Patents by Inventor Dong Seob LEE
Dong Seob LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11966768Abstract: Disclosed herein are an apparatus and method for a multi-cloud service platform. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program may receive a service request from a user client device, generate a multi-cloud infrastructure service using multiple clouds in response to the service request, make the multiple clouds interoperate with mufti-cloud infrastructure in order to provide the multi-cloud infrastructure service, and generate a multi-cloud application runtime environment corresponding to the multi-cloud infrastructure service.Type: GrantFiled: February 3, 2021Date of Patent: April 23, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seok-Ho Son, Dong-Jae Kang, Byoung-Seob Kim, Seung-Jo Bae, Ji-Hoon Seo, Byeong-Thaek Oh, Kure-Chel Lee, Young-Woo Jung
-
Publication number: 20240079834Abstract: A removable fastening system includes a rail unit located in a vehicle, an electrode portion located at the inner side of the rail unit, a fixing unit having one end inserted to be fixed to the rail unit, and a mounting unit mounted at another end of the fixing unit, wherein the fixing unit is inserted into the rail unit and has a conductive portion rotated to be brought into contact with the electrode portion.Type: ApplicationFiled: May 19, 2023Publication date: March 7, 2024Inventors: Ji Seob PARK, Ji Ah Kim, Jin Ho Hwang, Jae Yong Lee, Dong Ju Lee
-
Patent number: 11908612Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.Type: GrantFiled: September 26, 2022Date of Patent: February 20, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Seob Lee, Jong Min Lee
-
Patent number: 11721474Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.Type: GrantFiled: October 3, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyuk Jung, Yu Jong Kim, Young Sun Kim, Dong Seob Lee
-
Patent number: 11574768Abstract: A coil component includes a body having one surface and the other surface facing each other; an insulating substrate embedded in the body, and having one surface substantially perpendicular to the one surface of the body; a coil portion disposed on the one surface of the insulating substrate, and including a coil pattern layer having a coil pattern and a lead-out pattern extending from the coil pattern and exposed from the one surface of the body; an insulating layer disposed on the one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes arranged to be spaced apart from each other on the one surface of the body and respectively connected to the lead-out pattern. A thickness of the lead-out pattern is greater than a thickness of the coil pattern, and less than a thickness of the insulating layer.Type: GrantFiled: October 31, 2019Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Seob Lee, Jong Min Lee
-
Publication number: 20230023322Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.Type: ApplicationFiled: September 26, 2022Publication date: January 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Seob LEE, Jong Min LEE
-
Patent number: 11488770Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.Type: GrantFiled: November 4, 2019Date of Patent: November 1, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Seob Lee, Jong Min Lee
-
Patent number: 10832857Abstract: A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.Type: GrantFiled: June 25, 2018Date of Patent: November 10, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Seob Lee, Sang Seob Kim, Young Sun Kim
-
Publication number: 20200194167Abstract: A coil component includes a body having one surface and the other surface facing each other; an insulating substrate embedded in the body, and having one surface substantially perpendicular to the one surface of the body; a coil portion disposed on the one surface of the insulating substrate, and including a coil pattern layer having a coil pattern and a lead-out pattern extending from the coil pattern and exposed from the one surface of the body; an insulating layer disposed on the one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes arranged to be spaced apart from each other on the one surface of the body and respectively connected to the lead-out pattern. A thickness of the lead-out pattern is greater than a thickness of the coil pattern, and less than a thickness of the insulating layer.Type: ApplicationFiled: October 31, 2019Publication date: June 18, 2020Inventors: Dong Seob Lee, Jong Min Lee
-
Publication number: 20200194165Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.Type: ApplicationFiled: November 4, 2019Publication date: June 18, 2020Inventors: Dong Seob LEE, Jong Min LEE
-
Publication number: 20200185143Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.Type: ApplicationFiled: October 3, 2019Publication date: June 11, 2020Inventors: Jung Hyuk JUNG, Yu Jong KIM, Young Sun KIM, Dong Seob LEE
-
Publication number: 20190180928Abstract: A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.Type: ApplicationFiled: June 25, 2018Publication date: June 13, 2019Inventors: Dong Seob LEE, Sang Seob KIM, Young Sun KIM