Patents by Inventor Dong-Seop Park

Dong-Seop Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120105413
    Abstract: A flat panel display apparatus includes a substrate, a display unit on the substrate, a sealing substrate facing the display unit, a sealing member between the substrate and the sealing substrate surrounding the display unit, a wiring unit between the substrate and the sealing substrate with an area overlapped with the sealing member, the wiring unit comprising a plurality of separate wiring members, and a leading unit comprising a main body unit, a connection unit, and an intermediate unit that are integrally formed and where the leading unit is configured to receive a voltage applied to the wiring unit from an external power source. The connection unit is connected to the wiring unit, the main body unit is connected to the external power source, the intermediate unit is arranged between the connection unit and the main body unit, and a width of the connection unit decreases away from the main body unit.
    Type: Application
    Filed: September 21, 2011
    Publication date: May 3, 2012
    Applicants: Ensil Tech Co., Ltd., Samsung Mobile Display Co., Ltd.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20120106044
    Abstract: In a flat panel display apparatus and a method of manufacturing the same, the flat panel display apparatus includes a substrate, a display unit disposed on the substrate, a sealing substrate disposed facing the display unit, a sealing member disposed between the substrate and the sealing substrate so as to surround the display unit, a wiring unit disposed between the substrate and the sealing substrate so as to partially overlap the sealing member, and at least three inlet portion groups to which voltage is applied via an external power source. The inlet portion groups are connected to the wiring unit. Each inlet portion group includes a plurality of sub-inlet portions.
    Type: Application
    Filed: September 20, 2011
    Publication date: May 3, 2012
    Applicants: ENSIL TECH CO., LTD., SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20120106098
    Abstract: In a flat panel display apparatus having improved sealing and a method of manufacturing the same, the flat panel display apparatus comprises: a substrate; a display unit disposed on the substrate; a sealing substrate facing the display unit; a sealing member interposed between the substrate and the sealing substrate and surrounding the display unit; and a plurality of wiring groups comprising areas overlapping the sealing member between the substrate and the sealing substrate; wherein the wiring groups are disposed so as to surround the display unit, are spaced apart from an area corresponding to an edge of the display unit, and receive voltage from an external power source.
    Type: Application
    Filed: September 19, 2011
    Publication date: May 3, 2012
    Applicants: ENSIL TECH CO., LTD., SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Oh-Seob Kwon, Dong-Seop Park, Sung-Soo Koh, Jung-Jun Im, Byung-Uk Han, Jae-Sang Ro, Won-Eui Hong, Seog-Young Lee
  • Publication number: 20120056523
    Abstract: A flat panel display apparatus includes a first substrate having a display region, a second substrate facing the first substrate and bonded to the first substrate, a groove portion in an edge of at least one of the first substrate and the second substrate, and a wiring portion and a bonding member arranged in the groove portion. The bonding member contacts the wiring portion. The wiring portion is configured to receive power and to supply heat to the bonding member. The bonding member is configured to bond the first substrate and the second substrate using the heat supplied from the wiring portion disposed in the groove portion.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Inventors: Byung-Uk Han, Oh-Seob Kwon, Sung-Soo Koh, Jung-Jun Im, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20120043017
    Abstract: In a Joule heat encapsulating apparatus and an encapsulating method using the same, a panel is mounted on a stage, the panel including a thermal-hardening type sealant for surrounding and sealing a display unit formed between a first substrate and a second substrate, a heat-generating wiring overlapping the thermal-hardening type sealant, and an electric current application wiring connected to the heat-generating wiring. A cap is employed to form a sealed space, in which the panel is arranged, between the stage and the cap. An exhaustion mechanism for exhausting air in the sealed space, and a power applying mechanism connected to the electric current application wiring for supplying a current to the heat-generating wiring, are provided. As a result, a stable encapsulating structure which prevents permeation of oxygen or moisture may be easily formed.
    Type: Application
    Filed: May 6, 2011
    Publication date: February 23, 2012
    Applicants: ENSIL TECH CO., LTD., SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Oh-Seob Kwon, Sung-Soo Koh, Dong-Seop Park, Jae-Sang Ro, Seog-Young Lee, Won-Eui Hong
  • Publication number: 20110115370
    Abstract: An organic electroluminescence apparatus comprises: a substrate having a pixel region and sealing regions; an organic electroluminescence device located in the pixel region of the substrate; and a sealing substrate having a pixel region and sealing regions corresponding to the pixel region and the sealing regions of the substrate. The sealing regions of the sealing substrate comprise conductive layers continuously connected to each other. In a method of manufacturing organic electroluminescence apparatus by sealing the substrate and the sealing substrate using a glass frit, manufacturing costs and process time can be greatly reduced.
    Type: Application
    Filed: November 18, 2010
    Publication date: May 19, 2011
    Applicants: SAMSUNG MOBILE DISPLAY CO., LTD., ENSILTECH CORPORATION
    Inventors: Oh-Seob Kwon, Dong-Seop Park, Jung-Jun Im, Jae-Sang Ro, Won-Eui Hong, Seog-Young Lee