coil part; and a body formed around the coil part and containing a magnetic material. The body contains a first magnetic powder particle having a first insulating film formed on a surface thereof, and a second magnetic powder particle having a second insulating film formed on a surface thereof, and an average thickness of the first insulating film is thicker than that of the second insulating film.Type: GrantFiled: June 15, 2016Date of Patent: March 3, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong
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Patent number: 10553338Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.Type: GrantFiled: December 6, 2018Date of Patent: February 4, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Dong Jin Jeong