Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A wafer cleaning device is disclosed in which a brush is integrally formed with a nozzle for supplying pure water, such that a uniform water screen is formed on a surface of a wafer and particles on the wafer can be entirely removed. The cleaning device includes injectors for ejecting pure water supplied from a pure water supplier onto a wafer; nozzles disposed at one end of each of the injectors; and a brush for cleaning the wafer while moving horizontally between a center and edges of the wafer. The injectors include a first injector for ejecting pure water at an upper position of the wafer toward the center of the wafer, and a second injector disposed adjacent to the brush along one side of a brush arm, the brush arm supporting the brush and moving the brush and second injector toward the wafer.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: A wafer cleaning device is disclosed in which a brush is integrally formed with a nozzle for supplying pure water, such that a uniform water screen is formed on a surface of a wafer and particles on the wafer can be entirely removed. The cleaning device includes injectors for ejecting pure water supplied from a pure water supplier onto a wafer; nozzles disposed at one end of each of the injectors; and a brush for cleaning the wafer while moving horizontally between a center and edges of the wafer. The injectors include a first injector for ejecting pure water at an upper position of the wafer toward the center of the wafer, and a second injector disposed adjacent to the brush along one side of a brush arm, the brush arm supporting the brush and moving the brush and second injector toward the wafer.