Patents by Inventor Dong Vo

Dong Vo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5708557
    Abstract: The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.
    Type: Grant
    Filed: August 22, 1996
    Date of Patent: January 13, 1998
    Assignee: Packard Hughes Interconnect Company
    Inventors: Haim Feigenbaum, Bao Le, Randy Lee Thomas, Dong Vo