Abstract: According to at least one aspect, the present disclosure provides a robot system for automatically assembling a modular component and an assembly target, comprising: an assembly robot including a first manipulator, an assembly tool coupled to the first manipulator and configured to assemble the modular component and the assembly target, and a first camera configured to capture images in a direction in which the assemble tool faces; a loading robot including a second manipulator and a gripper coupled to the second manipulator and configured to grip the modular component; and a control device configured to control the assembly robot and the loading robot.

Abstract: A third-party interference monitoring system is provided. The third-party interference monitoring system, according to one embodiment of the present invention, is for detecting third-party interference in advance before a buried pipeline buried underground is damaged by the third-party interference. The third-party interference monitoring system comprises: a sensor unit which is installed on a buried pipeline so as to detect an impact signal which is propagated along the ground or the buried pipeline when heavy equipment strikes the ground; and a control unit which acquires a time domain value of the impact signal by receiving data from the sensor unit, converts the time domain value to a frequency domain value, and then detects the third-party interference on the basis of frequency response characteristics of the impact signal.

Abstract: A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.

Abstract: The present application relates to a system, device, and method for monitoring an abnormal state of pipe, which monitors whether a pipe is abnormal. In the present application, a pipe state signal input from each signal acquisition part is divided into a plurality of time periods, and then it is determined whether an abnormal state signal exists in the pipe state signal in each of the time periods. Therefore, the present application enables determination with higher accuracy of whether the pipe is abnormal, compared to the case of determining whether an abnormal state signal exists in a pipe state signal which has not been divided into a plurality of time periods.

Abstract: A lead frame includes: leads; and a dambar arranged between the leads and connecting the leads to each other, wherein each of the leads includes: a lower lead groove formed in a first surface for a wettable flank structure; and an upper lead groove formed in a second surface opposite the first surface and aligned with the lower lead groove in a thickness direction, wherein in a sawing process, a portion of the lead between the lower lead groove and the upper lead groove is at least partially removed.

Abstract: Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trench is provided and an upper surface in which a second trench and a third trench are provided, including a circuit pattern and a conductive material; a first resin arranged in the first trench; and a second resin arranged in the second trench and the third trench, wherein the second trench exposes at least a part of the first resin.

Abstract: According to at least one aspect, the present disclosure provides a robot system for automatically assembling a modular component and an assembly target, comprising: an assembly robot including a first manipulator, an assembly tool coupled to the first manipulator and configured to assemble the modular component and the assembly target, and a first camera configured to capture images in a direction in which the assemble tool faces; a loading robot including a second manipulator and a gripper coupled to the second manipulator and configured to grip the modular component; and a control device configured to control the assembly robot and the loading robot.

Abstract: A parts fastening system using a cooperative robot that fastens a module part to a fastening target includes: a jig to load the module part at a predetermined position; a loading robot to grip the module part loaded on the jig, and to move and align the module part to a fastening area in which the module part is fastened to the fastening target; a fastening robot including a first camera, the fastening robot to fasten the module part to the fastening target; and a control device to control movements of the loading robot and the fastening robot.

Abstract: A semiconductor package substrate and a method of manufacturing the same are provided. The semiconductor package substrate includes: a base layer including a conductive material, having a first surface and a second surface opposite the first surface, and having a first groove or first trench in the first surface and a second groove or second trench in the second surface; a first resin buried in the first groove or first trench in the first surface of the base layer; and a groove in at least one corner of the first surface of the base layer and having a depth based on the first surface is 1/2 or more of a thickness of the base layer.

Abstract: There is provided a method for displaying information regarding a user's point of interest. The method includes displaying a UI screen including a first UI region in which the user's point of interest is displayed on a map as a location identifier, and a second UI region in which at least one object for the user's point of interest is displayed. Here, the user's point of interest may include at least one of a point which is previously searched by the user, a point to which the user previously visits, and a point that the user previously registers as the point of interest, and the object may express the information regarding the user's point of interest in relation to the location identifier in detail.

Abstract: A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.

