Patents by Inventor Dong Seok Jeon

Dong Seok Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7539412
    Abstract: The present invention relates to a camera module and a manufacturing method thereof, in which both front and rear directions can be provided by improving the disadvantage of the existing camera module providing only one direction photographing. According to an embodiment of the present invention, the camera module includes first and second image sensor chips whose rear surfaces are adhered by a nonconductive bonding agent so that image region parts face opposite directions, a substrate that is connected to the first image sensor chip using bumps for signal connection and connected to the second image sensor chip using wires for signal connection, a through-hole being formed in the substrate under a region in which the first image sensor chip is mounted, an infrared-shielding filter installed in the through-hole of the substrate, first and second holders disposed on upper and lower sides of the substrate, and first and second lens disposed in the first and second holders, respectively.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: May 26, 2009
    Assignee: Terrasem Co. Ltd.
    Inventors: Jong Hyun Lee, Dong Seok Jeon
  • Publication number: 20070269205
    Abstract: The present invention relates to a camera module and a manufacturing method thereof, in which both front and rear directions can be provided by improving the disadvantage of the existing camera module providing only one direction photographing. According to an embodiment of the present invention, the camera module includes first and second image sensor chips whose rear surfaces are adhered by a nonconductive bonding agent so that image region parts face opposite directions, a substrate that is connected to the first image sensor chip using bumps for signal connection and connected to the second image sensor chip using wires for signal connection, a through-hole being formed in the substrate under a region in which the first image sensor chip is mounted, an infrared-shielding filter installed in the through-hole of the substrate, first and second holders disposed on upper and lower sides of the substrate, and first and second lens disposed in the first and second holders, respectively.
    Type: Application
    Filed: May 17, 2006
    Publication date: November 22, 2007
    Inventors: Jong Hyun Lee, Dong Seok Jeon
  • Patent number: 6326867
    Abstract: The present invention provides a dielectric filter having a dielectric block, and a plurality of resonators formed within the dielectric block, each of the resonators having a first and second through holes formed vertically through the dielectric block and arranged in series along longitudinal axis of the dielectric block and a coupling portion electrically connecting an end of the first through hole to an end of the second through hole.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: December 4, 2001
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Chang Hwa Lee, Bon Hee Koo, O Gon Chun, Dong Seok Jeon, Sang Seok Lee