Patents by Inventor Dong-Jin Lim

Dong-Jin Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240383305
    Abstract: A stabilizer bar link includes a hollow rod, an insert part mounted inside the rod, and a socket into which the rod is inserted and mounted, the socket having an outer surface coupled to the rod.
    Type: Application
    Filed: January 5, 2024
    Publication date: November 21, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Dong Jin LIM, Won Kil MOON
  • Patent number: 12037473
    Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: July 16, 2024
    Assignee: SK MICROWORKS CO., LTD.
    Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim, Kyungeun Oh
  • Patent number: 11970613
    Abstract: Embodiments relate to a polymer film. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has a haze (HZ0) before autoclave treatment of 3% or less and a ?HZ24 represented by Equation 1a of 500% or less.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 30, 2024
    Assignee: SK MICROWORKS CO., LTD.
    Inventors: Jung Hee Ki, Sunhwan Kim, Sang Hun Choi, Dae Seong Oh, Han Jun Kim, Jin Woo Lee, Dong Jin Lim
  • Patent number: 11873372
    Abstract: Embodiments relate to a polyamide-imide film that maintains its mechanical properties at least at a certain level under the conditions of high temperatures and low temperatures and is excellent in transparency and folding characteristics, a process for preparing the same, and a cover window comprising the same. The polyamide-imide film comprises a polyamide-imide polymer and has an MOR value defined in Equation 1a of 75% or more.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: January 16, 2024
    Assignee: SK MICROWORKS CO., LTD.
    Inventors: Han Jun Kim, Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Sang Hun Choi, Jung Hee Ki, Dong Jin Lim
  • Patent number: 11813626
    Abstract: Provided is an elastic member according to an embodiment. The elastic member includes an upper support, a lower support provided under the upper support, and at least one elastic part configured to connect the upper support to the lower support, wherein the elastic part includes an upper support portion formed downward from the upper support, a lower support portion configured to extend upwardly from the lower support, and a connecting portion configured to connect the upper support portion to the lower support portion with a predetermined inclination and to be bent and deformed when the elastic member is pressed.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: November 14, 2023
    Assignee: YONWOO CO., LTD.
    Inventors: Chul Ki Kim, Seong Ho Kim, Dong Jin Lim
  • Publication number: 20230329422
    Abstract: A cosmetic packaging comprising a single-use sachet for containing a cosmetic formulation. The single-use sachet comprises an enclosed section and an openable slit. The cosmetic formulation is contained within the enclosed section, only being able to escape the enclosed section once the openable slit is opened. The cosmetic packaging further comprises an application sheet and an outer pouch. The outer pouch comprises and openable end, surface walls, and an interior area. The single-use sachet and the application sheet are disposed within the outer pouch, allowing the cosmetic formulation to be applied to the application sheet immediately before removing the application sheet from the outer pouch.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 19, 2023
    Inventor: Dong-Jin Lim
  • Patent number: 11780965
    Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: October 10, 2023
    Assignee: SK microworks Co., Ltd.
    Inventors: Dawoo Jeong, Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Dong Jin Lim
  • Patent number: 11702519
    Abstract: An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4?X/Y?12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: July 18, 2023
    Assignee: SKC microworks CO., LTD.
    Inventors: Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dae Seong Oh, Dong Jin Lim
  • Patent number: 11559923
    Abstract: One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: January 24, 2023
    Assignee: SKC CO., LTD.
    Inventors: Jin Woo Lee, Dae Seong Oh, Dawoo Jeong, Dong Jin Lim, Cheol Ho Kim
  • Publication number: 20230001436
    Abstract: Provided is an elastic member according to an embodiment. The elastic member includes an upper support, a lower support provided under the upper support, and at least one elastic part configured to connect the upper support to the lower support, wherein the elastic part includes an upper support portion formed downward from the upper support, a lower support portion configured to extend upwardly from the lower support, and a connecting portion configured to connect the upper support portion to the lower support portion with a predetermined inclination and to be bent and deformed when the elastic member is pressed.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 5, 2023
    Inventors: Chul Ki KIM, Seong Ho KIM, Dong Jin LIM
  • Publication number: 20220387304
    Abstract: Disclosed herein are bilayered substrates useful for treating infection and/or inflammation in a subject such as, for example, the upper respiratory system. In another aspect, the layers of the substrates disclosed herein include biocompatible and biodegradable polymers as well as one or more bioactive agents useful for treating infection and/or inflammation. In a further aspect, the layers of the substrate can contain nanoparticles incorporating the bioactive agents. In any one of the above aspects, the bioactive agents are released at a constant rate over a period of time. In still another aspect, the substrates disclosed herein are useful for reducing the mass of biofilms and reducing or preventing inflammation by inhibiting the production of interleukin-8.
