Patents by Inventor Dong-pyo Kim

Dong-pyo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120218174
    Abstract: Provided are a backlight unit capable of improving light efficiency and acquiring a high-luminance image by implementing a color image without using a color filter having the large light loss and a liquid crystal display including the same. The backlight unit includes: a white light source generating white light, a light guide plate into which the white light is inputted, a blue phosphor sheet formed above the light guide plate and transmitting the white light, and a multi-color phosphor sheet formed on the same plane above the blue phosphor sheet and including a plurality of red phosphor layers, green phosphor layers, and transparent layers which transmit the light transmitted through the blue phosphor sheet.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 30, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Dong Pyo Kim, Kyu Ha Baek
  • Publication number: 20120161941
    Abstract: An RFID tag includes: an antenna receiving an RF signal from a reader; an AFE (analog front end) generating voltage using the RF signal; and one or more switches interposed between the antenna and the AFE and controlling the connection between the antenna and the AFE through the switch operation.
    Type: Application
    Filed: November 11, 2011
    Publication date: June 28, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ji Man PARK, Lee Mi DO, Kyu Ha BAEK, Kun Sik PARK, Dong Pyo KIM, Jong Chang WOO, Zin Sig KIM, Joo Yeon KIM, Ye Sul JEONG, Yong Hyun HAM
  • Publication number: 20120137907
    Abstract: Disclosed is an intaglio printing plate including: a pattern portion where a to-be-printed pattern is located; a non-pattern portion corresponding to a remaining area other than the pattern portion; and a supplementary pattern portion having a repetitive pattern with a predetermined form, wherein at least a part of the pattern portion is divided by a pattern structure that is formed by the supplementary pattern portion.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 7, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ye Sul JEONG, Kyu-Ha Baek, Lee-Mi Do, Ji Man Park, Kunsik Park, Dong-Pyo Kim, Zin Sig Kim, Joo Yeon Kim
  • Publication number: 20120140350
    Abstract: Disclosed are a printing plate and a mirror thereof, the printing plate including: printing portions for transferring an immersed solution, the printing portions being formed flat and arranged at regular intervals on one side of an upper part of the printing plate; and non-printing portions corresponding to a remaining area other than the printing portions, the non-printing portions being formed with at least two concavities and convexities respectively and arranged at regular intervals on the other side of the upper part of the printing plate.
    Type: Application
    Filed: November 21, 2011
    Publication date: June 7, 2012
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Joo Yeon Kim, Kyu-Ha Baek, Lee Mi Do, Ji Man Park, Kunsik Park, Zin Sig Kim, Dong-Pyo Kim, Ye Sul Jeong
  • Publication number: 20120086132
    Abstract: Provided is a method of manufacturing a via electrode by which productivity and production yield can be augmented or maximized. The method of the present invention includes: forming a via hole at a substrate; forming a catalyst layer at a sidewall and a bottom of the via hole; and forming a graphene layer in the via hole by exposing the catalyst layer to a solution mixed with graphene particles.
    Type: Application
    Filed: October 6, 2011
    Publication date: April 12, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Dong-Pyo Kim, Kyu-Ha Baek, Kunsik Park, Ji Man Park, Zin Sig Kim, Joo Yeon Kim, Ye Sul Jeong, Lee-Mi Do
  • Patent number: 8142953
    Abstract: Disclosed is an adjuvant capable of imparting a hydrophilic or superhydrophilic function to various materials or interfaces. The hydrophilic adjuvant comprises: a composite metal oxide containing Si and at least one metal element selected from the group consisting of Ti(IV), Zr(IV), Sn(IV) and Al(III); and a hydrophilic group-containing organic compound physically or chemically bonded with the Ti(IV), Zr(IV), Sn(IV) or Al of the composite metal oxide.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: March 27, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Dong Pyo Kim, Lan Young Hong, Jung Hye Won, Yong Su Park, Chong Kyu Shin
  • Patent number: 7998862
    Abstract: A method of fabricating a semiconductor device includes forming a via hole in a semiconductor substrate, forming an isolation layer on an inner side of the via hole, forming a diffusion barrier layer over an upper portion of the semiconductor substrate and the inner side of the via hole where the isolation layer is formed, arranging a solvent, which contains electrically charged metal particles, on the semiconductor substrate where the diffusion barrier layer is formed, and filling the via hole with the metal particles by moving the metal particles using applied external force. The applied external force said includes a voltage causing an electric current to flow between the semiconductor substrate and the solvent, an electrical field applied between the semiconductor substrate and the solvent, or a magnetic field applied between the semiconductor substrate and the solvent.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: August 16, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kunsik Park, Kyu-Ha Baek, Lee-Mi Do, Dong-Pyo Kim, Ji Man Park
  • Publication number: 20110147468
    Abstract: Provided is a radio frequency identification (RFID) tag whose data can be stably read at a long distance on the basis of a passive RFID tag. The RFID tag includes a rechargeable unit charged to a predetermined voltage, and a power source including a direct current (DC) power source including a rectifier for converting an RF signal into DC power and a regulator for supplying a predetermined DC voltage, an interceptor disposed between the rechargeable unit and the DC power source to connecting or disconnecting the power to the rechargeable unit, and an overvoltage preventor connected to an output terminal of the DC power source in parallel.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 23, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ji Man PARK, Lee Mi Do, Kyu Ha Baek, Kun Sik Park, Dong Pyo Kim
  • Publication number: 20110147787
    Abstract: An organic light emitting diode (OLED) and a method for manufacturing the same are provided. In the OLED, patterned metal electrodes are positioned on one or more of upper and lower portions of a light emission layer to allow light generated from the light emission layer to emit to an area between the patterned metal electrodes.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Lee Mi DO, Kun Sik Park, Ji Man Park, Dong Pyo Kim, Jin Yeong Kang, Kyu Ha Baek
  • Publication number: 20110136338
    Abstract: A method of fabricating a semiconductor device includes forming a via hole in a semiconductor substrate, forming an isolation layer on an inner side of the via hole, forming a diffusion barrier layer over an upper portion of the semiconductor substrate and the inner side of the via hole where the isolation layer is formed, arranging a solvent, which contains electrically charged metal particles, on the semiconductor substrate where the diffusion barrier layer is formed, and filling the via hole with the metal particles by moving the metal particles using applied external force. The applied external force said includes a voltage causing an electric current to flow between the semiconductor substrate and the solvent, an electrical field applied between the semiconductor substrate and the solvent, or a magnetic field applied between the semiconductor substrate and the solvent.
    Type: Application
    Filed: January 19, 2010
    Publication date: June 9, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kunsik Park, Kyu-Ha Baek, Lee-Mi Do, Dong-Pyo Kim, Ji Man Park
  • Publication number: 20110104322
    Abstract: Provided are a template used for nanoimprint lithography and a method for fabricating the same. A raised first deposition layer pattern including at least one downwardly sloped side surface is formed on a substrate. A second deposition layer pattern covering the side surface of the raised first deposition layer pattern and progressively decreasing in width downward along the side surface of the raised first deposition layer pattern is formed. A third deposition layer is formed on the entire surface of a structure on which the second deposition layer pattern. A second deposition layer nano pattern between the raised first deposition layer pattern and a planarized third deposition layer is formed by planarizing the third deposition layer to expose upper surfaces of the raised first deposition layer pattern and the second deposition layer pattern.
    Type: Application
    Filed: April 20, 2010
    Publication date: May 5, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kunsik PARK, Dong-Pyo Kim, Ji Man Park, Kyu-Ha Baek, Lee-Mi Do
  • Publication number: 20110097853
    Abstract: A via forming method is provided. The via forming method includes: forming via-holes in a substrate; putting the substrate having the via-holes in a first solution to fill the via-holes with the first solution; sinking the metal particles into the via-holes by supplying a second solution containing metal particles to the first solution, in which there is the substrate; and performing a first curing process of heat-treating the substrate having the via-holes filled with the metal particles so as to form vias in the via-holes. Further, a method of manufacturing a multi-chip package using the via forming method is provided.
