Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, at least one surface mount component operably coupled to conductive traces of at least one dielectric material, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate.

Abstract: Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure.

Abstract: Systems, devices, and methods for interconnects for a multi-die package are described. A multi-die package may include a set of conductive pillars and two or more semiconductor dice that each include a bond pad. In some cases, the multi-die package may include a plurality of pillar-wire combinations, and a bond wire may couple a corresponding conductive pillar with a corresponding bond pad. Pillar-wire combinations may each collectively have a matched impedance, or pillar-wire combinations in different groups may have different collective impedances. In other cases, a conductive pillar may be directly coupled with a corresponding bond pad without a bond wire. Different pillar-wire combinations or directly-coupled pillars may carry different signals. In some cases, pillars may be individually impedance-matched to a desired impedance.

Abstract: A Universal Serial Bus (USB) apparatus for USB communication is provided. The USB apparatus includes a Printed Circuit Board (PCB) including a circuit for communicating data with an external device according to a USB communication standard, a connector for connecting to a USB terminal of the external device, and a noise reduction circuit connected between an output terminal of the PCB and the connector for reducing noise of a data signal. The noise reduction circuit includes a common-mode filter for removing harmonic components generated between a ‘+’ data signal and a ‘?’ data signal and passing the ‘+’ data signal and the ‘?’ data signal, which operate in a differential mode.

Abstract: A Universal Serial Bus (USB) apparatus for USB communication is provided. The USB apparatus includes a Printed Circuit Board (PCB) including a circuit for communicating data with an external device according to a USB communication standard, a connector for connecting to a USB terminal of the external device, and a noise reduction circuit connected between an output terminal of the PCB and the connector for reducing noise of a data signal. The noise reduction circuit includes a common-mode filter for removing harmonic components generated between a ‘+’ data signal and a ‘?’ data signal and passing the ‘+’ data signal and the ‘?’ data signal, which operate in a differential mode.