Patents by Inventor Dong Soo Ryu

Dong Soo Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20240347442
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: April 12, 2024
    Publication date: October 17, 2024
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SEPARATOR PLATE ASSEMBLY FOR FUEL CELL CAPABLE OF FORMING VARIABLE FLOW PATH PATTERN
    Publication number: 20240204216
    Abstract: The separator plate assembly is capable of forming a variable flow path. The separator plate assembly includes a base plate, a flow path forming block, and a gas flow path. By arranging the flow path forming block on the base plate to form the gas flow path, the precision and productivity of flow path shape processing can be improved, and various gas flow paths can be variably formed on the base plate.
    Type: Application
    Filed: November 25, 2021
    Publication date: June 20, 2024
    Inventors: YONG-GEUN JEON, BYOUNG-SUN CHOI, DONG-SOO RYU
  • Semiconductor package and fabricating method thereof
    Patent number: 11961797
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE
    Publication number: 20240069629
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Application
    Filed: August 28, 2023
    Publication date: February 29, 2024
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • System and method for laser assisted bonding of an electronic device
    Patent number: 11742216
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: August 29, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20220130752
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: September 8, 2021
    Publication date: April 28, 2022
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Semiconductor package and fabricating method thereof
    Patent number: 11121071
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: September 14, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE
    Publication number: 20210082717
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 18, 2021
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20200350241
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: March 9, 2020
    Publication date: November 5, 2020
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • System and method for laser assisted bonding of an electronic device
    Patent number: 10763129
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 1, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • Semiconductor package and fabricating method thereof
    Patent number: 10586761
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: March 10, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE
    Publication number: 20190287816
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 19, 2019
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • System and method for laser assisted bonding of semiconductor die
    Patent number: 10304698
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: May 28, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
    Publication number: 20180204740
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Application
    Filed: March 13, 2018
    Publication date: July 19, 2018
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20180096928
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • System and method for laser assisted bonding of semiconductor die
    Patent number: 9916989
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: March 13, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • Semiconductor package and fabricating method thereof
    Patent number: 9859203
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: January 2, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
    Publication number: 20170301560
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 19, 2017
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20160225692
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: April 23, 2015
    Publication date: August 4, 2016
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park