Abstract: A light emitting element may include a light emitting stack pattern including a first semiconductor layer, an active layer, and a second semiconductor layer. An insulating film may surround an outer circumferential surface of the light emitting stack pattern. The insulating film may include a first layer, a second layer surrounding the first layer, and a third layer surrounding the second layer. The first layer and the third layer may include a same material.

Abstract: An embodiment mounting and demounting device for a wireless electronic device includes a pair of holder wings arranged symmetrically to each other and configured to press both sides of the wireless electronic device, a holder wing adjusting device configured to apply a force to adjust a gap between the holder wings using a driving force of a drive motor, a lifting implementing device configured to interlock with the holder wing adjusting device to lift the wireless electronic device upward in a case in which the holder wings are spread apart by a predetermined reference gap or more, a lower housing wrapped around a lower side of the holder wings, the holder wing adjusting device, and the lifting implementing device, and an upper housing coupled to an upper side of the lower housing and configured to allow the wireless electronic device to pass through in an up and down direction.

Abstract: An object of the present disclosure is to provide a composition for preventing or treating obesity comprising a substance isolated from poly-?-glutamic acid (?-PGA) as an active ingredient. According to the present disclosure, it was confirmed that ?-PGAbm or ?-PGAcm, a substance isolated from ?-PGA, suppressed the expression of adipogenic marker genes in 3T3-L1 cells to reduce accumulation of lipid droplets and triglycerides, and suppressed the expression of cell cycle regulators in the early stage of adipogenesis to reduce adipocyte differentiation. In addition, ?-PGAbm or ?-PGAcm has been confirmed to suppress obesity through weight loss, positive changes in glucose and insulin resistance, reduction of epididymal adipocytes, and suppression of adipogenesis, and thus may be used effectively for related businesses.

Abstract: The present invention relates to a one-touch-removable container packaging film, and a container comprising same and, more specifically, to a one-touch-removable container packaging film, and a container comprising same, the packaging film: being naturally removable from the container when a container lid is rotatably separated from a container body in order to open contents sealed in the container, so as to be forcibly removed from the container according to the opening of the container contents without the need to consciously remove the packaging film in order to recycle the used container, and thus inconvenient actions such as removal of the packaging film during disposal of the container can be fundamentally eliminated; being forcibly removable according to the opening of the container contents so that the packaging film is necessarily removed from the container after the container is used even if the packaging film is not intended to be removed; and being easily removable with only a one-touch rotational

Abstract: Disclosed is a light emitting display device which may prevent or at least reduce lateral leakage current. The light emitting display device includes a substrate comprising a plurality of first to third subpixels arranged to neighbor one another, each of the first to third subpixels comprising an emission part and a non-emission part to surround the emission part; a bank at the non-emission parts; first electrodes covered with the bank and respectively at the first to third subpixels to expose the respective emission parts; a first spacer structure having an inversed tapered shape configured to surround at least one side of each of the emission parts of the first to third subpixels on the bank; a common layer structure located on the first electrodes and the first spacer structure and disconnected at an edge of the first spacer structure; and a second electrode on the common layer structure.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.

Abstract: A semiconductor module socket includes an internal body including a slot therein, a lower end portion of a semiconductor module being inserted in the slot, and the semiconductor module including a printed circuit board with a semiconductor device thereon, an external body coupled to an outside of the internal body, and a plurality of socket pins on opposite surfaces of the slot, the plurality of socket pins facing each other, and top portions of the plurality of socket pins being arranged at different levels.

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.