Patents by Inventor Dong-Sel Kim

Dong-Sel Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10611937
    Abstract: Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: April 7, 2020
    Assignees: Samsung Electronics Co., Ltd., GAEMA TECH
    Inventors: Minchul Lee, Namil Koo, Kyungrim Kim, Sun-Woo Park, Yongin Park, Min-Woo Lee, Wonhee Choe, Hun Rae Kim, Dong-Sel Kim, Zeeyoung Lee
  • Publication number: 20180273816
    Abstract: Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.
    Type: Application
    Filed: March 23, 2018
    Publication date: September 27, 2018
    Applicants: Samsung Electronics Co., Ltd., GAEMA TECH
    Inventors: Minchul LEE, Namil KOO, Kyungrim KIM, Sun-Woo PARK, Yongin PARK, Min-Woo LEE, Wonhee CHOE, Hun Rae KIM, Dong-Sel KIM, Zeeyoung LEE
  • Publication number: 20100289431
    Abstract: The present disclosure provides a dimming control method for a display having a light-emitting device which includes: a first light-emitting body including an active layer generating a first light by recombination of electrons and holes; and a second light-emitting body excited by the first light and emitting a second light having a longer wavelength than the first light, the dimming control method including: controlling the power which will be supplied to the light-emitting device according to a dimming request; and adjusting the brightness of the display according to the controlled power using the second light-emitting body containing a first fluorescent material having a characteristic that chromaticity coordinates are shifted in a first direction according to the power control and a second fluorescent material having a characteristic that chromaticity coordinates are shifted in a second direction opposite to the first direction according to the power control.
    Type: Application
    Filed: August 2, 2010
    Publication date: November 18, 2010
    Applicant: EPIVALLEY CO., LTD.
    Inventors: Dong Sel Kim, Chang Tae Kim
  • Publication number: 20080089072
    Abstract: A high power light emitting diode (“LED”) package is disclosed. The high power LED package includes a housing made of an insulating material and having a cavity in its central portion; a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing; a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing; an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead; a lens portion coupled to the housing to cover the cavity of the housing; and an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.
    Type: Application
    Filed: March 23, 2007
    Publication date: April 17, 2008
    Applicant: ALTI-electronics Co., Ltd.
    Inventors: Dong-Sel Kim, Dong Soo Kim
  • Patent number: D568831
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: May 13, 2008
    Assignee: Alti-Electronics Co., Ltd.
    Inventor: Dong-Sel Kim
  • Patent number: D572211
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: July 1, 2008
    Assignee: Alti-electronics Co., Ltd.
    Inventors: Dong Sel Kim, Chi Ok In, Jong Won Park
  • Patent number: D580378
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: November 11, 2008
    Assignee: Anti-electronics Co., Ltd.
    Inventors: Dong Sel Kim, Chi Ok In, Jong Won Park
  • Patent number: D585848
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: February 3, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Dong-Sel Kim, Chi-Ok In, Jae Hoon Sung
  • Patent number: D586302
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: February 10, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Dong-Sel Kim, Chi-Ok In, Jae Hoon-Sung
  • Patent number: D593965
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 9, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Gwui-Youn Park, Dong-Sel Kim
  • Patent number: D593966
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: June 9, 2009
    Assignee: Alti-electronics Co., Ltd
    Inventors: Dong-Sel Kim, Chi Ok In, Jong Won Park