Patents by Inventor Dong-Jin Lim
Dong-Jin Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154252Abstract: A secondary battery includes a cylindrical case; an electrode assembly accommodated in the case and including a first electrode plate, a second electrode plate, and a separator, the electrode assembly being wound such that the first electrode plate is arranged at an outermost side and is in contact with the case; a cap assembly coupled to the case and electrically connected to the second electrode plate; and a first swelling tape attached to an inner surface of the first electrode plate in a state in which the electrode assembly is wound, the first swelling tape having a multi-layer structure. The swelling tape may be applied to a base material finishing portion of the electrode assembly to improve quality distribution of the base material finishing structure due to long-diameter distribution. In addition, a swelling effect may be improved through the multi-layer swelling tape.Type: ApplicationFiled: October 4, 2023Publication date: May 9, 2024Inventors: Geon Kyu SUNG, Hyun Ki JUNG, Dae Kyu KIM, Ho Jae LEE, Dong Jin AN, Byoung Hwi LIM
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Publication number: 20240121963Abstract: A semiconductor memory device includes: a substrate including a first region and a second region, the first region includes a peripheral circuit and a first active region (FAR), and the second region includes memory cell blocks. The FAR includes a FAR first extension extending in a first direction, a FAR second extension extending in a second direction, and a FAR third extension extending in a third direction. The FAR first extension, the FAR second extension, and the FAR third extension form an angle greater than 90 degrees relative to one another. The device includes a first pass transistor circuit configured to transmit driving signals, and the first pass transistor circuit includes a FAR first gate structure on the FAR first extension, a FAR second gate structure on the FAR second extension, a FAR third gate structure on the FAR third extension, and a first shared source/drain.Type: ApplicationFiled: September 26, 2023Publication date: April 11, 2024Inventors: So Hyun Lee, Kang-Oh Yun, Dong Jin Lee, Jun Hee Lim
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Patent number: 11944580Abstract: A wearable walking assist robot is provided that ensures high walking assistance performance without a complex calculation process by detecting a gait phase based on pressure distribution on feet and performing a corresponding control mode that is set in advance. The wearable walking assist robot includes a sensor unit that senses pressure on the soles of the feet of a wearer and a controller that determines gait phases of both a first leg to be operated and a second leg based on the sensed pressure. Additionally, the controller selects one of a plurality of control modes set in advance based on the determined gait phases and operates a joint-driving unit for the first leg to be operated.Type: GrantFiled: August 3, 2020Date of Patent: April 2, 2024Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Dong Jin Hyun, Kyung Mo Jung, Sang In Park, Hyun Seop Lim
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Publication number: 20240100719Abstract: A gripper includes a body part, a finger base part coupled to the body part, and a finger part coupled to a first side of the body part or the finger base part and coupled to the body part or the finger base part to be reciprocal, wherein the finger part comprises a first link structure and a second link structure, sides of which are coupled to the finger base part, respectively, and wherein, in the first link structure and the second link structure, a first support area of the first link structure and a second support area of the second link structure reciprocate in only one of a plurality of directions that cross a direction in which the finger part reciprocates with respect to the finger base part.Type: ApplicationFiled: February 6, 2023Publication date: March 28, 2024Inventors: Beom Su Kim, Hyun Seop Lim, Ju Young Yoon, Kyu Jung Kim, Hyo Joong Kim, Seong Taek Hwang, Ho Jun Kim, Dong Jin Hyun, Min Woong Jeung
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Publication number: 20240100690Abstract: A gripper includes a body part, a finger base part coupled to the body part to be rotatable, the finger base part including a first finger base part and a second finger base part configured such that when the first finger base part is rotated in a first direction with respect to the body part, the second finger base part is provided to be rotatable in a second direction opposite the first direction with respect to the body part, and a finger part coupled to a first side of the body part or the finger base part to be reciprocal.Type: ApplicationFiled: February 6, 2023Publication date: March 28, 2024Inventors: Beom Su Kim, Hyun Seop Lim, Ju Young Yoon, Kyu Jung Kim, Hyo-Joong Kim, Seong Taek Hwang, Ho Jun Kim, Dong Jin Hyun, Min Woong Jeung
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Publication number: 20240075853Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.Type: ApplicationFiled: April 13, 2023Publication date: March 7, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
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Patent number: 11873372Abstract: Embodiments relate to a polyamide-imide film that maintains its mechanical properties at least at a certain level under the conditions of high temperatures and low temperatures and is excellent in transparency and folding characteristics, a process for preparing the same, and a cover window comprising the same. The polyamide-imide film comprises a polyamide-imide polymer and has an MOR value defined in Equation 1a of 75% or more.Type: GrantFiled: June 26, 2020Date of Patent: January 16, 2024Assignee: SK MICROWORKS CO., LTD.Inventors: Han Jun Kim, Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Sang Hun Choi, Jung Hee Ki, Dong Jin Lim
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Patent number: 11813626Abstract: Provided is an elastic member according to an embodiment. The elastic member includes an upper support, a lower support provided under the upper support, and at least one elastic part configured to connect the upper support to the lower support, wherein the elastic part includes an upper support portion formed downward from the upper support, a lower support portion configured to extend upwardly from the lower support, and a connecting portion configured to connect the upper support portion to the lower support portion with a predetermined inclination and to be bent and deformed when the elastic member is pressed.Type: GrantFiled: September 24, 2020Date of Patent: November 14, 2023Assignee: YONWOO CO., LTD.Inventors: Chul Ki Kim, Seong Ho Kim, Dong Jin Lim
