Patents by Inventor Dong Weon Hwang

Dong Weon Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12248001
    Abstract: The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 11, 2025
    Assignees: HICON CO., LTD.
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20240280608
    Abstract: Provided are a contact pin, for a spring contact, the strength of which is guaranteed when a spring contact is manufactured in various lengths and which contributes to saving costs and time required to manufacture a test socket, and a spring contact including the same. The contact pin includes a body part of a certain width and thickness, a contact part provided on one end of the body part to be in contact with an object to be inspected, a shoulder part protruding in a width direction of the body part, a leg part extending in a longitudinal direction of the body part to face the contact part, and a guide part formed in the longitudinal direction of the body part to guide a vertical movement of another contact pin when coupled to the other contact pin.
    Type: Application
    Filed: August 31, 2023
    Publication date: August 22, 2024
    Applicant: HICON CO., LTD.
    Inventors: Dong Weon Hwang, Jae Baek Hwang, Logan Jae Hwang
  • Patent number: 12061212
    Abstract: The present disclosure relates to a socket having a thin structure and to a spring contact suitable thereto. The socket includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110), a lower contact pin (120) assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a coil spring (130) supporting the upper and lower contact pins (110 and 120); a lower film plate (310) including a plurality of first through-holes (311) through which the respective spring contacts (100) are positioned; an intermediate plate (320) provided on the lower film plate (310) and including second through-holes formed at positions corresponding to the first through-holes (311); and an upper film plate (330) provided on the intermediate plate (320) and including third through-holes formed at positions corresponding to the second through-holes.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: August 13, 2024
    Assignees: HICON CO., LTD.
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20240230715
    Abstract: Proposed is a socket device used for testing integrated circuits (ICs) and, more particularly, a test socket device with a thin structure especially suitable for ICs required to process high-speed signals. The socket device includes a socket body configured to accommodate a ground probe and a signal probe, each having an upper contact pin, a lower contact pin and a coil spring, and to have noise shielding properties, and an insulating thin film member having electrical insulation properties and attached to the lower part or upper/lower parts of the socket body to elastically support the probes, and thus the socket device has a thin structure suitable for ICs required to process high-speed signals, and is easy to manufacture.
    Type: Application
    Filed: January 2, 2024
    Publication date: July 11, 2024
    Applicants: HICON CO., LTD.
    Inventors: Dong Weon HWANG, Jae Baek HWANG, Jae Woo PARK, Hyung Suk PARK, Seung Woo Rhee
  • Publication number: 20240230716
    Abstract: Proposed is a socket device for testing integrated circuits (ICs). The socket device has an excellent noise shielding effect between signal probes and is easy to manufacture. The socket device with ground probes (10) and signal probes (20) includes an insulating socket body (110) having ground holes (110a) to accommodate the ground probes (10) and signal holes (110b) to accommodate the signal probes (20), a conductive ground plating layer (121) formed on the surface of each of the ground holes (110a), and a conductive shielding element (130) provided to penetrate the upper and lower surfaces of the socket body (110) to shield noise between adjacent signal probes (20).
    Type: Application
    Filed: January 2, 2024
    Publication date: July 11, 2024
    Applicants: HICON CO., LTD.
    Inventors: Dong Weon HWANG, Jae Baek HWANG, Jae Woo PARK, Hyung Suk PARK, Seung Woo Rhee
  • Publication number: 20240183879
    Abstract: Proposed is a socket device for testing integrated circuits (ICs) used to test ICs. The socket device includes a contact module (100) for seating an IC and having a plurality of contacts (110) for electrical connection of a lead of the IC and a terminal of a printed circuit board (PCB), and a pusher module (200) having a latch (211) to be fit-assembled from a top of the contact module (100) and for pressurizing the IC, wherein the pusher module (200) includes a lead frame (210) with the latch rotatably provided thereto, a pressurizing part (220) (230) assembled to the lead frame (210) with two floating hinge axes (C1) (C2) parallel to each other and elastically supported against the lead frame, first and second cam shafts (240) (250) provided in the respective floating hinge axes (C1) (C2), a handle (260), a lever (270), and a link (280).
    Type: Application
    Filed: November 10, 2023
    Publication date: June 6, 2024
    Applicants: HICON CO., LTD.
    Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
  • Patent number: 11982688
    Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: May 14, 2024
    Assignee: HICON CO., LTD.