Abstract: Provided are a method of manufacturing a semiconductor package substrate, a semiconductor package substrate manufactured using the method of manufacturing a semiconductor package substrate, a method of manufacturing a semiconductor package, and a semiconductor package manufactured using the method of manufacturing a semiconductor package. The method of manufacturing a semiconductor package substrate includes forming first grooves or first trenches in a bottom surface of a base substrate having a top surface and the bottom surface and formed of a conductive material; filling the first grooves or trenches with resin; curing the resin; removing exposed portions of the resin overfilled in the first grooves or trenches; etching the top surface of the base substrate to expose at least portions of the resin filled in the first grooves or trenches; and forming a second groove or a second trench in the bottom surface of the base substrate.

Abstract: Provided are a method of manufacturing a semiconductor package substrate, a semiconductor package substrate manufactured using the method of manufacturing a semiconductor package substrate, a method of manufacturing a semiconductor package, and a semiconductor package manufactured using the method of manufacturing a semiconductor package. The method of manufacturing a semiconductor package substrate includes forming first grooves or first trenches in a bottom surface of a base substrate having a top surface and the bottom surface and formed of a conductive material; filling the first grooves or trenches with resin; curing the resin; removing exposed portions of the resin overfilled in the first grooves or trenches; etching the top surface of the base substrate to expose at least portions of the resin filled in the first grooves or trenches; and forming a second groove or a second trench in the bottom surface of the base substrate.

Abstract: A nearby search method implemented with a computer includes verifying search request information entered through an electronic device, displaying a map screen on a screen of the electronic device, verifying a search result to be displayed on the map screen according to the verified search request information, dividing the map screen into a plurality of tiles, and displaying a search result, included in each of the divided tiles, as one search result icon corresponding to each of the divided tiles and distinguishably displaying search result icons to be displayed on each of the divided tiles according to the number of search results included in one tile.

Abstract: There is provided a method for displaying information regarding a user's point of interest. The method includes displaying a UI screen including a first UI region in which the user's point of interest is displayed on a map as a location identifier, and a second UI region in which at least one object for the user's point of interest is displayed. Here, the user's point of interest may include at least one of a point which is previously searched by the user, a point to which the user previously visits, and a point that the user previously registers as the point of interest, and the object may express the information regarding the user's point of interest in relation to the location identifier in detail.

Abstract: Provided is a method of locating a damage source of a wind turbine blade for tracking a damage source location of a blade used in a wind power generator, and more particularly, a method of locating a damage source of a wind turbine blade and an apparatus thereof in a large composite material structure capable of accurately locating a damage source even in a large composite material structure by detecting defects using contour maps written based on elastic wave energy value. The method of locating a damage source of the wind turbine blade according to the present invention can accurately locate the damage source even in the large composite material structure using at least two materials unlike the related art and can use a smaller number of AE sensor than the related art.

Abstract: A system and method for providing a nearby search service using a POI clustering scheme is provided. A nearby search method implemented with a computer includes verifying search request information entered through an electronic device, displaying a map screen on a screen of the electronic device, verifying a search result to be displayed on the map screen according to the verified search request information, dividing the map screen into a plurality of tiles, and displaying a search result, included in each of the divided tiles, as one search result icon corresponding to each of the divided tiles and distinguishably displaying search result icons to be displayed on each of the divided tiles according to the number of search results included in one tile.

Abstract: The present invention is effective in that automatically corrected temperature can be measured using one light source and one optical detector.

Abstract: A channel searching method may include setting a first channel in a broadcast signal, determining signal strength of the broadcast signal and generating an automatic gain control signal for the first channel, and when the signal strength satisfies a preset first requirement and the automatic gain control signal satisfies a preset second requirement, skipping demodulation of the first channel.

Abstract: A coil according to one embodiment of the present invention relates to a coil having a multi-layer structure, comprising n winding wires (n?2, n is natural number) which are spaced apart from a central axis and wound around the central axis, wherein a first winding of the n windings is wound to a first height in a direction perpendicular to a reference surface, a second winding is wound to a second height lower than the first height in a direction perpendicular to the reference surface, the first winding has a first radius from the central axis, the second winding has a second radius from the central axis, the second radius being smaller than the first radius, and the second winding wire is disposed in the first winding wire.