Patents by Inventor Dong-Seuk Lee

Dong-Seuk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation of powder granules by liquid condensation process and manufacture of powder compacts thereof
    Patent number: 7169336
    Abstract: A method for preparing powder granules by a liquid condensation process comprising preparing a slurry by mixing powders, a binding agent and a binding agent soluble solvent, dropping the slurry to a binding agent insoluble solvent to fix the binding agent so that the binding agent can not be released to a surface of a droplet of the slurry, coagulating the droplet by solvent exchange between the soluble solvent inside the droplet and the insoluble solvent at the surface of the droplets, and separating the coagulated droplet from the insoluble solvent, drying it and completely removing a residual solvent.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: January 30, 2007
    Assignee: Korea Institute of Science and Technology
    Inventors: Hae-Weon Lee, Joo-Sun Kim, Jong-Ho Lee, Hue-Sup Song, Jang-Yong You, Dong-Seuk Lee, Jang-Won Heo, Hyun-Ick Shin
  • Preparation of powder granules by liquid condensation process and manufacture of powder compacts thereof
    Publication number: 20030168755
    Abstract: A method for preparing powder granules by a liquid condensation process comprising preparing a slurry by mixing powders, a binding agent and a binding agent soluble solvent, dropping the slurry to a binding agent insoluble solvent to fix the binding agent so that the binding agent can not be released to a surface of a droplet of the slurry, coagulating the droplet by solvent exchange between the soluble solvent inside the droplet and the insoluble solvent at the surface of the droplets, and separating the coagulated droplet from the insoluble solvent, drying it and completely removing a residual solvent.
    Type: Application
    Filed: March 10, 2003
    Publication date: September 11, 2003
    Inventors: Hae-Weon Lee, Joo-Sun Kim, Jong-Ho Lee, Hue-Sup Song, Jang-Yong You, Dong-Seuk Lee, Jang-Won Heo, Hyun-Ick Shin