Abstract: A flicker reduction device of a display apparatus can include a frame memory configured to store image data of an input frame synchronized with an input frame frequency, a first circuit configured to output a first control signal when a plurality of fixed active periods based on a reference frame frequency are allocated within each input frame time corresponding to the input frame frequency and output a second control signal when only one fixed active period is allocated within each input frame time, and a second circuit configured to copy the image data of the input frame according to the first control signal and output image data of a plurality of input frames according to the reference frame frequency. The second circuit outputs the image data of the input frame according to the reference frame frequency without copying according to the second control signal.

Abstract: A flicker reduction device of a display apparatus can include a frame memory configured to store image data of an input frame synchronized with an input frame frequency, a first circuit configured to output a first control signal when a plurality of fixed active periods based on a reference frame frequency are allocated within each input frame time corresponding to the input frame frequency and output a second control signal when only one fixed active period is allocated within each input frame time, and a second circuit configured to copy the image data of the input frame according to the first control signal and output image data of a plurality of input frames according to the reference frame frequency. The second circuit outputs the image data of the input frame according to the reference frame frequency without copying according to the second control signal.

Abstract: An infinitely expandable display apparatus includes a set board outputting image data having a first resolution and a plurality of display circuits connected to one another through an interface circuit based on a cascading scheme to display the image data, each of the plurality of display circuits including an application specific integrated circuit (ASIC) embedded therein, wherein each of the plurality of display circuits includes a plurality of slave display circuits generating unit arrangement coordinate information based on a connection of the interface circuit and a master display circuit scaling the image data having the first resolution based on the unit arrangement coordinate information and transferring the scaled image data to the plurality of slave display circuits.

Abstract: An infinitely expandable display apparatus includes a set board outputting image data having a first resolution and a plurality of display circuits connected to one another through an interface circuit based on a cascading scheme to display the image data, each of the plurality of display circuits including an application specific integrated circuit (ASIC) embedded therein, wherein each of the plurality of display circuits includes a plurality of slave display circuits generating unit arrangement coordinate information based on a connection of the interface circuit and a master display circuit scaling the image data having the first resolution based on the unit arrangement coordinate information and transferring the scaled image data to the plurality of slave display circuits.

Abstract: A SAW filter includes a substrate, an upper bus bar arranged on the substrate, a lower bus bar arranged on the substrate so as to face the upper bus bar, a first finger IDT arranged so as to be connected to the upper bus bar at one end, a second finger IDT arranged so as to be connected to the lower bus bar at one end, a passivation part formed on the first finger IDT and the second finger IDT, a first metal part formed on the passivation part and including all area of the upper bus bar and a partial area of the first finger IDT, and a second metal part formed on the passivation part and including all area of the lower bus bar and a partial area of the second finger IDT.

Abstract: The present invention relates to a capacitor for a SAW filter, the SAW filter, and a method of manufacturing thereof, and more specifically, to a capacitor for a SAW filter including a first metal layer formed on a substrate; an insulation layer formed on the first metal layer; and a second metal layer formed on the insulation layer and overlapped with partially or totally of the first metal layer, in which the insulation layer is formed to be extended to the top of an IDT formed on the substrate, the SAW filter on which such a capacitor for a SAW filter is mounted, and a method of manufacturing thereof.

Abstract: A SAW filter includes a substrate, an upper bus bar arranged on the substrate, a lower bus bar arranged on the substrate so as to face the upper bus bar, a first finger IDT arranged so as to be connected to the upper bus bar at one end, a second finger TOT arranged so as to be connected to the lower bus bar at one end, passivation part formed on the first finger IDT and the second finger IDT, a first metal part formed on the passivation part and including all area of the upper bus bar and a partial area of the first finger IDT, and a second metal part formed on the passivation part and including all area of the lower bus bar and a partial area of the second finger IDT.

Abstract: The present invention relates to a capacitor for a SAW filter, the SAW filter, and a method of manufacturing thereof, and more specifically, to a capacitor for a SAW filter including a first metal layer formed on a substrate; an insulation layer formed on the first metal layer; and a second metal layer formed on the insulation layer and overlapped with partially or totally of the first metal layer, in which the insulation layer is formed to be extended to the top of an IDT formed on the substrate, the SAW filter on which such a capacitor for a SAW filter is mounted, and a method of manufacturing thereof.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: An apparatus and a method reduces charging time of a multi-battery with a plurality of battery units. A charging process and apparatus charges a first battery unit of a multi-battery, keeps checking whether a current charging the first battery unit reaches a prescribed value, selects and charges a selected second battery unit of the multi-battery along with the first battery unit if the preset value is reached, and charges the second battery unit with a limited maximum magnitude current when the first battery unit is completely charged. Dual-charging operations for both first and second battery units conducted in the present charging process can reduce total charging time of the multi-battery.

Abstract: A wafer cleaning device is disclosed in which a brush is integrally formed with a nozzle for supplying pure water, such that a uniform water screen is formed on a surface of a wafer and particles on the wafer can be entirely removed. The cleaning device includes injectors for ejecting pure water supplied from a pure water supplier onto a wafer; nozzles disposed at one end of each of the injectors; and a brush for cleaning the wafer while moving horizontally between a center and edges of the wafer. The injectors include a first injector for ejecting pure water at an upper position of the wafer toward the center of the wafer, and a second injector disposed adjacent to the brush along one side of a brush arm, the brush arm supporting the brush and moving the brush and second injector toward the wafer.

Abstract: An apparatus and a method reduces charging time of a multi-battery with a plurality of battery units. A charging process and apparatus charges a first battery unit of a multi-battery, keeps checking whether a current charging the first battery unit reaches a prescribed value, selects and charges a selected second battery unit of the multi-battery along with the first battery unit if the preset value is reached, and charges the second battery unit with a limited maximum magnitude current when the first battery unit is completely charged. Dual-charging operations for both first and second battery units conducted in the present charging process can reduce total charging time of the multi-battery.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A wafer cleaning device is disclosed in which a brush is integrally formed with a nozzle for supplying pure water, such that a uniform water screen is formed on a surface of a wafer and particles on the wafer can be entirely removed. The cleaning device includes injectors for ejecting pure water supplied from a pure water supplier onto a wafer; nozzles disposed at one end of each of the injectors; and a brush for cleaning the wafer while moving horizontally between a center and edges of the wafer. The injectors include a first injector for ejecting pure water at an upper position of the wafer toward the center of the wafer, and a second injector disposed adjacent to the brush along one side of a brush arm, the brush arm supporting the brush and moving the brush and second injector toward the wafer.