Patents by Inventor Dong Kyun Lee

Dong Kyun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12266933
    Abstract: A power trading system of virtual power plant includes a plurality of virtual power plants connected to a power system and including a distributed energy resource; a heat conversion device connected to the power system and converting the power generated from the plurality of distributed energy resources into thermal energy; and a power trading device configured to analyze an excess and insufficient power amount of the plurality of virtual power plant due to an output variation of the distributed energy resource, control power trading between the plurality of virtual power plant, the power system, or the heat conversion device by using the analysis result of the excess and insufficient power amount to stabilize the output of the power system and the virtual power plant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: April 1, 2025
    Assignee: KOREA DISTRICT HEATING CORP.
    Inventors: Ja Kyun Koo, Tae Seon Eom, Yong Ha Lee, Min Sung Ko, Dong Hwan Chang
  • Publication number: 20250104978
    Abstract: The ring assembly for a substrate processing apparatus, in which a plasma process is performed, of the present invention comprises an inner ring, in which a first plasma region is formed, an outer ring provided outside the inner ring, in which a second plasma region with a lower plasma distribution than the first plasma region is formed, and a cover ring provided on an upper surface of the outer ring, having a thickness smaller than that of the inner ring, and made of a material that has a lower etching reaction to plasma than the outer ring.
    Type: Application
    Filed: August 5, 2024
    Publication date: March 27, 2025
    Applicant: SEMES CO., LTD.
    Inventors: Dong Mok LEE, Chun Loon CHA, Jong Chan PARK, Chae Kyun OH, Hyung Joon KIM
  • Publication number: 20250098236
    Abstract: A power semiconductor device includes a substrate, a first epi layer of a first conductivity type disposed on the substrate, a second epi layer of a first conductivity type disposed on the first epi layer, a first well of a second conductivity type partially disposed in the first epi layer, a second well of a second conductivity type disposed on the second epi layer, an ion implantation region and a source region of the second conductivity type disposed in the second well, a source electrode in the source region, a gate insulating layer in a trench region where a portion of the ion implantation region and the second epi layer is removed, a trench gate disposed on the gate insulating layer, an interlayer insulating layer disposed on the trench gate and a gate electrode electrically connected to the trench gate.
    Type: Application
    Filed: September 18, 2024
    Publication date: March 20, 2025
    Applicant: LX SEMICON CO., LTD.
    Inventors: Ho Jung LEE, Nam Ju KANG, Dong Kyun KIM, Kuk Tae HONG, Jun Ha HWANG
  • Patent number: 12255075
    Abstract: An atomic layer etching method using a ligand exchange reaction may include a substrate providing step of putting a substrate with a thin film formed thereon into a reaction chamber, a halogenated thin film forming step of forming a halogenated thin film on a surface of the thin film by infusing a halogenated gas into the reaction chamber, and an etching step of etching the halogenated thin film by infusing a ligand without a metal or metal precursor into the reaction chamber with the substrate with the halogenated thin film.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: March 18, 2025
    Assignees: SK hynix Inc., Merck Patent GmbH
    Inventors: Jae Chul Lee, Hyun Sik Noh, Dong Kyun Lee, Eun Ae Jung, Kyoung-Mun Kim, Jooyong Kim, Younghun Byun, Byeong Il Yang, Changhyun Jin
  • Patent number: 12252024
    Abstract: The present disclosure relates to an electric vehicle charging cable, in which a cooling fluid is used to efficiently cool heat generated during charging of an electric vehicle, a thermally conductive material is added as well as the cooling fluid to improve cooling performance, thereby preventing damage to inner components due to heat, safety accidents such as fire are prevented, and a diameter of the cable is minimized.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: March 18, 2025
    Assignees: LS CABLE & SYSTEM LTD., LS EV KOREA LTD.
    Inventors: Hyun Woong Kim, Jae Bok Lee, Dong Kyun Yoo, Uk Yeol Choi
  • Publication number: 20250074624
    Abstract: An aircraft assembly system includes a jig; and a position adjuster connected to the jig and configured to adjust a position of the jig, wherein the jig includes a ball stud between the jig and the position adjuster, and the position adjuster includes a socket in which at least a portion of the ball stud is accommodated and in which the ball stud is rotatably fastened.
