Patents by Inventor Dong-Soon LIM

Dong-Soon LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200075548
    Abstract: Systems, devices, and methods for interconnects for a multi-die package are described. A multi-die package may include a set of conductive pillars and two or more semiconductor dice that each include a bond pad. In some cases, the multi-die package may include a plurality of pillar-wire combinations, and a bond wire may couple a corresponding conductive pillar with a corresponding bond pad. Pillar-wire combinations may each collectively have a matched impedance, or pillar-wire combinations in different groups may have different collective impedances. In other cases, a conductive pillar may be directly coupled with a corresponding bond pad without a bond wire. Different pillar-wire combinations or directly-coupled pillars may carry different signals. In some cases, pillars may be individually impedance-matched to a desired impedance.
    Type: Application
    Filed: September 4, 2018
    Publication date: March 5, 2020
    Inventors: Kang-Yong Kim, Chan Yoo, Dong Soon Lim, Jaekyu Song
  • Patent number: 9009381
    Abstract: A Universal Serial Bus (USB) apparatus for USB communication is provided. The USB apparatus includes a Printed Circuit Board (PCB) including a circuit for communicating data with an external device according to a USB communication standard, a connector for connecting to a USB terminal of the external device, and a noise reduction circuit connected between an output terminal of the PCB and the connector for reducing noise of a data signal. The noise reduction circuit includes a common-mode filter for removing harmonic components generated between a ‘+’ data signal and a ‘?’ data signal and passing the ‘+’ data signal and the ‘?’ data signal, which operate in a differential mode.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: April 14, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Min Kim, Joong-Ho Jeong, Kyung-Ho Kim, Yong-Sup Kim, Dong-Soon Lim
  • Publication number: 20120030400
    Abstract: A Universal Serial Bus (USB) apparatus for USB communication is provided. The USB apparatus includes a Printed Circuit Board (PCB) including a circuit for communicating data with an external device according to a USB communication standard, a connector for connecting to a USB terminal of the external device, and a noise reduction circuit connected between an output terminal of the PCB and the connector for reducing noise of a data signal. The noise reduction circuit includes a common-mode filter for removing harmonic components generated between a ‘+’ data signal and a ‘?’ data signal and passing the ‘+’ data signal and the ‘?’ data signal, which operate in a differential mode.
    Type: Application
    Filed: July 26, 2011
    Publication date: February 2, 2012
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Jung-Min KIM, Joong-Ho JEONG, Kyung-Ho KIM, Yong-Sup KIM, Dong-Soon LIM