Patents by Inventor Dong-Kyun YU

Dong-Kyun YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10111321
    Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Won Park, Dong-Kyun Yu, Ji-Heon Yu, Seung-Yup Lee, Taek-Kyun Choi
  • Publication number: 20160242291
    Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 18, 2016
    Inventors: Sung-Won PARK, Dong-Kyun YU, Ji-Heon YU, Seung-Yup LEE, Taek-Kyun CHOI