Patents by Inventor Dong Weon Hwang
Dong Weon Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240069607Abstract: Proposed is a memory module socket capable of increasing electrical contact reliability. The memory module socket includes a socket body (100) including a slot (111) in which terminals (13) of a memory module are inserted, a plurality of receiving portions (113) symmetrically defined by a plurality of partition walls (112), and a stopper member (114) provided under the slot (111), at least one pair of contacts (200) symmetrically provided in each pair of receiving portions (113); and an elastic body (300) inserted into the socket body (100). Each of the contacts (200) includes a curved portion (210), an outer extension portion (220), a first protrusion (222), an inner extension portion (230), an inclined extension portion (240) including a first contact protrusion (240a), and a vertical extension portion (250). Each of the receiving portions (113) includes restraining surfaces (118a and 118b).Type: ApplicationFiled: August 10, 2023Publication date: February 29, 2024Applicants: HICON CO., LTD.Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
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Patent number: 11668744Abstract: A contact for burning-in and testing a semiconductor IC and a socket device including the contact are proposed. The contact includes: an upper terminal part (111) having an upper tip part (111b) at an upper end part thereof; a lower terminal part (112) having a lower tip part (112c) at a lower end part thereof and provided on the same axis as the upper terminal part (111); and an elastic part (113) elastically supporting the upper terminal part (111) and the lower terminal part (112), wherein the upper terminal part (111) and the lower terminal part (112) include a shoulder part (111a) and a shoulder part (112a), respectively, formed by protruding therefrom in width directions thereof, and the elastic part (113) has a third width (w3), and includes a first strip (113a) and a second strip (113b).Type: GrantFiled: December 14, 2021Date of Patent: June 6, 2023Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Publication number: 20230043825Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).Type: ApplicationFiled: October 25, 2022Publication date: February 9, 2023Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Patent number: 11561241Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).Type: GrantFiled: May 4, 2020Date of Patent: January 24, 2023Assignee: HICON CO., LTD.Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Patent number: 11486896Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.Type: GrantFiled: January 25, 2021Date of Patent: November 1, 2022Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
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Patent number: 11486897Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.Type: GrantFiled: January 26, 2021Date of Patent: November 1, 2022Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
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Patent number: 11387584Abstract: A contact pin, a spring contact including the same, and a socket device are proposed, in which the contact pin has a minimum length suitable for testing a semiconductor IC for a high speed signal and allows the spring contact to secure a maximum compression distance. The contact pin (100) includes: a plate-shaped body part (110) having a width and a thickness; a head part (120) configured to be integrated with an upper end of the body part (110); and a leg part (130) formed by extending from a lower end of the body part (110) to be integrated therewith, wherein the head part (120) is a plate-shaped strip (122) provided on the upper end of the body part (110).Type: GrantFiled: March 3, 2021Date of Patent: July 12, 2022Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Publication number: 20220209449Abstract: A contact pin, a spring contact including the same, and a socket device are proposed, in which the contact pin has a minimum length suitable for testing a semiconductor IC for a high speed signal and allows the spring contact to secure a maximum compression distance. The contact pin (100) includes: a plate-shaped body part (110) having a width and a thickness; a head part (120) configured to be integrated with an upper end of the body part (110); and a leg part (130) formed by extending from a lower end of the body part (110) to be integrated therewith, wherein the head part (120) is a plate-shaped strip (122) provided on the upper end of the body part (110).Type: ApplicationFiled: March 3, 2021Publication date: June 30, 2022Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
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Publication number: 20220206041Abstract: The present disclosure relates to a socket having a thin structure and to a spring contact suitable thereto. The socket includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110), a lower contact pin (120) assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a coil spring (130) supporting the upper and lower contact pins (110 and 120); a lower film plate (310) including a plurality of first through-holes (311) through which the respective spring contacts (100) are positioned; an intermediate plate (320) provided on the lower film plate (310) and including second through-holes formed at positions corresponding to the first through-holes (311); and an upper film plate (330) provided on the intermediate plate (320) and including third through-holes formed at positions corresponding to the second through-holes.Type: ApplicationFiled: June 5, 2019Publication date: June 30, 2022Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Publication number: 20220196727Abstract: A contact for burning-in and testing a semiconductor IC and a socket device including the contact are proposed. The contact includes: an upper terminal part (111) having an upper tip part (111b) at an upper end part thereof; a lower terminal part (112) having a lower tip part (112c) at a lower end part thereof and provided on the same axis as the upper terminal part (111); and an elastic part (113) elastically supporting the upper terminal part (111) and the lower terminal part (112), wherein the upper terminal part (111) and the lower terminal part (112) include a shoulder part (111a) and a shoulder part (112a), respectively, formed by protruding therefrom in width directions thereof, and the elastic part (113) has a third width (w3), and includes a first strip (113a) and a second strip (113b).Type: ApplicationFiled: December 14, 2021Publication date: June 23, 2022Inventors: Dong Weon HWANG, Logan Jae HWANG, Jae Baek HWANG
