Patents by Inventor Dong-Min NOH

Dong-Min NOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220208720
    Abstract: The present invention relates to a substrate bonding apparatus including: a chamber; a first chuck disposed inside the chamber to adhere a first substrate; a second chuck disposed facingly inside the chamber toward the first chuck to adhere a second substrate; and a camera located above or under the first chuck and the second chuck to recognize first alignment key disposed on the first substrate and second alignment key disposed on the second substrate.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 30, 2022
    Applicant: TES CO., LTD
    Inventors: Joo-Il HA, Yeong-Been KIM, Jae-Hwan KIM, Dong-Min NOH, Woo-Pil SHIM