    Type: Application
    Filed: July 13, 2010
    Publication date: April 28, 2011
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong Pyo KIM, Kyu Ha Baek, Kun Sik Park, Lee Mi Do
  • Publication number: 20110084603
    Abstract: An inorganic electroluminescent device includes: patterned metal electrodes periodically disposed at pre-set intervals; and a phosphor layer positioned on the patterned metal electrodes, wherein as a first voltage and a second voltage are alternately applied to the patterned metal electrodes according to the order of their disposition, light emitted from the phosphor layer is discharged to the spaces between the patterned metal electrodes.
    Type: Application
    Filed: October 7, 2010
    Publication date: April 14, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Lee Mi Do, Kun Silk Park, Dong Pyo Kim, Ji Man Park, Jin Yeong Kang, Kyu Ha Baek
  • Publication number: 20100167168
    Abstract: Disclosed is an adjuvant capable of imparting a hydrophilic or superhydrophilic function to various materials or interfaces. The hydrophilic adjuvant comprises: a composite metal oxide containing Si and at least one metal element selected from the group consisting of Ti(IV), Zr(IV), Sn(IV) and Al(III); and a hydrophilic group-containing organic compound physically or chemically bonded with the Ti(IV), Zr(IV), Sn(IV) or Al of the composite metal oxide.
    Type: Application
    Filed: December 15, 2006
    Publication date: July 1, 2010
    Inventors: Dong-Pyo Kim, Lan-Young Hong, Jung Hye Won, Yong Su Park, Chong Kyu Shin
  • Publication number: 20090176875
    Abstract: A method for manufacturing a stabilized metal nano particle solution is disclosed. This method manufactures a metal nano particle solution so as to make a metal substance such as silver, gold, copper, zinc or cobalt into ultra-capsular nano particles. That is to say, this new method is simple and suitable for mass production without requiring any separate reducer putting process at a room temperature while a transition metal nano particle solution is produced. In this method, an alcohol solution including a metal salt solution and a soluble polymer is mixed at a room temperature to make a nano metal particle solution with a particle size of 100 nm or less.
    Type: Application
    Filed: January 9, 2008
    Publication date: July 9, 2009
    Inventors: Dong-Pyo Kim, Yoon-Hyuck Choi, Choong G. Row
  • Publication number: 20060140843
    Abstract: A catalyst support comprises a monolithic non-oxide material having a surface area per unit volume of at least 105 m2/m3, and a pressure drop of at most 0.25 atm/mm.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 29, 2006
    Inventors: In-Kyung Sung, Dong-Pyo Kim, Paul Kenis
  • Patent number: 6037544
    Abstract: Disclosed is a splice closure for telecommunications cables. The splice closure includes a body having an upper portion and a lower portion, at least one entrance hole formed at opposing ends of the body, a plurality of flanges formed longitudinally along edges of both the upper and lower portions of the body where the same are joined, a compound reservoir formed between the flanges and into which a sealing compound is injected to form a seal, end stoppers having at least one cable hole and which are provided at ends of the splice closure, and plugs received in the cable holes of the end stoppers.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: March 14, 2000
    Assignees: LG Chemical Ltd, LG Cable and Machinery Ltd.
    Inventors: Jeoung-Yeoun Lee, Jeong-su Yu, Jang-youl Rhee, Dong-pyo Kim, Hui-jung Kim, Jae-ik Whang, Sang-Cheol Lee
  • Patent number: 5399377
    Abstract: Borazine oligomers in liquid form are produced and used to create composites of fibers bonded to boron nitride as a matrix and also to coat or increase the density of various fiber composites.
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: March 21, 1995
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: James Economy, Dong-pyo Kim