Patents by Inventor Dong-Ju Jang
Dong-Ju Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240129725Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.Type: ApplicationFiled: December 23, 2021Publication date: April 18, 2024Applicant: ESTORM CO., LTD.Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
-
Patent number: 11955755Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case. The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.Type: GrantFiled: November 18, 2021Date of Patent: April 9, 2024Assignee: SOLUM CO., LTD.Inventors: Young Jun Jang, Hyun Su Kim, Jun Kyu Lee, Pill Ju Kim, Sang Keun Ji, Dong Kyun Ryu
-
Publication number: 20240077618Abstract: A functional safety system of a robot according to an exemplary embodiment of the present disclosure can duplicate modules so as to satisfy a performance level d (pl-d) required for the functional satisfy of a robot.Type: ApplicationFiled: May 12, 2023Publication date: March 7, 2024Inventors: Seong Ju PARK, Dong Hyeon SEO, Seung Ho JANG, Min Chang, Yun Jib Kim, Chang Woo Kim
-
Publication number: 20240075622Abstract: A functional safety system of a robot according to an exemplary embodiment of the present disclosure can duplicate modules so as to satisfy a performance level d (pl-d) required for the functional satisfy of a robot.Type: ApplicationFiled: May 12, 2023Publication date: March 7, 2024Inventors: Seong Ju PARK, Dong Hyeon SEO, Seung Ho JANG, Min Chang, Yun Jib Kim, Chang Woo Kim
-
Publication number: 20240075620Abstract: A functional safety system of a robot according to an exemplary embodiment of the present disclosure can generate a safety zone which is a zone to sense whether an obstacle is present.Type: ApplicationFiled: May 12, 2023Publication date: March 7, 2024Inventors: Seong Ju PARK, Dong Hyeon SEO, Seung Ho JANG, Min Chang, Yun Jib Kim, Chang Woo Kim
-
Publication number: 20230291176Abstract: A laser driver for driving a Vertical Cavity Surface Emitting Laser (VCSEL) includes a high-side switch (High-side Field Effect Transistor) having an internal capacitor for charging with a drain terminal thereof connected to a high-voltage terminal, a low-side switch (Low-side Field Effect Transistor) in which a drain terminal thereof is connected to a source terminal of the high-side switch and a source terminal thereof is connected to a ground terminal, and a VCSEL diode having an anode terminal connected to the high-side switch.Type: ApplicationFiled: May 27, 2022Publication date: September 14, 2023Inventors: Seon-Yong An, Kyoung-Chun Kweon, Hoon-Il Jeong, Jun-Hwan Jang, Chan-M Lim, Dong-Ju Jang
-
Publication number: 20230223347Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: ApplicationFiled: February 27, 2023Publication date: July 13, 2023Inventors: JONGHO PARK, Seung Hwan Kim, Jung Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
-
Patent number: 11610845Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: GrantFiled: August 3, 2021Date of Patent: March 21, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
-
Patent number: 11538801Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.Type: GrantFiled: April 1, 2021Date of Patent: December 27, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Jungjoo Kim, Yongkwan Lee, Dong-Ju Jang
-
Publication number: 20220068904Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.Type: ApplicationFiled: April 1, 2021Publication date: March 3, 2022Applicant: Samsung Electronics Co., Ltd.Inventors: Jongho PARK, Seung Hwan KIM, Jun Young OH, Jungjoo KIM, Yongkwan LEE, Dong-Ju JANG
-
Publication number: 20210366832Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: ApplicationFiled: August 3, 2021Publication date: November 25, 2021Inventors: JONGHO PARK, SEUNG HWAN KIM, JUN YOUNG OH, Kyong Hwan KOH, SANGSOO KIM, DONG-JU JANG
-
Patent number: 11107769Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: GrantFiled: April 10, 2020Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
-
Publication number: 20210035913Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: ApplicationFiled: April 10, 2020Publication date: February 4, 2021Inventors: JONGHO PARK, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang