Patents by Inventor Dong Ki Nam

Dong Ki Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The Same
    Publication number: 20090004488
    Abstract: Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a polymer binder; and (c) cyanate ester or a prepolymer of the cyanate ester, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a flame retardant. Also, a composite substrate and a copper laminate using the same are disclosed.
    Type: Application
    Filed: June 26, 2008
    Publication date: January 1, 2009
    Applicant: Doosan Corporation
    Inventors: Kwang Suk PARK, In Wook Kim, Duk Sang Han, Soo Im Jung, Dong Ki Nam
  • Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same
    Publication number: 20090004484
    Abstract: Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a dicyclopentadiene epoxy resin represented by Formula 1; and (c) an alkylphenol aldehyde novolak curing agent represented by Formula 2, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a brominated epoxy resin. Also, a composite substrate and a copper laminate using the same are disclosed.
    Type: Application
    Filed: June 26, 2008
    Publication date: January 1, 2009
    Applicant: Doosan Corporation
    Inventors: In Wook KIM, Duk Sang Han, Kwang Suk Park, Soo Im Jung, Dong Ki Nam