Patents by Inventor Dong-Sen Chen
Dong-Sen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11667757Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.Type: GrantFiled: December 31, 2020Date of Patent: June 6, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Dong-Sen Chen, Yu-Ju Kuo, Yung-Lung Tseng, Chun-Wei Su
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Publication number: 20220204705Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Dong-Sen CHEN, Yu-Ju KUO, Yung-Lung TSENG, Chun-Wei SU
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Patent number: 10995237Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.Type: GrantFiled: December 27, 2018Date of Patent: May 4, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Dong-Sen Chen, Yu-Ju Kuo, Chyi-Ming Leu
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Publication number: 20190276704Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.Type: ApplicationFiled: December 27, 2018Publication date: September 12, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Dong-Sen CHEN, Yu-Ju KUO, Chyi-Ming LEU
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Publication number: 20190202996Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, 5-20 parts by weight of silica particles, 10-40 parts by weight of an alkoxysilane, and 60-80 parts by weight of a solvent.Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Dong-Sen CHEN, Yu-Ju KUO, Chyi-Ming LEU
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Publication number: 20190196098Abstract: An optical waveguide includes a lower clad layer, a core layer, and an upper clad layer, wherein the core layer is disposed between the lower clad layer and the upper clad layer. The lower clad layer has a composition including unetchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a composition including etchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The upper clad layer has a composition including an organic material and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a refractive index lager than that of the upper clad layer and the lower clad layer.Type: ApplicationFiled: December 28, 2017Publication date: June 27, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Jen YANG, Li-Ting HUANG, Dong-Sen CHEN, Chyi-Ming LEU
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Patent number: 10310179Abstract: An optical waveguide includes a lower clad layer, a core layer, and an upper clad layer, wherein the core layer is disposed between the lower clad layer and the upper clad layer. The lower clad layer has a composition including unetchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a composition including etchable closed-loop polyimide and plate-shaped clay in a range of 20 wt %-60 wt %. The upper clad layer has a composition including an organic material and plate-shaped clay in a range of 20 wt %-60 wt %. The core layer has a refractive index lager than that of the upper clad layer and the lower clad layer.Type: GrantFiled: December 28, 2017Date of Patent: June 4, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Jen Yang, Li-Ting Huang, Dong-Sen Chen, Chyi-Ming Leu
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Publication number: 20150027642Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.Type: ApplicationFiled: October 8, 2014Publication date: January 29, 2015Inventors: Dong-Sen CHEN, Hsiao-Fen WEI, Liang-You JIANG, Yu-Yang CHANG
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Patent number: 8883053Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.Type: GrantFiled: October 1, 2009Date of Patent: November 11, 2014Assignee: Industrial Technology Research InstituteInventors: Dong-Sen Chen, Hsiao-Fen Wei, Liang-You Jiang, Yu-Yang Chang
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Patent number: 8837133Abstract: A display module includes a front frame, a rear housing, and a trimming board. The front frame includes a first positioning hole and a clamping hole. The rear housing includes a second positioning hole. The front frame is engaged with the rear housing. The second positioning hole communicates with the first positioning hole. The trimming board includes a bolt structure and a clamping structure. The bolt structure is adapted to pass through the first positioning hole and the second positioning hole for preventing the front frame from separated from the rear housing. The clamping hole is used for the clamping structure to pass through and prevent the clamping structure from separating from the clamping hole.Type: GrantFiled: May 17, 2011Date of Patent: September 16, 2014Assignee: Inventec CorporationInventors: Dong-Sen Chen, Ming-Jheng Huang, Chun-Hsien Yu, Chun-Chi Lin
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Patent number: 8834655Abstract: A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.Type: GrantFiled: October 1, 2009Date of Patent: September 16, 2014Assignee: Industrial Technology Research InstituteInventors: Liang-You Jiang, Janglin Chen, Yu-Yang Chang, Dong-Sen Chen
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Patent number: 8514554Abstract: A display module includes a front frame, a resilient member, a rear housing, and a first fastening member. The front frame includes a circular groove, and a first disassembly hole. The first disassembly hole is located in the circular groove. A part of the resilient member is detachably engaged in the circular groove and covers the first disassembly hole. The rear housing includes a first assembly hole, a second disassembly hole, and a trimming board. The first disassembly hole communicates with the second disassembly hole. The trimming board is used for covering the first assembly hole and the second disassembly hole. The first fastening member is used for fastening the rear housing to the front frame through the first assembly hole.Type: GrantFiled: March 30, 2011Date of Patent: August 20, 2013Assignee: Inventec CorporationInventors: Dong-Sen Chen, Chun-Hsien Yu, Ming-Jheng Huang, Chun-Chi Lin
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Patent number: 8508936Abstract: A portable electronic device includes a main body, a door and a latch. The main body includes a positioning concave area on a bottom surface thereof. The positioning concave area has a cutout at a first edge, and an inclined surface and a guide edge at an opposite edge. The door is detachably connected with the bottom surface of the main body. The latch is slidably connected with a through hole of the door. The latch has an engaging portion and a guiding portion at two opposite ends. When the door is assembled to the bottom surface of the main body, the engaging portion inserts into the cutout. When the door is taken apart from the bottom surface, the engaging portion is removed from the cutout, and the guiding portion slides along the guide edge to move the door along a direction perpendicular to a long axis of the latch.Type: GrantFiled: April 21, 2011Date of Patent: August 13, 2013Assignee: Inventec CorporationInventors: Dong-Sen Chen, Jen-Hsiang Wang, Chun-Chi Lin
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Publication number: 20120170226Abstract: A portable electronic device includes a main body, a door and a latch. The main body includes a positioning concave area on a bottom surface thereof. The positioning concave area has a cutout at a first edge, and an inclined surface and a guide edge at an opposite edge. The door is detachably connected with the bottom surface of the main body. The latch is slidably connected with a through hole of the door. The latch has an engaging portion and a guiding portion at two opposite ends. When the door is assembled to the bottom surface of the main body, the engaging portion inserts into the cutout. When the door is taken apart from the bottom surface, the engaging portion is removed from the cutout, and the guiding portion slides along the guide edge to move the door along a direction perpendicular to a long axis of the latch.Type: ApplicationFiled: April 21, 2011Publication date: July 5, 2012Applicant: INVENTEC CORPORATIONInventors: Dong-Sen CHEN, Jen-Hsiang WANG, Chun-Chi LIN
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Publication number: 20120170178Abstract: A display module includes a front frame, a resilient member, a rear housing, and a first fastening member. The front frame includes a circular groove, and a first disassembly hole. The first disassembly hole is located in the circular groove. A part of the resilient member is detachably engaged in the circular groove and covers the first disassembly hole. The rear housing includes a first assembly hole, a second disassembly hole, and a trimming board. The first disassembly hole communicates with the second disassembly hole. The trimming board is used for covering the first assembly hole and the second disassembly hole. The first fastening member is used for fastening the rear housing to the front frame through the first assembly hole.Type: ApplicationFiled: March 30, 2011Publication date: July 5, 2012Applicant: INVENTEC CORPORATIONInventors: Dong-Sen CHEN, Chun-Hsien YU, Ming-Jheng HUANG, Chun-Chi LIN
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Publication number: 20120170180Abstract: A display module includes a front frame, a rear housing, and a trimming board. The front frame includes a first positioning hole and a clamping hole. The rear housing includes a second positioning hole. The front frame is engaged with the rear housing. The second positioning hole communicates with the first positioning hole. The trimming board includes a bolt structure and a clamping structure. The bolt structure is adapted to pass through the first positioning hole and the second positioning hole for preventing the front frame from separated from the rear housing. The clamping hole is used for the clamping structure to pass through and prevent the clamping structure from separating from the clamping hole.Type: ApplicationFiled: May 17, 2011Publication date: July 5, 2012Applicant: INVENTEC CORPORATIONInventors: Dong-Sen CHEN, Ming-Jheng HUANG, Chun-Hsien YU, Chun-Chi LIN
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Publication number: 20120120564Abstract: An electronic device includes a shell body, an input component, a backlight board, and a transparent cover. The shell body has a top surface and a bearing tank located on the top surface. The input component is disposed in the bearing tank, and the backlight board is superposed on the input component and is located in the bearing tank. The bearing tank exposes the backlight board. In addition, the transparent cover is superposed on the backlight board, so as to achieve the waterproof effect.Type: ApplicationFiled: January 26, 2011Publication date: May 17, 2012Applicant: INVENTEC CORPORATIONInventors: Chih Kuo Lu, Sheng Wen Hu, Dong Sen Chen
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Publication number: 20100264112Abstract: A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.Type: ApplicationFiled: October 1, 2009Publication date: October 21, 2010Inventors: Liang-You JIANG, Janglin Chen, Yu-Yang Chang, Dong-Sen Chen
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Publication number: 20100267203Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.Type: ApplicationFiled: October 1, 2009Publication date: October 21, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Dong-Sen CHEN, Hsiao-Fen WEI, Liang-You JIANG, Yu-Yang CHANG
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Patent number: 6371535Abstract: An easily releasable locking device includes upper and lower assemblies of latch and cavity members adapted to be disposed between a right lateral wall of a battery pack and a right inner side wall of a bottom wall of a portable battery-powered apparatus respectively, and aligned with each other and spaced apart in a transverse direction. The latch member and the cavity member of each assembly are disposed on the right inner side wall and the right lateral wall, respectively. The latch members are biased by two biasing members to be movable towards the corresponding cavity members. Two ejecting members are disposed between the right lateral wall and the right inner side wall, respectively.Type: GrantFiled: August 30, 1999Date of Patent: April 16, 2002Assignee: Mitac International CorporationInventors: Chih-Hsien Wei, Dong-Sen Chen