Abstract: At least one embodiment provides a computing device including: a controller that receives first input data of a first data type and second input data of a second data type different from the first data type, and outputs a first signal representing the first data type, a second signal representing the second data type, and a clock signal based on the number of bits of the first input data and the second input data, and a computing circuit that performs a multiplication computation the first input data and the second input data based on the first signal, the second signal, and the clock signal and generates output data.

Abstract: Disclosed is an accelerator device which includes an interface circuit that communicates with an external device, a memory that stores first data received through the interface circuit, a polar encoder that performs polar encoding with respect to the first data provided from the memory and to output a result of the polar encoding as second data, and an accelerator core that loads the second data. The first data are compressed weight data, the second data are decompressed weight data, the accelerator core is configured to perform machine learning-based inference based on the second data, and the first data are variable in length.

Abstract: Disclosed is an accelerator performing an accumulation operation on a plurality of data, each being a floating point type. A method of operating the accelerator includes loading first data, finding a first exponent, which is a maximum value among exponents of the first data, generating aligned first fractions by performing a bit shift on first fractions of the first data based on the first exponent, and generating a first accumulated value by an accumulation operation on the aligned first fractions, loading second data, finding a second exponent, which is a maximum value among exponents of the second data, and generating a first aligned accumulated value by a bit shift on the first accumulated value, generating aligned second fractions by a bit shift on second fractions of the second data, and generating a second accumulated value by an accumulation operation on the aligned second fractions and the first aligned accumulated value.

Abstract: A memory controller includes a plurality of processors, a memory device and a memory manager. The memory device includes a plurality of segments, which are divided into a plurality of segment groups, to which group identifiers are respectively assigned. The memory manager is configured to map a first buffer identifier to a first group identifier from among the group identifiers, select one or more segments only from a first segment group, to which the first group identifier is assigned among the plurality of segment groups, map the first buffer identifier to the one or more segments, and allocate, to a first processor from among the plurality of processors, the first buffer identifier and the one or more segments.

Abstract: A banking processing method according is performed by a processing logic including an application for banking processing implemented on a user terminal and a computer-readable storage medium. The method comprises the steps of: when the application for banking processing is run, searching a hardware security area of the user terminal and confirming the existence of a certificate for confirming an execution history of the application for banking processing; when the existence of the certificate is confirmed, searching the security area and confirming the existence of a token key for identifying whether login information of the user has been set; when the existence of the token key is not confirmed, setting the login information of the user by providing a membership page for setting the login information of the user; and opening an account according to a request of the user whose login information has been set.

Abstract: Disclosed is a single process for producing hydrogen, carbon monoxide, and carbon from methane by forming gas products comprising hydrogen and carbon monoxide, and solid products comprising carbon and an iron-based catalyst from methane in a methane-containing feedstock through pyrolysis route involving auto-thermal reduction in a rotary kiln-type reactor in the presence of an iron-based catalyst and separating and recovering respective products.

Abstract: A low-loss spiral coil includes a conducting wire wound N turns of which a width of each of wires corresponding to each of sections of the conducting wire is determined by setting an entire width of the conducting wire to be a width of M sections of the conducting wire, and then determining the width of each of the wires such that a resistance of the spiral coil formed based on the width of the M sections is minimized.

Abstract: The present invention relates to an antibody against resistin and use thereof and, more specifically, to a resistin antibody or antigen-binding fragment thereof that inhibits the activity of resistin by blocking resistin/CAP1 binding, a nucleic acid encoding same, a vector comprising the nucleic acid, a cell transformed with the vector, a method for preparing the antibody or antigen-binding fragment thereof, an antibody-drug conjugate comprising the antibody or antigen-binding fragment thereof, a bi- or multi-specific antibody, a chimeric antigen receptor, an immune cell containing same, and a composition for the prevention or treatment of diseases that can be treated through the inhibition of resistin activity, the composition comprising same.

Abstract: A method for providing a credential service may include transmitting, to a user terminal, data of a request page including a cloud service selection field for selecting one cloud service from a list of a plurality of cloud services; receiving, from the user terminal, a request for issuing a temporary key for a credential for calling an API served by a second cloud service selected in the cloud service selection field; transmitting an account issuance request signal to a system of the second cloud service in response to the receiving the request for issuing the temporary key; receiving credential key information for a first account issued to an institution, from the system of the second cloud service in response to the transmitting the account issuance request signal; and transferring the credential key information to the user terminal in response to the request for issuing the temporary key.

Abstract: The present invention relates to a one-touch-removable container packaging film, and a container comprising same and, more specifically, to a one-touch-removable container packaging film, and a container comprising same, the packaging film: being naturally removable from the container when a container lid is rotatably separated from a container body in order to open contents sealed in the container, so as to be forcibly removed from the container according to the opening of the container contents without the need to consciously remove the packaging film in order to recycle the used container, and thus inconvenient actions such as removal of the packaging film during disposal of the container can be fundamentally eliminated; being forcibly removable according to the opening of the container contents so that the packaging film is necessarily removed from the container after the container is used even if the packaging film is not intended to be removed; and being easily removable with only a one-touch rotational

Abstract: Disclosed is a light emitting display device which may prevent or at least reduce lateral leakage current. The light emitting display device includes a substrate comprising a plurality of first to third subpixels arranged to neighbor one another, each of the first to third subpixels comprising an emission part and a non-emission part to surround the emission part; a bank at the non-emission parts; first electrodes covered with the bank and respectively at the first to third subpixels to expose the respective emission parts; a first spacer structure having an inversed tapered shape configured to surround at least one side of each of the emission parts of the first to third subpixels on the bank; a common layer structure located on the first electrodes and the first spacer structure and disconnected at an edge of the first spacer structure; and a second electrode on the common layer structure.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A semiconductor module socket includes an internal body including a slot therein, a lower end portion of a semiconductor module being inserted in the slot, and the semiconductor module including a printed circuit board with a semiconductor device thereon, an external body coupled to an outside of the internal body, and a plurality of socket pins on opposite surfaces of the slot, the plurality of socket pins facing each other, and top portions of the plurality of socket pins being arranged at different levels.

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.