    Type: Application
    Filed: January 29, 2024
    Publication date: March 6, 2025
    Inventors: Dong Ho Lee, Myung Kyun Jeong, Chang Hoon Lee, Tae Hwan Kwak, Sang Bin Han, Suk Hyun Yoon, Tae Jin Song, Jun Young Choi, Cheol Bae Park
  • Patent number: 12237676
    Abstract: A virtual power plant system using a renewable combined heat and power plant includes a plurality of distributed energy resources connected to a virtual power plant; a virtual power plant output adjustment device connected to the virtual power plant and including a renewable combined heat and power plant that produces electricity using a new and renewable energy source; and a virtual power plant management device configured to conduct a bidding by predicting an power generation amount of the plurality of distributed energy resources, analyze output variation and error of the virtual power plant based on the power generation amount of the plurality of distributed energy resources, and stabilize an output variation of the virtual power plant by controlling a power generation amount of the virtual power plant output adjustment device.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: February 25, 2025
    Assignee: KOREA DISTRICT HEATING CORP.
    Inventors: Ja Kyun Koo, Tae Seon Eom, Yong Ha Lee, Min Sung Ko, Dong Hwan Chang
  • Patent number: 12227891
    Abstract: A washing machine including a plurality of washers may include a fixing bracket coupled to a front of a first housing in which a first tub is disposed and a front of a second housing in which a second tub is disposed, to prevent the first housing and the second housing from being separated from each other.
    Type: Grant
    Filed: November 22, 2023
    Date of Patent: February 18, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek Gyu Kwon, Dong-Won Kim, Do Yun Lee, Bo-Kyun Kim, Geon Ho Lee
  • Patent number: 12223871
    Abstract: The present disclosure relates a display device and a method compensating for deterioration thereof, and a mobile terminal including the display device. The display device includes: a display panel including a first pixel area, a second pixel area, and a third pixel area; a first optical device disposed below the display panel or embedded within the display panel in a predetermined sensing area on the display panel, the first optical device facing at least a portion of the first pixel area and a portion of the second pixel area when the display panel is folded or moved; and a pixel deterioration compensation circuit configured to operate to reduce a luminance difference between the first pixel area and the second pixel area by receiving sensing data from the first optical device in a deterioration sensing mode.
    Type: Grant
    Filed: June 9, 2023
    Date of Patent: February 11, 2025
    Assignee: LG Display Co., Ltd.
    Inventors: Dong Gun Lee, Seung Taek Oh, Yong Kyun Choi, Jung Hoon Lee
  • Publication number: 20250026492
    Abstract: In an assembly system of an aircraft including a fuselage and a wing, the aircraft assembly system may include: a jig unit coupled to the wing to move integrally with the wing; a transfer unit connected to the jig unit and transferring the wing toward the fuselage; a position adjusting unit detachably connected to the jig unit and adjusting a position of the jig unit; and a measuring unit configured for measuring positions of the fuselage and the wing, wherein the fuselage may be relatively fixed to the movement of the wing, wherein the measuring unit may be configured to set a fuselage coordinate system and a wing coordinate system for the fuselage and the wing, respectively, wherein the position adjusting unit may be configured to move the jig unit so that the wing coordinate system coincides with the fuselage coordinate system.
    Type: Application
    Filed: November 30, 2023
    Publication date: January 23, 2025
    Inventors: Dong Ho LEE, Sang Bin HAN, Myung Kyun JEONG, Chang Hoon LEE, Tae Hwan KWAK, Cheol Bae PARK, Jun Young CHOI, Dong Han LEE, Suk Hyun YOON, Jeong Rak KIM
  • Patent number: 11958874
    Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: April 16, 2024
    Assignees: EGTM Co., Ltd., SK hynix Inc.
    Inventors: Jang Keun Sim, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
  • Publication number: 20240079249
    Abstract: An atomic layer etching method using a ligand exchange reaction may include a substrate providing step of putting a substrate with a thin film formed thereon into a reaction chamber, a halogenated thin film forming step of forming a halogenated thin film on a surface of the thin film by infusing a halogenated gas into the reaction chamber, and an etching step of etching the halogenated thin film by infusing a ligand without a metal or metal precursor into the reaction chamber with the substrate with the halogenated thin film.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 7, 2024
    Inventors: Jae Chul LEE, Hyun Sik NOH, Dong Kyun LEE, Eun Ae JUNG, Kyoung-Mun KIM, Jooyong KIM, Younghun BYUN, Byeong Il YANG, Changhyun JIN
  • Publication number: 20230328962
    Abstract: A semiconductor device includes a first capacitor block including a first conductive plate, and first lower electrodes on the first conductive plate, a second capacitor block including a second conductive plate spaced apart from the first conductive plate, and second lower electrodes on the second conductive plate, a first edge capacitor block including first edge electrodes on the first conductive plate and surrounding the first capacitor block, a second edge capacitor block including a second edge electrodes on the second conductive plate and surrounding the second capacitor block and a first electrode support which supports the first lower electrodes, the second lower electrodes, the first edge electrodes, and the second edge electrodes. A first penetration pattern penetrates the first electrode support, is over the first lower electrodes and the second lower electrodes, and is not over the first edge electrodes and the second edge electrodes.