    Type: Application
    Filed: October 2, 2020
    Publication date: December 8, 2022
    Inventors: Do-Yeon CHO, Dong Jin LIM, Bradford A. WOODWORTH
  • Publication number: 20220356317
    Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.
    Type: Application
    Filed: July 12, 2022
    Publication date: November 10, 2022
    Inventors: Dae Seong OH, Dawoo JEONG, Sunhwan KIM, Jin Woo LEE, Dong Jin LIM, Kyungeun OH
  • Patent number: 11434335
    Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: September 6, 2022
    Assignee: SKC CO., LTD.
    Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim, Kyungeun Oh
  • Patent number: 11433573
    Abstract: An embodiment can provide a method for producing a polyamide-imide film which is colorless and transparent and has excellent mechanical properties, the method comprising: a step of producing a polyamide-imide polymer solution by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound; a step of producing a gel sheet by extruding, casting and drying the polymer solution; and a step of producing a polyamide-imide film by heat-treating the gel sheet, wherein the viscosity of the polymer solution is 100,000 to 500,000 cps, and the polyamide-imide film has a yellowness index of 5 or lower, a haze of 2% or lower, a transmittance of 85% or above and a modulus of 5.0 GPa or above, at a thickness of 20 ?m to 75 ?m.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: September 6, 2022
    Assignee: SKC CO., LTD.
    Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim, Cheol Ho Kim
  • Patent number: 11365287
    Abstract: Embodiments relate to a process for preparing a poly(amide-imide) film and a poly(amide-imide) film prepared thereby. The process is capable of preparing a poly(amide-imide) film that is excellent in optical properties and mechanical properties.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 21, 2022
    Assignee: SKC CO., LTD.
    Inventors: Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Dawoo Jeong, Dong Jin Lim, Kyung Won Choi
  • Publication number: 20220162388
    Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.
    Type: Application
    Filed: February 8, 2022
    Publication date: May 26, 2022
    Inventors: Dawoo JEONG, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Dong Jin LIM
  • Patent number: 11339250
    Abstract: Embodiments provide a polyamide-imide polymer film, which comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound; and silica particles, wherein the number of aggregates having an average diameter of 150 to 200 nm observed in a cross-section cut in the thickness direction of the polyamide-imide film is less than 0.5/?m2, and a process for preparing the same.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: May 24, 2022
    Assignee: SKC CO., LTD.
    Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim
  • Patent number: 11326030
    Abstract: Disclosed herein are a polyamide-imide film which is transparent and exhibits superior mechanical properties such as surface hardness, etc. and a method of preparing the same. The polyamide-imide film a copolymer of an aromatic diamine, an aromatic dianhydride, and an aromatic dicarbonyl compound, wherein the aromatic diamine and the aromatic dianhydride forms an imide unit; the aromatic diamine and the aromatic dicarbonyl compound forms an amide unit; and the amide unit accounts for 50-70 mol % of 100 mol % of the units of the copolymer, thereby exhibiting transparency and superior mechanical properties including surface hardness.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: May 10, 2022
    Assignee: SKC CO., LTD.
    Inventors: Jin Woo Lee, Dong Jin Lim, Jae In Ahn, Jong Ho Lee, Sang Il Kim, Sun Hwan Kim, Dae Sung Oh, Dawoo Jeong
  • Patent number: 11267942
    Abstract: One embodiment may provide a polyamide-imide film which is colorless and transparent while having an adequate level of solubility and excellent mechanical properties, the polyamide-imide film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, for a square cross-section of 1 cm×1 cm and a thickness of 30 um to 100 mm, the polyamide-imide film has a dissolution time of 5-60 minutes in 10 ml of dimethylacetamide (DMAc), and for a thickness of 50 mm, the polyamide-imide film has a yellowness of at most 5, a haze of at most 2%, a permeability of at least 85% and a modulus of at least 5.0 GPa.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 8, 2022
    Assignee: SKC CO., LTD.
    Inventors: Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Dawoo Jeong, Dong Jin Lim
  • Patent number: D937904
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: December 7, 2021
    Assignee: YONWOO CO., LTD
    Inventors: Chui Ki Kim, Seong Ho Kim, Dong Jin Lim