Abstract: The present invention relates to a device for regenerating nerve cells and suppressing immune diseases, and more particularly, to a device for regenerating nerve cells and suppressing immune diseases, which uses a contact lens containing a conductive material to increase the effect of microcurrent on nerve cell regeneration and immune response suppression. The device for regenerating nerve cells and suppressing immune diseases comprises: a contact lens comprising a body configured to be worn on a cornea, and a conductive material inserted into the body and serving to induce a microcurrent generated outside the body; a plurality of channels configured to come into close contact with skins around eyes and to generate a flow of microcurrent on upper part of the contact lens; and a signal supply unit configured to supply electrical signals to the plurality of channels.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, and a fourth lens sequentially disposed from an object side toward an image side on an optical axis, and a reflecting member disposed closer to the object side, as compared to the first lens, and having a reflecting surface configured to change a path of light to be incident to the first to fourth lenses. The first to fourth lenses are disposed to be spaced apart from each other by a preset distance along the optical axis, and 1.3<TTL/BFL<3.5, where TTL is a distance from an object-side surface of the first lens to an imaging plane of an image sensor, and BFL is a distance from an image-side surface of the fourth lens to the imaging plane of the image sensor.

Abstract: An electrode insulating coating composition according to the present invention includes boehmite particles, a dispersant, a binder, and a solvent, wherein the dispersant includes two or more fatty acid compounds, and is included in an amount of 1.2 to 8.8 parts by weight with respect to 100 parts by weight of the boehmite particles.

Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. The organic electroluminescent compound of the present disclosure may be comprised in a light-emitting layer, and is effective for producing an organic electroluminescent device having high luminescent efficiency and/or excellent lifespan characteristic.

Abstract: An anchor foundation mechanism includes: a vertical cylindrical tubular body formed to be inserted into the ground and having a receiving space therein; a cover part fixed to the bottom of the body by bolts and configured to be easily inserted into the ground; a support integrally formed with the top of the body and having a plurality of through-holes and an installation fixing bolt flange so as to allow the support to be fixed to a facility post after being exposed on the ground; and an anchor assembly formed in the receiving space of the body and having anchor pins for driving the body deeply into the ground and then tightly fixing the body so as to support a load and prevent rotation, and prevent forced pulling out.

Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.

Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.

Abstract: A coil component includes a body and a coil portion disposed in the body and including first and second lead-out portions. Recesses are disposed along edges of one surface of the body, and expose the first and second lead-out portions to internal walls and lower surfaces of the recesses. First and second external electrodes are disposed in the recesses, and are connected to the first and second lead-out portions. A third external electrode is disposed in the recesses, and is connected to a connection electrode disposed on side surfaces of the body and on another surface of the body opposite to the one surface. An external insulating layer covers the connection electrode, and has an opening exposing at least a portion of the connection electrode. A shielding layers is disposed on the external insulating layer and in the opening and connects to the connection electrode.

Abstract: An anchor foundation mechanism includes: a vertical cylindrical tubular body formed to be inserted into the ground and having a receiving space therein; a cover part fixed to the bottom of the body by bolts and configured to be easily inserted into the ground; a support integrally formed with the top of the body and having a plurality of through-holes and an installation fixing bolt flange so as to allow the support to be fixed to a facility post after being exposed on the ground; and an anchor assembly formed in the receiving space of the body and having anchor pins for driving the body deeply into the ground and then tightly fixing the body so as to support a load and prevent rotation, and prevent forced pulling out.

Abstract: A capacitor includes a structure including a plurality of openings penetrating from a first surface of the structure to a second surface opposing the first surface; a capacitor layer disposed on the second surface of the structure and in the plurality of the openings and including a dielectric layer, and a first electrode and a second electrode, the dielectric layer interposed between the first electrode and the second electrode; a first connection layer disposed on the first surface of the structure and connected to the first electrode; a second connection layer disposed on the capacitor layer on the second surface and connected to the second electrode of the structure; and first and second terminals disposed on opposite side surfaces of the structure and connected to the first connection layer and the second connection layer, respectively.

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.

Abstract: A capacitor includes a support member included in a body, a plurality of pillars disposed in an upper portion of the support member and each having a lower portion wider than an upper portion, and a capacitor layer disposed on a side surface and an upper surface of each pillar and including a dielectric layer and first and second electrodes alternately disposed with the dielectric layer interposed therebetween. Lower end portions of adjacent pillars are in contact with each other.

Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.

Abstract: A coil component includes a body and a coil portion disposed in the body and including first and second lead-out portions. Recesses are disposed along edges of one surface of the body, and expose the first and second lead-out portions to internal walls and lower surfaces of the recesses. First and second external electrodes are disposed in the recesses, and are connected to the first and second lead-out portions. A third external electrode is disposed in the recesses, and is connected to a connection electrode disposed on side surfaces of the body and on another surface of the body opposite to the one surface. An external insulating layer covers the connection electrode, and has an opening exposing at least a portion of the connection electrode. A shielding layers is disposed on the external insulating layer and in the opening and connects to the connection electrode.

Abstract: A capacitor includes a body including a substrate and a capacitance layer disposed on the substrate. The substrate includes a plurality of first trenches penetrating from one surface of the substrate to an interior of the substrate, and a first capacitor layer disposed on the one surface of the substrate and in the first trenches. The first capacitor layer includes a first dielectric layer and first and second electrodes disposed on opposing sides thereof. The capacitance layer includes a plurality of second trenches penetrating from one surface of the capacitance layer to an interior of the capacitance layer, and a second capacitor layer disposed on the one surface of the capacitance layer and in the second trenches. The second capacitor layer includes a second dielectric layer and third and fourth electrodes disposed on opposing sides thereof. A method of manufacturing the capacitor is also provided.

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.

Abstract: A capacitor includes a plurality of cells each including a capacitance formation portion in which a plurality of trenches are positioned and a margin portion disposed around the capacitance formation portion. The cell includes three or more dielectric layers disposed in the capacitance formation portion and extending in the trenches, and three or more electrode layers sequentially stacked with dielectric layers interposed therebetween and extending in the trenches. At least first and second electrode layers have opposite polarities and each include a lead electrode extending from the capacitance formation portion to the margin portion. A lead electrode of the first electrode layer is disposed in a first region disposed to one side of a central portion of a cell, and a lead electrode of the second electrode layer is disposed in a second region disposed on another side of a central portion of the cell.

Abstract: A capacitor includes a structure including a plurality of openings penetrating from a first surface of the structure to a second surface opposing the first surface; a capacitor layer disposed on the second surface of the structure and in the plurality of the openings and including a dielectric layer, and a first electrode and a second electrode, the dielectric layer interposed between the first electrode and the second electrode; a first connection layer disposed on the first surface of the structure and connected to the first electrode; a second connection layer disposed on the capacitor layer on the second surface and connected to the second electrode of the structure; and first and second terminals disposed on opposite side surfaces of the structure and connected to the first connection layer and the second connection layer, respectively.

Abstract: A multilayer thin-film capacitor includes a first multilayer body and a second multilayer body spaced apart from each other in a vertical direction by a split layer. The second multilayer body is disposed on a lower surface of the first multilayer body, the first multilayer body constitutes a top capacitor, and the second body constitutes a bottom capacitor. First, second, and third external terminals may be disposed on an upper surface of the first multilayer body and be connected to internal electrode layers of the first and second multilayer bodies.