Patents by Inventor Dong Tack MOON

Dong Tack MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180226366
    Abstract: A semiconductor package includes a device embedded portion including a first substrate having a first device embedded therein and a second substrate disposed on the first substrate, a device mounting portion comprising a second device disposed on the device embedded portion, and a sealing portion for sealing the second device, and a second module mounted on a surface of the device embedded portion that is opposite of a surface on which the device mounting portion is disposed.
    Type: Application
    Filed: September 26, 2017
    Publication date: August 9, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Jong KIM, Dong Tack MOON, Won Gi KIM