Patents by Inventor DONG SUB OH

DONG SUB OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210151333
    Abstract: A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Applicant: SEMES CO., LTD.
    Inventors: JI-HWAN LEE, SEONG GIL LEE, DONG SUB OH, MYOUNGSUB NOH, DONG-HUN KIM, WAN JAE PARK
  • Publication number: 20210013049
    Abstract: An apparatus and method for processing a substrate using plasma, which has high plasma stability and process reproducibility, is provided. The method includes providing an apparatus for processing a substrate comprising a plasma generating region and a process region separate from the plasma generating region, placing the substrate including a silicon layer and an oxide layer in the process region, forming a hydrogen atmosphere in the process region by providing a hydrogen-based gas to the process region without passing through the plasma generating region, generating plasma by providing a fluorine-based gas to the plasma generating region, and providing the generated plasma to the process region to selectively remove the silicon layer compared to the oxide layer.
    Type: Application
    Filed: July 1, 2020
    Publication date: January 14, 2021
    Inventors: Seong Gil Lee, Sehoon Oh, Dong Sub Oh, Ji-Hwan Lee, Dong-Hun Kim, Wan Jae Park
  • Publication number: 20200122165
    Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 23, 2020
    Inventors: BYOUNGDOO CHOI, YANGYEOL RYU, DONG SUB OH, HYE BIN BAEK