Abstract: An apparatus for manufacturing a display apparatus includes: a chamber; a head unit configured to supply a process gas and a cleaning gas to an inside of the chamber; which has a storage space where the process gas or the cleaning gas is temporarily stored, and including a nozzle connected to the storage space and configured to guide the process gas or the cleaning gas from the storage space to the inside of the chamber; a susceptor unit arranged to face the head unit and on which a substrate is placeable; a cleaning gas supply unit connected to the head unit and configured to plasmarize the cleaning gas and supply the cleaning gas that is plasmarized to the head unit; and a cleaning gas ejection unit connected to the cleaning gas supply unit and configured to supply the cleaning gas to at least two portions of the storage space.

Abstract: According to an embodiment of the present disclosure, a refrigerant pipe fitting, the fitting having a pipe shape with a hollow to connect a pipe, may include an out pipe opening which is opened at one end of the fitting and into which an out pipe is inserted; an inner pipe opening which is opened at the other end of the fitting and into which an inner pipe is inserted to be inserted into the out pipe inside the fitting; a pressing portion which is configured to form a part of an inner surface of the fitting and formed to have a narrower inner diameter as it extends toward the inner pipe opening to press and deform the out pipe to allow the out pipe to connect with the inner pipe in movement of the fitting; and a fastening portion which is formed on the inner surface of the fitting between the pressing portion and the out pipe opening to constrain an end of the out pipe to prevent the fitting from being separated.

Abstract: An apparatus and method for manufacturing a display apparatus includes: a chamber; a first nozzle unit at the chamber, the first nozzle unit configured to deposit an organic layer or an inorganic layer on a substrate; a second nozzle unit at the chamber, the second nozzle unit configured to deposit the organic layer or the inorganic layer on a substrate and the second nozzle unit being linearly aligned with the first nozzle unit in a first direction; and an injection nozzle unit between the first nozzle unit and the second nozzle unit, the injection nozzle unit configured to inject a first gas in the chamber toward the substrate.

Abstract: An apparatus for manufacturing a display apparatus includes: a chamber; a head unit configured to supply a process gas and a cleaning gas to an inside of the chamber; which has a storage space where the process gas or the cleaning gas is temporarily stored, and including a nozzle connected to the storage space and configured to guide the process gas or the cleaning gas from the storage space to the inside of the chamber; a susceptor unit arranged to face the head unit and on which a substrate is placeable; a cleaning gas supply unit connected to the head unit and configured to plasmarize the cleaning gas and supply the cleaning gas that is plasmarized to the head unit; and a cleaning gas ejection unit connected to the cleaning gas supply unit and configured to supply the cleaning gas to at least two portions of the storage space.

Abstract: An apparatus and method for manufacturing a display apparatus includes: a chamber; a first nozzle unit at the chamber, the first nozzle unit configured to deposit an organic layer or an inorganic layer on a substrate; a second nozzle unit at the chamber, the second nozzle unit configured to deposit the organic layer or the inorganic layer on a substrate and the second nozzle unit being linearly aligned with the first nozzle unit in a first direction; and an injection nozzle unit between the first nozzle unit and the second nozzle unit, the injection nozzle unit configured to inject a first gas in the chamber toward the substrate.

Abstract: A display apparatus and an apparatus for and method of manufacturing the display apparatus. The display apparatus includes: a substrate; a display unit formed on the substrate; and a thin film encapsulation layer formed on the display unit. The thin film encapsulation layer includes an inorganic layer, and the inorganic layer includes a first sub-inorganic layer including a compound oxide including at least two of aluminum (Al), zinc (Zn), zirconium (Zn), and hafnium (Hf).

Abstract: An apparatus and a method of manufacturing a display apparatus are disclosed. In one aspect, the apparatus includes a chamber and an inorganic layer forming nozzle unit formed in the chamber and configured to form at least one inorganic layer. The apparatus also includes an organic layer forming nozzle unit formed in the chamber and configured to form at least one organic layer, wherein the organic layer forming nozzle unit is arranged substantially in line with the inorganic layer forming nozzle unit. The apparatus further includes a separating nozzle unit formed between the inorganic layer forming nozzle unit and the organic layer forming nozzle unit and configured to spray an inert gas.

Abstract: A display apparatus and an apparatus for and method of manufacturing the display apparatus. The display apparatus includes: a substrate; a display unit formed on the substrate; and a thin film encapsulation layer formed on the display unit. The thin film encapsulation layer includes an inorganic layer, and the inorganic layer includes a first sub-inorganic layer including a compound oxide including at least two of aluminum (Al), zinc (Zn), zirconium (Zn), and hafnium (Hf).

Abstract: A display apparatus and an apparatus for and method of manufacturing the display apparatus. The display apparatus includes: a substrate; a display unit formed on the substrate; and a thin film encapsulation layer formed on the display unit. The thin film encapsulation layer includes an inorganic layer, and the inorganic layer includes a first sub-inorganic layer including a compound oxide including at least two of aluminum (Al), zinc (Zn), zirconium (Zn), and hafnium (Hf).

Abstract: A display apparatus and an apparatus for and method of manufacturing the display apparatus. The display apparatus includes: a substrate; a display unit formed on the substrate; and a thin film encapsulation layer formed on the display unit. The thin film encapsulation layer includes an inorganic layer, and the inorganic layer includes a first sub-inorganic layer including a compound oxide including at least two of aluminum (Al), zinc (Zn), zirconium (Zn), and hafnium (Hf).

Abstract: An apparatus and method for manufacturing a display apparatus includes: a chamber; a first nozzle unit at the chamber, the first nozzle unit configured to deposit an organic layer or an inorganic layer on a substrate; a second nozzle unit at the chamber, the second nozzle unit configured to deposit the organic layer or the inorganic layer on a substrate and the second nozzle unit being linearly aligned with the first nozzle unit in a first direction; and an injection nozzle unit between the first nozzle unit and the second nozzle unit, the injection nozzle unit configured to inject a first gas in the chamber toward the substrate.

Abstract: An apparatus and a method of manufacturing a display apparatus are disclosed. In one aspect, the apparatus includes a chamber and an inorganic layer forming nozzle unit formed in the chamber and configured to form at least one inorganic layer. The apparatus also includes an organic layer forming nozzle unit formed in the chamber and configured to form at least one organic layer, wherein the organic layer forming nozzle unit is arranged substantially in line with the inorganic layer forming nozzle unit. The apparatus further includes a separating nozzle unit formed between the inorganic layer forming nozzle unit and the organic layer forming nozzle unit and configured to spray an inert gas.

Abstract: A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

Abstract: A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

Abstract: A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

Abstract: A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

Abstract: A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.