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Publication number: 20230329422Abstract: A cosmetic packaging comprising a single-use sachet for containing a cosmetic formulation. The single-use sachet comprises an enclosed section and an openable slit. The cosmetic formulation is contained within the enclosed section, only being able to escape the enclosed section once the openable slit is opened. The cosmetic packaging further comprises an application sheet and an outer pouch. The outer pouch comprises and openable end, surface walls, and an interior area. The single-use sachet and the application sheet are disposed within the outer pouch, allowing the cosmetic formulation to be applied to the application sheet immediately before removing the application sheet from the outer pouch.Type: ApplicationFiled: April 13, 2023Publication date: October 19, 2023Inventor: Dong-Jin Lim
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Patent number: 11780965Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.Type: GrantFiled: February 8, 2022Date of Patent: October 10, 2023Assignee: SK microworks Co., Ltd.Inventors: Dawoo Jeong, Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Dong Jin Lim
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Patent number: 11702519Abstract: An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4?X/Y?12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.Type: GrantFiled: February 5, 2018Date of Patent: July 18, 2023Assignee: SKC microworks CO., LTD.Inventors: Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dae Seong Oh, Dong Jin Lim
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Patent number: 11559923Abstract: One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.Type: GrantFiled: February 6, 2018Date of Patent: January 24, 2023Assignee: SKC CO., LTD.Inventors: Jin Woo Lee, Dae Seong Oh, Dawoo Jeong, Dong Jin Lim, Cheol Ho Kim
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Publication number: 20230001436Abstract: Provided is an elastic member according to an embodiment. The elastic member includes an upper support, a lower support provided under the upper support, and at least one elastic part configured to connect the upper support to the lower support, wherein the elastic part includes an upper support portion formed downward from the upper support, a lower support portion configured to extend upwardly from the lower support, and a connecting portion configured to connect the upper support portion to the lower support portion with a predetermined inclination and to be bent and deformed when the elastic member is pressed.Type: ApplicationFiled: September 24, 2020Publication date: January 5, 2023Inventors: Chul Ki KIM, Seong Ho KIM, Dong Jin LIM
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Publication number: 20220387304Abstract: Disclosed herein are bilayered substrates useful for treating infection and/or inflammation in a subject such as, for example, the upper respiratory system. In another aspect, the layers of the substrates disclosed herein include biocompatible and biodegradable polymers as well as one or more bioactive agents useful for treating infection and/or inflammation. In a further aspect, the layers of the substrate can contain nanoparticles incorporating the bioactive agents. In any one of the above aspects, the bioactive agents are released at a constant rate over a period of time. In still another aspect, the substrates disclosed herein are useful for reducing the mass of biofilms and reducing or preventing inflammation by inhibiting the production of interleukin-8.Type: ApplicationFiled: October 2, 2020Publication date: December 8, 2022Inventors: Do-Yeon CHO, Dong Jin LIM, Bradford A. WOODWORTH
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Publication number: 20220356317Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.Type: ApplicationFiled: July 12, 2022Publication date: November 10, 2022Inventors: Dae Seong OH, Dawoo JEONG, Sunhwan KIM, Jin Woo LEE, Dong Jin LIM, Kyungeun OH
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Patent number: 11433573Abstract: An embodiment can provide a method for producing a polyamide-imide film which is colorless and transparent and has excellent mechanical properties, the method comprising: a step of producing a polyamide-imide polymer solution by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound; a step of producing a gel sheet by extruding, casting and drying the polymer solution; and a step of producing a polyamide-imide film by heat-treating the gel sheet, wherein the viscosity of the polymer solution is 100,000 to 500,000 cps, and the polyamide-imide film has a yellowness index of 5 or lower, a haze of 2% or lower, a transmittance of 85% or above and a modulus of 5.0 GPa or above, at a thickness of 20 ?m to 75 ?m.Type: GrantFiled: February 6, 2018Date of Patent: September 6, 2022Assignee: SKC CO., LTD.Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim, Cheol Ho Kim
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Patent number: 11434335Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.Type: GrantFiled: February 6, 2018Date of Patent: September 6, 2022Assignee: SKC CO., LTD.Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim, Kyungeun Oh
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Patent number: 11365287Abstract: Embodiments relate to a process for preparing a poly(amide-imide) film and a poly(amide-imide) film prepared thereby. The process is capable of preparing a poly(amide-imide) film that is excellent in optical properties and mechanical properties.Type: GrantFiled: December 7, 2018Date of Patent: June 21, 2022Assignee: SKC CO., LTD.Inventors: Sunhwan Kim, Dae Seong Oh, Jin Woo Lee, Dawoo Jeong, Dong Jin Lim, Kyung Won Choi
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Publication number: 20220162388Abstract: Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.Type: ApplicationFiled: February 8, 2022Publication date: May 26, 2022Inventors: Dawoo JEONG, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Dong Jin LIM
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Patent number: 11339250Abstract: Embodiments provide a polyamide-imide polymer film, which comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound; and silica particles, wherein the number of aggregates having an average diameter of 150 to 200 nm observed in a cross-section cut in the thickness direction of the polyamide-imide film is less than 0.5/?m2, and a process for preparing the same.Type: GrantFiled: June 26, 2019Date of Patent: May 24, 2022Assignee: SKC CO., LTD.Inventors: Dae Seong Oh, Dawoo Jeong, Sunhwan Kim, Jin Woo Lee, Dong Jin Lim