Patents by Inventor Dong-Ki Ho

Dong-Ki Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing the same
    Patent number: 8759958
    Abstract: A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: June 24, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Ki Ho, Boseong Kim
  • Semiconductor package and method of manufacturing the same
    Publication number: 20100213591
    Abstract: A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls.
    Type: Application
    Filed: February 12, 2010
    Publication date: August 26, 2010
    Applicant: Samsaung Electronics Co., Ltd.
    Inventors: Dong-Ki Ho, Boseong Kim