Abstract: A multi-pattern matching algorithm may be provided that includes: a moving step of moving a moving window from the start of a string one byte by one byte; a DF1 checking step of converting the string on a current position of the moving window into an integer value, and of checking whether or not a bit of a related position in a first direct filter DF1 for patterns having lengths larger than 2 bytes is set to 1; a DF moving step of checking one or more direct filters DF when the bit is set to 1 according to the DF1 checking step; a re-moving step of moving the moving window by one byte again when the bit of a related position in the direct filter DF, which has been checked lastly, is 0; and a terminating step of checking whether the moving window is located at the end of the string or not, and of terminating the algorithm when the moving window is positioned at the end of the string.

Abstract: An apparatus for repairing a semiconductor module including: a heating block comprising a thermal contact surface for contacting a defective semiconductor package mounted on a substrate of the semiconductor module to heat the defective semiconductor package using a conduction method and to melt a solder of the defective semiconductor package, and a vacuum adsorption line for adsorbing the defective semiconductor package and separating the defective semiconductor package from the substrate; and a heater installed in the heating block.