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Publication number: 20220163561Abstract: The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.Type: ApplicationFiled: April 15, 2019Publication date: May 26, 2022Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Publication number: 20210148950Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.Type: ApplicationFiled: January 26, 2021Publication date: May 20, 2021Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
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Publication number: 20210140997Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.Type: ApplicationFiled: January 25, 2021Publication date: May 13, 2021Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
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Publication number: 20210102973Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).Type: ApplicationFiled: May 4, 2020Publication date: April 8, 2021Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Patent number: 10971843Abstract: Disclosed is a BGA socket device used for testing a BGA IC and having a dual pinch type contact. The BGA socket device includes: contacts each including a fixed terminal and a movable terminal and configured such that respective upper ends of the fixed and movable terminals are offset from each other with respect to each solder ball of the IC; a main body in which the contact is provided and fixed; a cover supported on an upper surface of the main body and configured to be movable up and down; and a slider provided between the main body and the cover and configured to slide left and right, thus opening and closing the movable terminal in a horizontal direction, the slider having a fixed terminal receiving hole and a movable terminal receiving hole in which the fixed and movable terminals of the contact are received, respectively, by passing therethrough.Type: GrantFiled: October 9, 2019Date of Patent: April 6, 2021Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Patent number: 10955438Abstract: Disclosed are a hybrid-type contact and a socket device for testing a semiconductor device, in which the hybrid-type contact includes a first contact unit integrally configured by rolling a predetermined shaped strip pattern formed by blanking a metal plate into a cylindrical shape, a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit, and a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together, so as to compensate the disadvantages of conventional pin-type and rubber-type test socket devices, whereby it is easy to optimize the mechanical and electrical properties according to the requirements of the test device, and it is suitable for testing a fine pitch device.Type: GrantFiled: November 2, 2018Date of Patent: March 23, 2021Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Patent number: 10935572Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.Type: GrantFiled: December 6, 2017Date of Patent: March 2, 2021Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
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Patent number: 10761110Abstract: Disclosed is related generally to a contact for testing a semiconductor device and a socket device therefor. The contact of the present invention, being a spring contact configured in an integrated body by blanking and bending a metal board, includes: an elastic part composed of various strips in a fixed pattern, and sharp end parts provided on opposite ends of the elastic part, respectively. Preferably, with a filler having conductivity and elasticity being filled in space volume, the contact of the present invention has excellent durability and electrical characteristics. In addition, the test socket according to the present invention, being the rubber type adopting the above-stated contacts, provides an appropriate effect for a test of a semiconductor device having a fine pitch.Type: GrantFiled: August 23, 2018Date of Patent: September 1, 2020Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
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Publication number: 20200176910Abstract: Disclosed is a BGA socket device used for testing a BGA IC and having a dual pinch type contact. The BGA socket device includes: contacts each including a fixed terminal and a movable terminal and configured such that respective upper ends of the fixed and movable terminals are offset from each other with respect to each solder ball of the IC; a main body in which the contact is provided and fixed; a cover supported on an upper surface of the main body and configured to be movable up and down; and a slider provided between the main body and the cover and configured to slide left and right, thus opening and closing the movable terminal in a horizontal direction, the slider having a fixed terminal receiving hole and a movable terminal receiving hole in which the fixed and movable terminals of the contact are received, respectively, by passing therethrough.Type: ApplicationFiled: October 9, 2019Publication date: June 4, 2020Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Publication number: 20200049736Abstract: Disclosed are a hybrid-type contact and a socket device for testing a semiconductor device, in which the hybrid-type contact includes a first contact unit integrally configured by rolling a predetermined shaped strip pattern formed by blanking a metal plate into a cylindrical shape, a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit, and a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together, so as to compensate the disadvantages of conventional pin-type and rubber-type test socket devices, whereby it is easy to optimize the mechanical and electrical properties according to the requirements of the test device, and it is suitable for testing a fine pitch device.Type: ApplicationFiled: November 2, 2018Publication date: February 13, 2020Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang