Patents by Inventor Dong-Jin Jeong

Dong-Jin Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12278039
    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: April 15, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 12062476
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: August 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Publication number: 20230215610
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Application
    Filed: March 10, 2023
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin JEONG
  • Publication number: 20230118574
    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 20, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin JEONG
  • Patent number: 11626233
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: April 11, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 11562848
    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 11469030
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 11378721
    Abstract: A display device includes: a display panel including a substrate, and an organic light emitting element; an ultraviolet ray blocking part on a rear surface of the substrate of the display panel; a rear protection layer on a rear surface of the ultraviolet ray blocking part, and having an opening; and a sensor in the opening of the rear protection layer. The ultraviolet ray blocking part includes polyester.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 5, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ye Won Cho, Dong Eun Lee, Dong Jin Jeong
  • Publication number: 20210181383
    Abstract: A display device includes: a display panel including a substrate, and an organic light emitting element; an ultraviolet ray blocking part on a rear surface of the substrate of the display panel; a rear protection layer on a rear surface of the ultraviolet ray blocking part, and having an opening; and a sensor in the opening of the rear protection layer. The ultraviolet ray blocking part includes polyester.
    Type: Application
    Filed: August 27, 2019
    Publication date: June 17, 2021
    Inventors: Ye Won CHO, Dong Eun LEE, Dong Jin JEONG
  • Patent number: 10923264
    Abstract: An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. A thickness of each of the lead parts is formed to be thinner than a thickness of each of the internal coil parts.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Jae Yeol Choi
  • Patent number: 10910145
    Abstract: There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a?15 ?m and b/a?7 are satisfied.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: February 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Publication number: 20200373055
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Inventor: Dong Jin JEONG
  • Publication number: 20200335260
    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.
    Type: Application
    Filed: July 7, 2020
    Publication date: October 22, 2020
    Inventor: Dong Jin JEONG
  • Patent number: 10804021
    Abstract: A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10734155
    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 ?m thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 ?m to 50 ?m. Further, the second insulator may extend to a thickness 1 ?m to 20 ?m larger than that of the first insulator on the insulating substrate.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Publication number: 20200135376
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Inventor: Dong Jin JEONG
  • Patent number: 10607769
    Abstract: An electronic component includes a magnetic body, and first and second internal coil parts embedded in the magnetic body spaced apart from each other and including coil conductors disposed on first and second surfaces of a support member. First and second spacer parts are disposed between the first and second internal coil parts in upper and lower portions of the magnetic body, respectively, with an interval therebetween.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Publication number: 20200075228
    Abstract: There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a?15 ?m and b/a?7 are satisfied.
    Type: Application
    Filed: November 7, 2019
    Publication date: March 5, 2020
    Inventor: Dong Jin JEONG
  • Patent number: 10580563
    Abstract: A coil component includes: a coil part; and a body formed around the coil part and containing a magnetic material. The body contains a first magnetic powder particle having a first insulating film formed on a surface thereof, and a second magnetic powder particle having a second insulating film formed on a surface thereof, and an average thickness of the first insulating film is thicker than that of the second insulating film.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10553338
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: February 4, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong