Abstract: A pet training device comprises a wireless command module, a wireless receiver module connected to an adjustable collar assembly. The wireless command module is used to select a stimulation mode, a stimulation duration, and a stimulation intensity level through the use of one-touch digital switches located on the wireless training device front panel. The selected functions are displayed on an LCD. Stimulation commands are transmitted to the wireless receiver module where they are demodulated into control signals that trigger a shock, a vibration, or a shock and vibration. When the wireless receiver module is placed in a no-bark mode, the wireless receiver module will generate a shock when triggered by a bark sensor. Power controllers built into both the wireless command module and wireless receiver module optimizes battery life by turning the training devices off after a period of inactivity.

Abstract: A pet training device comprises a wireless command module, a wireless receiver module connected to an adjustable collar assembly. The wireless command module is used to select a stimulation mode, a stimulation duration, and a stimulation intensity level through the use of one-touch digital switches located on the wireless training device front panel. The selected functions are displayed on an LCD. Stimulation commands are transmitted to the wireless receiver module where they are demodulated into control signals that trigger a shock, a vibration, or a shock and vibration. When the wireless receiver module is placed in a no-bark mode, the wireless receiver module will generate a shock when triggered by a bark sensor. Power controllers built into both the wireless command module and wireless receiver module optimizes battery life by turning the training devices off after a period of inactivity.

Abstract: The pet training device comprises a handheld wireless command module, a wireless receiver module connected to an adjustable collar assembly. The wireless command module is used to select a stimulation mode, stimulation duration, and a stimulation intensity level through the used of one-touch digital switches located on the device front panel. The selected functions are displayed on a LCD. The stimulation commands are transmitted to the wireless receiver module where they are demodulated into control signals that trigger a shock, a vibration, or both. When the wireless receiver is placed in the no-bark mode, the wireless receiver module will generate a shock when triggered by a bark sensor. Power controllers built into both the wireless command module and wireless receiver module optimizes battery life by turning the devices off after a period of inactivity.

Abstract: A monitoring device and a driving control system for a fan filter unit in a semiconductor clean room for monitoring the operating state of the fan filter unit. The monitoring device includes a switching section in each fan filter unit which alternately applies electrical power to one of a plurality of terminals. The switching section is responsive to a force from an air stream introduced therein via rotation of a fan in the fan filter unit. A display section in each fan filter unit is connected to the plurality of terminals which provide different signals, indicative of an on or off state of the fan, according to which of the plurality of terminals is electrically connected to the electrical power.

Abstract: An apparatus for quantitatively depositing molecular impurities on a semiconductor wafer, includes a reaction chamber, a gas generator for generating a source gas serving as the molecular impurities, a humidifier for generating moisture vapour of a constant temperature, a mixer for mixing the source gas and the moisture vapour to generate a mixed gas, a gas injector for injecting the mixed gas into the reaction chamber, an exhausting part for initiating a vacuum condition in the reaction chamber before deposition of the molecular impurities and for exhausting a remaining gases after deposition of the molecular impurities, and a cleaning air supply portion for supplying a cleaning air into the reaction chamber before deposition of the molecular impurities. After fabricating a semiconductor device using the wafer processed as above, a defective source of mechanism of contamination can be traced by analysing the semiconductor device.