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20240069607
    Abstract: Proposed is a memory module socket capable of increasing electrical contact reliability. The memory module socket includes a socket body (100) including a slot (111) in which terminals (13) of a memory module are inserted, a plurality of receiving portions (113) symmetrically defined by a plurality of partition walls (112), and a stopper member (114) provided under the slot (111), at least one pair of contacts (200) symmetrically provided in each pair of receiving portions (113); and an elastic body (300) inserted into the socket body (100). Each of the contacts (200) includes a curved portion (210), an outer extension portion (220), a first protrusion (222), an inner extension portion (230), an inclined extension portion (240) including a first contact protrusion (240a), and a vertical extension portion (250). Each of the receiving portions (113) includes restraining surfaces (118a and 118b).
    Type: Application
    Filed: August 10, 2023
    Publication date: February 29, 2024
    Applicants: HICON CO., LTD.
    Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
  • Patent number: 11668744
    Abstract: A contact for burning-in and testing a semiconductor IC and a socket device including the contact are proposed. The contact includes: an upper terminal part (111) having an upper tip part (111b) at an upper end part thereof; a lower terminal part (112) having a lower tip part (112c) at a lower end part thereof and provided on the same axis as the upper terminal part (111); and an elastic part (113) elastically supporting the upper terminal part (111) and the lower terminal part (112), wherein the upper terminal part (111) and the lower terminal part (112) include a shoulder part (111a) and a shoulder part (112a), respectively, formed by protruding therefrom in width directions thereof, and the elastic part (113) has a third width (w3), and includes a first strip (113a) and a second strip (113b).
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: June 6, 2023
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20230043825
    Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).
    Type: Application
    Filed: October 25, 2022
    Publication date: February 9, 2023
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Patent number: 11561241
    Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: January 24, 2023
    Assignee: HICON CO., LTD.
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Patent number: 11486897
    Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: November 1, 2022
    Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
  • Patent number: 11486896
    Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: November 1, 2022
    Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
  • Patent number: 11387584
    Abstract: A contact pin, a spring contact including the same, and a socket device are proposed, in which the contact pin has a minimum length suitable for testing a semiconductor IC for a high speed signal and allows the spring contact to secure a maximum compression distance. The contact pin (100) includes: a plate-shaped body part (110) having a width and a thickness; a head part (120) configured to be integrated with an upper end of the body part (110); and a leg part (130) formed by extending from a lower end of the body part (110) to be integrated therewith, wherein the head part (120) is a plate-shaped strip (122) provided on the upper end of the body part (110).
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: July 12, 2022
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20220209449
    Abstract: A contact pin, a spring contact including the same, and a socket device are proposed, in which the contact pin has a minimum length suitable for testing a semiconductor IC for a high speed signal and allows the spring contact to secure a maximum compression distance. The contact pin (100) includes: a plate-shaped body part (110) having a width and a thickness; a head part (120) configured to be integrated with an upper end of the body part (110); and a leg part (130) formed by extending from a lower end of the body part (110) to be integrated therewith, wherein the head part (120) is a plate-shaped strip (122) provided on the upper end of the body part (110).
    Type: Application
    Filed: March 3, 2021
    Publication date: June 30, 2022
    Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
  • Publication number: 20220206041
    Abstract: The present disclosure relates to a socket having a thin structure and to a spring contact suitable thereto. The socket includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110), a lower contact pin (120) assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a coil spring (130) supporting the upper and lower contact pins (110 and 120); a lower film plate (310) including a plurality of first through-holes (311) through which the respective spring contacts (100) are positioned; an intermediate plate (320) provided on the lower film plate (310) and including second through-holes formed at positions corresponding to the first through-holes (311); and an upper film plate (330) provided on the intermediate plate (320) and including third through-holes formed at positions corresponding to the second through-holes.
    Type: Application
    Filed: June 5, 2019
    Publication date: June 30, 2022
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20220196727
    Abstract: A contact for burning-in and testing a semiconductor IC and a socket device including the contact are proposed. The contact includes: an upper terminal part (111) having an upper tip part (111b) at an upper end part thereof; a lower terminal part (112) having a lower tip part (112c) at a lower end part thereof and provided on the same axis as the upper terminal part (111); and an elastic part (113) elastically supporting the upper terminal part (111) and the lower terminal part (112), wherein the upper terminal part (111) and the lower terminal part (112) include a shoulder part (111a) and a shoulder part (112a), respectively, formed by protruding therefrom in width directions thereof, and the elastic part (113) has a third width (w3), and includes a first strip (113a) and a second strip (113b).
    Type: Application
    Filed: December 14, 2021
    Publication date: June 23, 2022
    Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
  • Publication number: 20220163561
    Abstract: The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.
    Type: Application
    Filed: April 15, 2019
    Publication date: May 26, 2022
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Publication number: 20210148950
    Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
  • Publication number: 20210140997
    Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 13, 2021
    Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang