Patents by Inventor Dong-joo ROH

Dong-joo ROH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11519953
    Abstract: An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: December 6, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Woo Kim, Seung Bin Ko, Dong Joo Roh, Chang Ho Lee, Jin-Ho Choi
  • Publication number: 20210109149
    Abstract: An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.
    Type: Application
    Filed: May 15, 2020
    Publication date: April 15, 2021
    Inventors: MIN WOO KIM, SEUNG BIN KO, DONG JOO ROH, CHANG HO LEE, JIN-HO CHOI
  • Publication number: 20160109512
    Abstract: A semiconductor package test blade and a semiconductor package test apparatus may prevent damage to a semiconductor package and occurrence of failures in the semiconductor package during a pass/fail test on the semiconductor package. The semiconductor package test blade includes a blade body formed at a lower end portion of a pusher for testing a semiconductor package, the blade body having a first surface contacting the semiconductor package and a groove dented upward from the first surface, a vacuum suction picker configured to penetrate a central portion of the blade body and suck and pick up the semiconductor package in vacuum, and a flexible silicone layer filling the groove. A bottom surface of the flexible silicone layer may be positioned at substantially the same level as the first surface of the blade body.
    Type: Application
    Filed: April 15, 2015
    Publication date: April 21, 2016
    Inventors: Suk-lae Kim, Dong-joo Roh
  • Publication number: 20080090311
    Abstract: A dipping detecting device used in the fabrication of semiconductor devices. The dipping detecting device includes a gripper used as a conductive first electrode and configured to pick up a semiconductor device in order to dip the semiconductor device into a dipping solution. A conductor used as a second electrode and formed at a side of the gripper. The conductor electrically insulated from the gripper. A power source unit applying a power to the gripper and the conductor and detecting a current flow, wherein a dipping state of the semiconductor device is detected depending on the flow of current.
    Type: Application
    Filed: September 20, 2007
    Publication date: April 17, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-joo ROH, Yong-kyun SUN, Youn-sung KO