    Type: Application
    Filed: December 6, 2022
    Publication date: October 12, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Dong Kyun LEE
  • Patent number: 11600495
    Abstract: Provided is a method of manufacturing a semiconductor device. The method includes providing a substrate in which a main area including a first cell area and a first peripheral area, and an edge area including a second cell area and a second peripheral area are defined, sequentially forming a mold layer, a supporter layer, a mask layer, and a preliminary pattern layer on the substrate, exposing the preliminary pattern layer to light to simultaneously form a first pattern and a second pattern on the mask layer of the first cell area and the second cell area, respectively, forming an etch stop layer on the second pattern and etching the mask layer using the etch stop layer and the first pattern to form a hole pattern in the mold layer and the supporter layer of the first cell area.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: March 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon Young Choi, Dong Kyun Lee, Sang Oh Lee, Sang Jae Park
  • Publication number: 20220402946
    Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.
    Type: Application
    Filed: April 11, 2022
    Publication date: December 22, 2022
    Inventors: Jang Keun SIM, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
  • Publication number: 20210272817
    Abstract: Provided is a method of manufacturing a semiconductor device. The method includes providing a substrate in which a main area including a first cell area and a first peripheral area, and an edge area including a second cell area and a second peripheral area are defined, sequentially forming a mold layer, a supporter layer, a mask layer, and a preliminary pattern layer on the substrate, exposing the preliminary pattern layer to light to simultaneously form a first pattern and a second pattern on the mask layer of the first cell area and the second cell area, respectively, forming an etch stop layer on the second pattern and etching the mask layer using the etch stop layer and the first pattern to form a hole pattern in the mold layer and the supporter layer of the first cell area.
    Type: Application
    Filed: September 23, 2020
    Publication date: September 2, 2021
    Inventors: YOON YOUNG CHOI, DONG KYUN LEE, SANG OH LEE, SANG JAE PARK
  • Publication number: 20160161828
    Abstract: A camera module includes: a lens barrel including one or more lenses; a housing accommodating the lens barrel in an internal space thereof; and a piezoelectric actuator disposed on an inner surface of the housing and coupled to the inner surface of the housing through magnetic force, the piezoelectric actuator being configured to drive the lens barrel in an optical axis direction in the internal space.
    Type: Application
    Filed: November 23, 2015
    Publication date: June 9, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Dong Kyun LEE
  • Publication number: 20160141485
    Abstract: A capsule endoscope includes a power supply operably coupled to a piezoelectric element. The power supply is configured to provide an alternating electric signal to the piezoelectric element. A housing defines a cavity therein to receive the piezoelectric element and the power supply. The piezoelectric element is configured to frictionally couple with an inner circumferential surface of the housing to impart movement.
    Type: Application
    Filed: September 22, 2015
    Publication date: May 19, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Kyun LEE
  • Patent number: 9210309
    Abstract: Disclosed herein is a camera module including: a lens barrel in which one or more lenses are installed; a housing accommodating the lens barrel; a printed circuit board coupled with a bottom of the housing and having an image sensor with a light receiving portion mounted thereon; a window film having a window formed therein to define an incident area of light incident on the image sensor; and an infrared ray blocking member blocking an infrared ray in the light incident on the image sensor.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: December 8, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chuel Jin Park, Won Seob Oh, Dong Kyun Lee, Ki Mun Paik, Jung Wook Hwang
  • Publication number: 20140362285
    Abstract: A lens module includes a housing; a lens barrel mounted in the housing; and an actuator unit including an actuator to move the lens barrel. The actuator unit has a coupling area on one end for coupling to the housing, and an adjustment portion on another end for adjusting a tilt of the lens barrel formed.
    Type: Application
    Filed: December 17, 2013
    Publication date: December 11, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Won Min, DONG KYUN LEE, WOON KI KIM, SEOG JIN HONG, Ick Chan Shim