Abstract: The present invention relates to an antibody against resistin and use thereof and, more specifically, to a resistin antibody or antigen-binding fragment thereof that inhibits the activity of resistin by blocking resistin/CAP1 binding, a nucleic acid encoding same, a vector comprising the nucleic acid, a cell transformed with the vector, a method for preparing the antibody or antigen-binding fragment thereof, an antibody-drug conjugate comprising the antibody or antigen-binding fragment thereof, a bi- or multi-specific antibody, a chimeric antigen receptor, an immune cell containing same, and a composition for the prevention or treatment of diseases that can be treated through the inhibition of resistin activity, the composition comprising same.

Abstract: A method for providing a credential service may include transmitting, to a user terminal, data of a request page including a cloud service selection field for selecting one cloud service from a list of a plurality of cloud services; receiving, from the user terminal, a request for issuing a temporary key for a credential for calling an API served by a second cloud service selected in the cloud service selection field; transmitting an account issuance request signal to a system of the second cloud service in response to the receiving the request for issuing the temporary key; receiving credential key information for a first account issued to an institution, from the system of the second cloud service in response to the transmitting the account issuance request signal; and transferring the credential key information to the user terminal in response to the request for issuing the temporary key.

Abstract: The present invention relates to a one-touch-removable container packaging film, and a container comprising same and, more specifically, to a one-touch-removable container packaging film, and a container comprising same, the packaging film: being naturally removable from the container when a container lid is rotatably separated from a container body in order to open contents sealed in the container, so as to be forcibly removed from the container according to the opening of the container contents without the need to consciously remove the packaging film in order to recycle the used container, and thus inconvenient actions such as removal of the packaging film during disposal of the container can be fundamentally eliminated; being forcibly removable according to the opening of the container contents so that the packaging film is necessarily removed from the container after the container is used even if the packaging film is not intended to be removed; and being easily removable with only a one-touch rotational

Abstract: Disclosed is a light emitting display device which may prevent or at least reduce lateral leakage current. The light emitting display device includes a substrate comprising a plurality of first to third subpixels arranged to neighbor one another, each of the first to third subpixels comprising an emission part and a non-emission part to surround the emission part; a bank at the non-emission parts; first electrodes covered with the bank and respectively at the first to third subpixels to expose the respective emission parts; a first spacer structure having an inversed tapered shape configured to surround at least one side of each of the emission parts of the first to third subpixels on the bank; a common layer structure located on the first electrodes and the first spacer structure and disconnected at an edge of the first spacer structure; and a second electrode on the common layer structure.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A semiconductor module socket includes an internal body including a slot therein, a lower end portion of a semiconductor module being inserted in the slot, and the semiconductor module including a printed circuit board with a semiconductor device thereon, an external body coupled to an outside of the internal body, and a plurality of socket pins on opposite surfaces of the slot, the plurality of socket pins facing each other, and top portions of the plurality of socket pins being arranged at different levels.

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.